INSERTION LOSS SENSOR FOR TESTING IMMERSION COOLING LIQUIDS

SUBSTRATE CONNECTION STRUCTURE, ANTENNA SUBSTRATE, AND DISPLAY DEVICE

CONTROLLING IMPEDANCE AND PHASE SHIFT OF A TRANSMISSION LINE

SURFACE-TREATED COPPER FOIL HAVING PILLAR NODULE STRUCTURE, AND COPPER CLAD LAMINATE AND PRINTED WIRING BOARD COMPRISING SAME

Printed Circuit board Having Pad and Communication Device

BRIDGE COUPLING TO SURFACE EMITTERS

COPPER FOIL HAVING PATTERNED ROUGHNESS NODULES

MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE

VERSATILE HIGH FREQUENCY MONOLITHIC MULTI-LAYERED CIRCUIT BOARD WITH EMBEDDED COAXIAL VIAS USEFUL FOR TESTING OF HIGH FREQUENCY INTEGRATED CIRCUIT DEVICES

LOW-TRANSMISSION-LOSS COPPER-BASED COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, PCB, AND ELECTRONIC COMPONENT

LOW-LOSS FLAT-CABLE SIGNAL LINE FOR ULTRA-HIGH FREQUENCY, FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD CONTINUOUS-MANUFACTURING DEVICE

MULTILAYER SUBSTRATE AND WIRING SUBSTRATE

CIRCUIT BOARD

PRINTED CIRCUIT BOARD TRACE WITH FORMATIONS

Printed-Circuit-Board Structure and Method for Manufacturing

TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AND RELATED METHODS AND APPARATUSES

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING LAYER WITH ROUGHNESS AND ELECTRONIC DEVICE INCLUDING SAME

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE MULTILAYER WIRING SUBSTRATE

THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES

WIRING BOARD

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD FOR PRODUCING THE SAME

ELECTRONIC DEVICE

RF COVER LAYER

TRANSMISSION MEDIA FOR DIGITAL SIGNALS AND ELECTRONIC DEVICE

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

PHASE SHIFTER

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIRING SUBSTRATE

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURING WITH REDUCED INTERFERENCE AND NOISE

PACKAGE COMPONENT

Transmission device for suppressing glass fiber effect

ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PRINTED CIRCUIT BOARDS

RF CONNECTOR AND COMMUNICATION APPARATUS INCLUDING SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD

CIRCUIT BOARD FOR ANTENNA, ANTENNA PACKAGE INCLUDING THE SAME AND IMAGE DISPLAY DEVICE INCLUDING THE SAME

WIRING BOARD

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

Package component and forming method thereof

APPARATUS AND SYSTEM OF A PRINTED CIRCUIT BOARD (PCB) INCLUDING A RADIO FREQUENCY (RF) TRANSITION

Bend compensation for conductive traces on printed circuit boards

Method of manufacturing wiring substrate

Circuit signal enhancement method of circuit board and structure thereof

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD

FLEXIBLE PCB RF CABLE

Circuit board and method of manufacturing thereof

Circuit board

Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface

Wiring substrate and method of manufacturing the same

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

Printed conductor and rectifier package for power transfer

SURFACE MOUNT RADIO FREQUENCY CROSSOVER DEVICE

Multilayer substrate module with filter function

Board having conductive layer for shielding electronic component and electronic device including the same

SIGNAL TRANSMISSION LINE

Method and procedure for miniaturing a multi-layer PCB

High-frequency circuit

Printed wiring board

Printed circuit board for transmitting signal in high-frequency band and electronic device including same

Interconnect structure for insertion loss reduction in signal transmission and method thereof

TRANSMISSION LINE COMPONENT AND ELECTRONIC DEVICE

Circuit board

Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

Printed wiring board

CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD

Non-galvanic interconnect for planar RF devices

Transmission line and electronic device

Transmission line substrate and electronic device

Printed wiring board, memory system, and method for manufacturing printed wiring board

Printed circuit board

Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof

TRANSMITTING DATA SIGNALS ON SEPARATE LAYERS OF A MEMORY MODULE, AND RELATED METHODS AND APPARATUSES

Method and procedure for miniaturing a multi-layer PCB

Structure for mounting a transmission line substrate having interlayer connection conductors to another substrate by a conductive bonding material

Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board

Signal transmission circuit and printed circuit board

Electrodeposited copper foil and electrode, and lithium-ion secondary battery comprising the same

Electrodeposited copper foil, current collector, electrode, and lithium ion secondary battery comprising the same

Bend compensation for conductive traces on printed circuit boards

Surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same

Surface mount radio frequency crossover device

Tapered broadband balun

Electronic apparatus and electrical element

Glass wiring board

Antenna device and circuit board having the same

Conductive pattern

EMI shielding for a signal trace

Method of manufacturing radio frequency interconnections

Transmission line and mounting structure thereof

Circuit board and manufacturing method of circuit board

Wiring substrate

Transmitting data signals on separate layers of a memory module, and related methods, systems and apparatuses

Method for manufacturing personalized chipless radiofrequency identification (“RFID”) devices

Wiring substrate and method for manufacturing wiring substrate

Circuit board

Electric circuit, electronic module for a chip card formed on the electric circuit, and method for the production of such an electric circuit

Trace length on printed circuit board (PCB) based on input/output (I/O) operating speed

Method for producing high frequency circuit board, and high frequency circuit board

Surface treated copper foil

Electrolytic copper foil with low profile

Printed circuit board and manufacturing method therefor

Flexible resonant trap circuit

Electronic apparatus and electrical element

HIGH DENSITY FLEXIBLE INTERCONNECT DESIGN FOR MULTI-MODE SIGNALING

Electronic apparatus

Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition

Method of producing printed circuit boards with routing conductors and dielectric strands

Printed circuit board and display apparatus

Printed circuit board with substrate-integrated waveguide transition

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Circuit board for transmitting high speed signal and for said signal to be detected

Electronic apparatus and electrical element

Component carrier with adhesion promoting shape of wiring structure

Additive manufacturing technology (AMT) low profile signal divider

SNAP-RF interconnections

Insertion loss reduction and increased bonding in a circuit apparatus

Microwave attenuators on high-thermal conductivity substrates for quantum applications

Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers

Flexible circuit board having enhanced bending durability and method for preparing same

Flexible circuit board having enhanced bending durability and method for preparing same

Reduction of insertion loss in printed circuit board signal traces

High-frequency and high-transmission speed FPC with FRCC and preparation method thereof

Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making

Printed circuit board with substrate-integrated waveguide transition

Mounting component and electronic device

Electronic apparatus

Printed circuit board for a radar level measurement device with waveguide coupling

Wiring board and method for manufacturing same

Release material

Printed circuit board including electroconductive pattern and electronic device including printed circuit board

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

Rectification module

Printed circuit via for KA satcom circuit boards

Antenna apparatus and circuit board thereof

Wiring board and method for manufacturing the same

Electronic device

PRINTED CIRCUIT BOARD FOR HIGH-SPEED TRANSMISSION

High-speed interconnects for printed circuit boards

Filter

Metal-clad laminate and metal foil with resin

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL WITH CARRIER, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Circuit board

Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

Flexible circuit board having enhanced bending durability and method for preparing same

Flexible circuit board having enhanced bending durability

Absorber assemblies having a dielectric spacer, and corresponding methods of assembly

Stranded transmission line and uses thereof

PROCESS TECHNOLOGY FOR EMBEDDED HORN STRUCTURES WITH PRINTED CIRCUIT BOARDS

Differential signal transmitting circuit board

Multilayer substrate and electronic device

Wiring board and manufacturing method for same

Electronic apparatus

Structure for connecting board and connector, board, and method for connecting board and connector

Component carrier with adhesion promoting shape of wiring structure

Wired circuit board

Insertion loss reduction and increased bonding in a circuit apparatus

Bond channel reliefs for bonded assemblies and related techniques

Signal transmitting apparatus and image forming apparatus

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Conductive pattern

Resin substrate and electronic device

Resilient miniature integrated electrical connector

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE

Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards

Method of manufacturing a signal transition component having a C-shaped conducting frame

Printed circuit board, optical module, and transmission equipment

High-frequency transmission line and electronic device

Multilayer substrate

High-frequency signal line

Switching circuit including wire traces to reduce the magnitude of voltage and current oscillations

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Electronic apparatus, electrical element, and electrical element tray

High-frequency transmission line

High-frequency signal line and manufacturing method thereof

Insertion loss reduction and increased bonding in a circuit apparatus

Circuit, display substrate and display device

Electronic apparatus

FLEXIBLE WIRING BOARD

Input/output coupling structure of dielectric waveguide

Trace border routing

Printed wiring board

Transmission line member and electronic apparatus

Printed wiring board

Printed circuit board having reduced loss of electric signal and method of manufacturing the same

High-frequency signal transmission line and electronic apparatus

Circuit board

Vertical trench routing in a substrate

High-speed interconnects for printed circuit boards

Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces

Multi-layer printed circuit boards having properties suitable for layer reduction design

Electrical channel including pattern voids

Multi-layer substrates including thin film signal lines

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

TRANSMISSION OF SIGNALS ON MULTI-LAYER SUBSTRATES WITH MINIMUM INTERFERENCE

Coupling of signals on multi-layer substrates

Wiring board

Assembly comprising a hyperfrequency component and a printed circuit

Flat cable

Multi-layer substrate and method of manufacturing multi-layer substrate

Transmission line, a transmission line apparatus, and an electronic device

Transmission lines

Communication module

THIN PROFILE METAL TRACE TO SUPPRESS SKIN EFFECT AND EXTEND PACKAGE INTERCONNECT BANDWIDTH

High-frequency signal transmission line

Apparatus and methods for electrical energy harvesting and/or wireless communication

Board assembly for transmitting high-speed signal and method of manufacturing the same

High frequency module

High-frequency signal transmission line and electronic device

Trace structure for improved electrical signaling

Circuit board

Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias

Multilayer wiring board with enclosed Ur-variant dual conductive layer

Attenuation reduction structure for high frequency signal contact pads of circuit board

High-frequency signal line

EBG structure, semiconductor device, and circuit board

Surface-treated copper foil

Printed circuit board including linking extended contact pad

High-frequency signal line and manufacturing method thereof

High-frequency signal line and method for producing base layer with signal line

Laminated flat cable and method for producing same

Flexible circuit board with planarized cover layer structure

Printed circuit board having improved characteristic impedance

Flat cable

Printed circuit board and printed wiring board

High-frequency signal transmission line and electronic apparatus

High-frequency signal transmission line and electronic apparatus

Through-hole-vias in multi-layer printed circuit boards

Radiofrequency absorptive filter

High-frequency signal transmission line

Folded planar Litz wire and method of making same

High-speed pluggable rigid-end flex circuit

High-frequency signal transmission line

Printed circuit board

MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING

Multilayer electronic structure with novel transmission lines

Printed wiring board, semiconductor package, and printed circuit board

Conductor structure with integrated via element

Package with printed filters

HIGH FREQUENCY CIRCUIT COMPRISING GRAPHENE AND METHOD OF OPERATING THE SAME

Printed wiring board and method of manufacture thereof

Laminated and sintered ceramic circuit board, and semiconductor package including the circuit board

Connection substrate

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

High-frequency signal transmission line

Soldering pad

HEAT-RESISTANT COPPER FOIL AND METHOD OF PRODUCING THE SAME, CIRCUIT BOARD, AND COPPER-CLAD LAMINATE AND METHOD OF PRODUCING THE SAME

Wiring substrate and method of manufacturing the same

Through-hole-vias in multi-layer printed circuit boards

Through-hole-vias in multi-layer printed circuit boards

REDUCED CIRCUIT TRACE ROUGHNESS FOR IMPROVED SIGNAL PERFORMANCE

Substrate for semiconductor package and method of manufacturing thereof

Trace border routing

Self referencing pin

Compensating Conductive Circuit

CIRCUIT ELEMENT

Method for fabricating a printed circuit board having differential trace profile

Through hole-vias in multi-layer printed circuit boards

Compensating Conductive Circuit

Printed wiring board and electronic-component package

HEAD SUSPENSION UNIT, HEAD SUSPENSION ASSEMBLY, AND STORAGE DEVICE

Printed wiring board and manufacturing method thereof

Carrier for high frequency signals having conducting wires with roughness portions and a carrier layout method

Multilayer ceramic substrate

Transmitting radio frequency signal in semiconductor structure

Differential trace profile for printed circuit boards

SELECTIVE SURFACE ROUGHNESS FOR HIGH SPEED SIGNALING

Circuit Board And Manufacturing Method Thereof

Printed wiring board and manufacturing method thereof

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed circuit board including pads with vacancies

Circuit board with trace configuration for high-speed digital differential signaling

Wiring board and circuit apparatus

Routing configuration for high frequency signals in an integrated circuit package

Circuit board and method of manufacturing the same

Electronic circuit board having microstrip lines

Dual composition ceramic substrate for microelectronic applications

Method for manufacturing multi-layer printed circuit board

High-frequency wiring structure and method for producing the same

Method for altering the delay properties of a transmission line using compensation tabs

Printed wiring board for controlling signal transmission using paired inductance and capacitance

Circuit board with trace configuration for high-speed digital differential signaling

Dual composition ceramic substrate for microelectronic applications

Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same

Trace modulations in connectors for integrated-circuit packages

Integrated high pass filter for microwave system in package

Printed circuit board with routing of a conductor and dielectric strands

Flexible cable and electronic device with the same

Printed circuit board having improved high speed transmission lines

Geometrically inverted ultra wide band microstrip balun