233663 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; High frequency adaptations; Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
#2WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE INCLUDING WIRING BOARD, AND ELECTRONIC MODULE
#3MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
#4CIRCUIT BOARD
#5Optical Module
#6Core Resonance Suppression in Signal Integrity Optimized Package
#7CIRCUIT BOARD AND ELECTRONIC DEVICE
#8DUAL IN-LINE MEMORY MODULE (DIMM) SOLUTION THAT INCLUDES FLEXIBLE TRANSMISSION LINES
#9Mating backplane for high speed, high density electrical connector
#10FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME
#11FLEXIBLE PCB RF CABLE
#12CIRCUIT BOARD, ANTENNA PACKAGE AND DISPLAY DEVICE
#13Setting the impedance of signal traces of a circuit board using a reference trace
#14Mating backplane for high speed, high density electrical connector
#15FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
#16Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#17Reference metal layer for setting the impedance of metal contacts of a connector
#18Setting the impedance of signal traces of a circuit board using a reference trace
#19EMBEDDED MICROSTRIP WITH OPEN SLOT FOR HIGH SPEED SIGNAL TRACES
#20Circuit board and optical module
#21Setting the impedance of signal traces of a circuit board using a reference trace
#22Reference metal layer for setting the impedance of metal contacts of a connector
#23Mating backplane for high speed, high density electrical connector
#24Method of manufacturing radio frequency interconnections
#25Transmission line and mounting structure thereof
#26Radio frequency filter and radio frequency module
#27Printed board
#28Mating backplane for high speed, high density electrical connector
#29Radio frequency filter and radio frequency module
#30Differential transmission line formed on a wiring substrate and having a metal conductor ground layer, where a metal conductor removal block is formed in the ground layer at a location of curved sections of the differential transmission line
#31Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket
#32Terminal device
#33SNAP-RF interconnections
#34Communication channel with tuning structure
#35Mutual inductance suppressor for crosstalk immunity enhancement
#36Printed circuit board, memory module and memory system including the same
#37Circuit board and conductive pattern structure
#38Communication module packaging
#39Skew-resistant multi-wire channel
#40Printed circuit board and electronic component
#41Optical module and optical transmission equipment
#42Device, system and method to promote the integrity of signal communications
#43Electrical interconnect for a flexible electronic package
#44Mating backplane for high speed, high density electrical connector
#45High-frequency signal transmission line and electronic device
#46Semiconductor device and method for manufacturing the same
#47Communication apparatus
#48Structure for connecting board and connector, board, and method for connecting board and connector
#49Signal transmission component and electronic device
#50Signal transmitting apparatus and image forming apparatus
#51Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
#52Resource allocation for traffic-profile-dependent scheduling request
#53Skew-resistant multi-wire channel
#54High-frequency signal line, method for producing same, and electronic device
#55MULTILAYER CIRCUIT BOARD
#56Circuit board and conductive pattern structure
#57High-frequency signal line and manufacturing method thereof
#58High-frequency signal transmission line and electronic device
#59RF circuit with multiple-definition RF substrate and conductive material void under a bias line
#60Flexible printed circuit board and liquid crystal display
#61High-frequency signal transmission line and electronic apparatus
#62Assembly of circuit boards and electronic device comprising said assembly
#63Semiconductor device
#64Avoiding reflections in PCB signal trace
#65High-frequency signal transmission line and electronic device
#66Circuit board, electronic component housing package, and electronic device
#67Voltage detection unit
#68GROUNDING PATTERN STRUCTURE FOR HIGH-FREQUENCY CONNECTION PAD OF CIRCUIT BOARD
#69Electromagnetic noise filter device and equivalent filter circuit thereof
#70Signal transmission component and electronic device
#71Printed circuit board and printed circuit board for camera module
#72Printed wiring board, electronic device, and wiring connection method
#73Printed circuit board and printed circuit board for camera module
#74Flat cable
#75Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees
#76High-frequency transmission line
#77High-frequency signal transmission line
#78Electrical connection interface for connecting electrical leads for high speed data transmission
#79Printed circuit board
#80Multilayer circuit substrate
#81Footprint for Prototyping High Frequency Printed Circuit Boards
#82High-frequency signal transmission line, electronic device and manufacturing method of high-frequency signal transmission line
#83Composite module
#84Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
#85Windowed reference planes for embedded conductors
#86High-frequency signal line and manufacturing method thereof
#87High-frequency signal line and electronic device including the same
#88High-frequency signal line and method for producing base layer with signal line
#89Laminated flat cable and method for producing same
#90Circuit with flat electromagnetic band gap resonance structure
#91CIRCUIT BOARD ASSEMBLY WITH PADS AND CONNECTION LINES HAVING SAME RESISTANCE VALUE AS THE PADS AND IMPEDANCE MATCHING METHOD
#92High-frequency signal transmission line and electronic device
#93Planar circuit to waveguide transition having openings formed in a conductive pattern to form a balance line or an unbalance line
#94Flat cable
#95Insulation circuit and communication equipment
#96Attenuation reduction grounding pattern structure for connection pads of flexible circuit board
#97Printed circuit board and memory module including the same
#98System and method for using a reference plane to control transmission line characteristic impedance
#99High-frequency signal line, method for producing same, and electronic device
#100CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE
#101Optical receiver and transceiver using the same
#102FLEXIBLE CIRCUIT BOARD
#103Wiring substrate for a semiconductor device having differential signal paths
#104Flat cable
#105Optimized via cutouts with ground references
#106High-frequency signal line and electronic device
#107High frequency signal line and electronic device
#108High-frequency signal line and electronic device
#109Circuit board with signal routing layer having uniform impedance
#110Printed circuit board
#111Interconnection device for electronic circuits, notably microwave electronic circuits
#112High-frequency signal line and electronic device including the same
#113High-frequency signal transmission line and electronic device
#114Electrical characteristics of package substrates and semiconductor packages including the same
#115Multilayer circuit substrate having core layer with through-hole
#116High frequency circuit module
#117Multilayer circuit substrate
#118High-frequency signal transmission line and electronic apparatus
#119High-frequency signal transmission line and electronic apparatus
#120Multilayer substrate
#121Multilayer wiring board
#122High-frequency signal transmission line
#123Flexible printed circuit board and circuit-board connection structure
#124High-frequency signal transmission line
#125High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
#126Circuit substrate having noise suppression structure
#127Wiring board for mounting a semiconductor element
#128Decoupling method, appratus for designing power feeding line, and circuit board
#129Differential mode signal transmission module
#130Flexible circuit board
#131Impedance matching method
#132Printed circuit boards including strip-line circuitry and methods of manufacturing same
#133FLEXIBLE PRINTED CIRCUIT BOARD
#134PRINTED CIRCUIT BOARD
#135Apparatus for broadband matching
#136DC-DC converter
#137Printed circuit board with circuit topology
#138Method of forming a package substrate
#139Circuit manufacturing and design techniques for reference plane voids with strip segment
#140Circuit manufacturing and design techniques for reference plane voids with strip segment
#141Circuit board
#142Printed circuit board and method of manufacturing the same
#143Multilayer substrate
#144Printed circuit board and method of manufacturing the same
#145High-frequency signal transmission line
#146CIRCUIT BOARD
#147STRUCTURE OF TRANSMISSION LINE FOR DATA COMMUNICATION AND METHOD FOR DESIGNING THE SAME
#148Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship
#149WIRELESS COMMUNICATIONS USING MULTI-BANDPASS TRANSMISSION LINE WITH SLOT RING RESONATORS ON THE GROUND PLANE
#150Method and device for routing over a void for high speed signal routing in electronic systems
#151Continuously referencing signals over multiple layers in laminate packages
#152POWER AND GROUND PLANES HAVING MODIFIED RESONANCE FREQUENCIES
#153Electrical impedance precision control of signal transmission line for circuit board
#154Signal line disposed in a flexible insulating main body, where the main body includes a connector portion which is wider than a signal portion
#155Printed circuit board with good performance on impedance
#156WIRING SUBSTRATE, FILTER DEVICE AND PORTABLE EQUIPMENT
#157CIRCUIT BOARD STRUCTURE WITH LOW CAPACITANCE
#158Defected ground structure with shielding effect
#159Method and device for differential signal channel length compensation in electronic system
#160Differential transmission line with a set relationship to a ground conductor and method of manufacturing
#161Flexible printed circuit board with waterproof structure
#162Printed circuit board
#163Package substrate
#164Connector and cable assembly
#165Printed circuit board
#166Flexible printed circuit board
#167Connector and printed circuit board foot pattern for a connector
#168Printed circuit board impedance matching step for microwave (millimeter wave) devices
#169Connection device for high frequency signals between a connector and a transmission line
#170Method for manufacturing an integrated lead suspension
#171Coupler apparatus
#172Metamaterial transmission line apparatus and method of implementing the same
#173High-speed ceramic modules with hybrid referencing scheme for improved performance and reduced cost
#174High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefrom
#175PRINTED CIRCUIT BOARD
#176Printed circuit board
#177Magnetodielectric substrate and antenna apparatus using the same
#178SIGNAL TRANSMISSION APPARATUS
#179FLEXIBLE FLAT CIRCUITRY
#180FLEXIBLE PRINTED CIRCUIT BOARD
#181STORAGE DEVICE
#182Multi-layer ground plane structures for integrated lead suspensions
#183Flexible printed circuit board
#184MICROSTRUCTURED MATERIAL AND PROCESS FOR ITS MANUFACTURE
#185CIRCUIT BOARD
#186Printed circuit board
#187Printed circuit board
#188Circuit manufacturing and design techniques for reference plane voids with strip segment
#189Flexible printed circuit board
#190Flexible printed circuit board
#191Printed wiring board having wire grounding conductors with distances that are 1/n the width of the signal lines
#192Optical module
#193Circuit board and display panel assembly having the same
#194High-Speed Two-Layer and Multilayer Circuit Boards
#195ELECTRONIC DEVICE AND HIGH FREQUENCY CIRCUIT BOARD THEREOF
#196Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive
#197Printed wiring board and electronic apparatus
#198Circuit board layout method
#199PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#200Circuit substrate having power/ground plane with grid holes
#201Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density
#202ELECTRONIC APPARATUS, FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD
#203Printed circuit board with reduced signal distortion
#204Printed circuit board
#205Optical communication module and flexible printed circuit board
#206FLEXIBLE PRINTED CIRCUIT BOARD
#207FLEXIBLE PRINTED CIRCUIT BOARD
#208Continuously referencing signals over multiple layers in laminate packages
#209PRINTED CIRCUIT BOARD WITH GROUND GRID
#210Ground-plane slotted type signal transmission circuit board
#211PCB layout structrue for suppressing EMI and method thereof
#212Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring
#213MULTILAYER SUBSTRATE
#214Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces
#215Ground straddling in PTH pinfield for improved impedance
#216Reference plane voids with strip segment for improving transmission line integrity over vias
#217Electric apparatus
#218DUAL DENSITY PRINTED CIRCUIT BOARD ISOLATION PLANES AND METHOD OF MANUFACTURE THEREOF
#219Multilayer build-up wiring board including a chip mount region
#220Reference layer openings
#221Ceramic substrate grid structure for the creation of virtual coax arrangement
#222Ceramic substrate grid structure for the creation of virtual coax arrangement
#223High speed electrical interconnects and method of manufacturing thereof
#224Layout of a circuit board with stacked signal and reference layers and an opening in the reference layer
#225Flexible printed circuit board
#226PRINTED WIRING BOARD
#227Circuit connection structure and printed circuit board
#228Printed circuit board having impedance-matched strip transmission line
#229MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB
#230Skew Compensation by Changing Ground Parasitic For Traces
#231FLEXIBLE CIRCUIT
#232Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
#233PRINTED CIRCUIT BOARD
#234Wired circuit board
#235STRUCTURES FOR IMPLEMENTING EMI SHIELDING FOR RIGID CARDS AND FLEXIBLE CIRCUITS
#236Method and Structure for Implementing Control of Mechanical Flexibility With Variable Pitch Meshed Reference Planes Yielding Nearly Constant Signal Impedance
#237Optical transmitter module
#238High frequency tuner module and tuner module
#239PRINTED-WIRING BOARD
#240Circuit board with improved ground plane
#241FLEXIBLE PRINTED CIRCUIT BOARD
#242Ceramic substrate grid structure for the creation of virtual coax arrangement
#243VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH
#244Differential transmission line having a curved region with selected radius of curvature
#245Flexible printed board
#246Continuously Referencing Signals over Multiple Layers in Laminate Packages
#247Skew compensation by changing ground parasitic for traces
#248Method and Structures for Implementing EMI Shielding for Rigid Cards and Flexible Circuits
#249Reference layer openings
#250Buildup board, and electronic component and apparatus having the buildup board
#251Tailoring impedances of conductive traces in a circuit board
#2522-Layer printed circuit board and method of manufacturing the same
#253Printed circuit board and manufacturing method thereof
#254Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit board
#255WIRING STRUCTURE, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE
#256RIGID FLEXIBLE PRINTED CIRCUIT BOARD HAVING OPENINGS
#257Differential signal transmission structure, wiring board, and chip package
#258Differential transmission line structure and wiring substrate
#259Electrical connector having a circuit board with controlled impedance
#260Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes
#261System and Method for Noise Reduction in Multi-Layer Ceramic Packages
#262Differential transmission line having curved section with reduced line width
#263Differential transmission line having curved differential conductors and ground plane slots
#264Electro-optical device, electronic apparatus, and interface board
#265Printed circuit board for real-time clock IC and manufacturing method for printed circuit board for real-time clock IC
#266Printed circuit board
#267Substrate warpage control and continuous electrical enhancement
#268Method of reducing warpage in an over-molded IC package
#269Apparatus having reduced warpage in an over-molded IC package
#270Printed circuit board
#271Printed circuit board for improving impedance of signal transmission lines
#272Method and system for an improved package substrate for use with a semiconductor package
#273System and method for noise reduction in multi-layer ceramic packages
#274Electrical lead suspension having partitioned air slots
#275Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension
#276Printed circuit board for connection with an external connector
#277Semiconductor device having signal line and reference potential planes separated by a vertical gap
#278Printed circuit board with improved ground plane
#279Interconnect and head gimbal assembly with the same
#280Vents with signal image for signal return path
#281Integrated capacitor on packaging substrate
#282Ground plane having opening and conductive bridge traversing the opening
#283Signal transmission structure having plural reference planes with non-overlapping openings
#284Two-layer PCB with impedence control and method of providing the same
#285Electronic component mounted structure and optical transceiver using the same
#286Reference layer openings
#287Multilayer printed wiring board and multilayer printed circuit board
#288Reference slots for signal traces
#289Flat flexible circuitry
#290Structure of a circuit board for improving the performance of routing traces
#291Package substrate for integrated circuit and method of making the substrate
#292Voltage controlled oscillator small in reduction of inductance and Q
#293Signal transmission structure
#294Method of fabricating the routing of electrical signals
#295Signal transmission structure having salients aligned with non-reference regions
#296Signal transmission structure
#297Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane
#298Chip package with degassing holes
#299Setting the impedance of signal traces of a circuit board using a reference trace