ClassID:

233698

H05K1/0326 - page 2 - CPC Classification

Classification description:

Printed circuits; Details; Use of materials for the substrate; Organic insulating material consisting of one material containing O

Recent Application in this class:
#301
20100155123
2010-06-24

Halogen-free prepreg and resin for preparing the same

#302
20100155122
2010-06-24

Biomass-derived epoxy compound and manufacturing method thereof

#303
20100144926
2010-06-10

EPOXY RESIN COMPOSITION

#304
20100119805
2010-05-13

Thermoplastic polyhydroxy polyether resin and resin composition comprising the same

#305
20100108368
2010-05-06

Resin composition for forming insulating layer of printed wiring board

#306
20100093928
2010-04-15

Epoxy phosphorous-containing resin, epoxy resin composition essentially containing the epoxy resin, and cured product of the epoxy resin composition

#307
20100084170
2010-04-08

Composite-forming method, composites formed thereby, and printed circuit boards incorporating them

#308
20100084167
2010-04-08

SUBSTRATE APPLICABLE IN CHIP LED PACKAGE

#309
20100080998
2010-04-01

Epoxy resin composition, and cured material, semi-cured material, prepreg and composite substrate using the epoxy resin composition

#310
20100068958
2010-03-18

Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same

#311
20100063182
2010-03-11

EPOXY COMPOSITION

#312
20100048826
2010-02-25

Cyanate-terminated polyphenylene ether

#313
20100012354
2010-01-21

THERMALLY CONDUCTIVE POLYMER BASED PRINTED CIRCUIT BOARD

#314
20090321117
2009-12-31

A CURABLE EPOXY RESIN COMPOSITION HAVING A MIXED CATALYST SYSTEM AND LAMINATES MADE THEREFROM

#315
20090281273
2009-11-12

INSULATING POLYMERIC-MATERIAL COMPOSITION

#316
20090253887
2009-10-08

Epoxy resin curing composition

#317
20090247724
2009-10-01

Poly(arylene ether) copolymer

#318
20090240022
2009-09-24

Liquid crystal polymer and film thereof

#319
20090215967
2009-08-27

Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications

#320
20090205856
2009-08-20

Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

#321
20090200071
2009-08-13

Resin composition, prepreg, laminate, and wiring board

#322
20090169773
2009-07-02

FLEXIBLE FILM AND DISPLAY DEVICE COMPRISING THE SAME

#323
20090159313
2009-06-25

CURABLE EPOXY RESIN COMPOSITION AND LAMINATES MADE THEREFROM

#324
20090118458
2009-05-07

Insulating film-forming composition

#325
20090069513
2009-03-12

EPOXY RESIN, METHOD FOR PRODUCING SAME AND USE THEREOF

#326
20090054669
2009-02-26

Process For Producing Epoxy Compound

#327
20090032286
2009-02-05

Epoxy Resin Composition

#328
20090030147
2009-01-29

Epoxy resin curable composition for prepreg

#329
20090018355
2009-01-15

Process for Crystallizing an Epoxy Compound

#330
20080269427
2008-10-30

(Meth)acrylated epoxy-terminated polyphenylene ether

#331
20080268179
2008-10-30

Method for producing laminate comprising liquid-crystalline polyester layer

#332
20080262139
2008-10-23

Flame retardant crosslink agent and epoxy resin compositions free of halogen and phosphorous

#333
20080255306
2008-10-16

Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers

#334
20080254257
2008-10-16

Poly (phenylene ether) resin composition, prepreg, and laminated sheet

#335
20080213489
2008-09-04

Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom

#336
20080211629
2008-09-04

Polymeric Film Substrate for Use in Radio-Frequency Responsive

#337
20080200617
2008-08-21

Halogen-free flameproof epoxy resin formulations

#338
20080194724
2008-08-14

METHOD OF FORMING A CROSSLINKED POLY(ARYLENE ETHER) FILM, AND FILM FORMED THEREBY

#339
20080178983
2008-07-31

Composite-forming method, composites formed thereby, and printed circuit boards incorporating them

#340
20080154006
2008-06-26

Carboxylic acid-modified biphenyl epoxy diacrylate

#341
20080153976
2008-06-26

Epoxy Resin, Epoxy Resin Composition, And Cured Material Thereof

#342
20080132637
2008-06-05

Functionalized polyphenylene ether

#343
20080125531
2008-05-29

Polymerizable Composition, Thermoplastic Resin Composition, Crosslinked Resin, And Crosslinked Resin Composite Materials

#344
20080113176
2008-05-15

Curable polyvinyl benzyl compound and process for producing the same

#345
20080108739
2008-05-08

Epoxy resin hardener of anhydride copolymer and anhydride-elastomer copolymer

#346
20080097014
2008-04-24

Non-Halogen Flame Retardant and Highly Heat Resistant Phosphorous-Modified Epoxy Resin Compositions

#347
20080090084
2008-04-17

Flame retardant resin composition for printed circuit board and printed circuit board using the same

#348
20080071036
2008-03-20

CURED POLY(ARYLENE ETHER) COMPOSITION, METHOD, AND ARTICLE

#349
20080050596
2008-02-28

Composition of oxazolidine epoxy resin, epoxy phosphazene, phosphorus compound or polyphenylene ether and curing agent

#350
20080044667
2008-02-21

Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition

#351
20080033117
2008-02-07

(Meth)acrylate-terminated polyphenylene ether

#352
20080032144
2008-02-07

Oriented polyester film

#353
20080020231
2008-01-24

Epoxy Resin Composition

#354
20070281566
2007-12-06

Prepreg and conductive layer-laminated substrate for printed wiring board

#355
20070281142
2007-12-06

RESIN COMPOSITION FOR PRINTED WIRING BOARD FILM AND USE THEREOF

#356
20070275250
2007-11-29

Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent

#357
20070265423
2007-11-15

Di(meth)acrylate of epoxy-terminated polyphenylene ether

#358
20070191540
2007-08-16

LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN

#359
20070187643
2007-08-16

Liquid-crystalline polyester and solution composition comprising the same

#360
20070184280
2007-08-09

Epoxy compounds and cured epoxy resins obtained by curing the compounds

#361
20070135609
2007-06-14

Poly(arylene ether) copolymer

#362
20070122637
2007-05-31

Aromatic liquid-crystalline polyester film and metal laminated article

#363
20070106051
2007-05-10

Polyfunctional poly(arylene ether) method

#364
20070093614
2007-04-26

Epoxy resin composition

#365
20070092709
2007-04-26

Resin-impregnated base substrate and method for producing the same

#366
20070088136
2007-04-19

Flame retarding epoxy resin composition containing no halogen

#367
20070077416
2007-04-05

Substrate for flexible wiring and method for producing the same

#368
20070064054
2007-03-22

Polyester flex circuit constructions and fabrication methods for ink-resistant flex circuits used in ink jet printing

#369
20070060720
2007-03-15

Epoxy resin composition

#370
20070060673
2007-03-15

Resin compositions, prepregs and laminates

#371
20070055041
2007-03-08

Phenolic resins

#372
20070026245
2007-02-01

Laminate of liquid crystalline polyester with copper foil

#373
20070015872
2007-01-18

Thermosetting resin composition and multilayer printed wiring board using the same

#374
20060275591
2006-12-07

Heat-stabilised poly(ethylene naphthalate) film for flexible electronic and opto-electronic devices

#375
20060269764
2006-11-30

Laminated polyester film, flame-retardant polyester film thereof, copper-clad laminated plate and circuit substrate

#376
20060258824
2006-11-16

Flame-retardant epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards

#377
20060247334
2006-11-02

Epoxy resin composition and method for producing heat-resistant laminate sheet

#378
20060222856
2006-10-05

Prepreg for printed wiring board and copper-clad laminated board

#379
20060178454
2006-08-10

Vinyl ether curing composition

#380
20060177666
2006-08-10

Curable resin compositions

#381
20060160931
2006-07-20

Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same

#382
20060159929
2006-07-20

Epoxy compound and cured epoxy resin product

#383
20060159928
2006-07-20

Resin composition for printed wiring board, prepreg, and laminate obtained with the same

#384
20060141262
2006-06-29

Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg

#385
20060135710
2006-06-22

Epoxy resin compositions, methods of preparing and articles made therefrom

#386
20060134409
2006-06-22

Biaxially oriented copolyester film and laminates thereof

#387
20060118766
2006-06-08

Low loss prepregs, compositions useful for the preparation thereof and uses therefor

#388
20060069190
2006-03-30

Aromatic liquid-crystalline polyester composition and film of the same

#389
20060038324
2006-02-23

Molding method for curable poly(arylene ether) composition and article thereby

#390
20060035093
2006-02-16

Heat resistant film and metal laminate thereof

#391
20060008632
2006-01-12

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

#392
20050267266
2005-12-01

Hybrid materials employing PPE/polystyrene/curable epoxy mixtures

#393
20050228148
2005-10-13

Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the resin, sealant containing the composition, molding material containing the composition, and laminate containing the composition

#394
20050215749
2005-09-29

Phenol-reacted non-ester alicyclic diepoxides

#395
20050186430
2005-08-25

Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof

#396
20050176909
2005-08-11

Curable polyvinyl benzyl compound and process for producing the same

#397
20050154110
2005-07-14

Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition

#398
20050143524
2005-06-30

Hardener composition for epoxy resins

#399
20050131167
2005-06-16

Indole resins epoxy resins and resin compositions containing the same

#400
20050131166
2005-06-16

Process for producing high speed transmitting dielectric material

#401
20050130447
2005-06-16

Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition

#402
20050130446
2005-06-16

Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosetting polyvinylbenzyl ether resin composition, and method for preparing thermosetting polyvinylbenzyl ether resin composition

#403
20050107508
2005-05-19

Mono or biaxially oriented, flame-retardant polyester film

#404
20050095435
2005-05-05

Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent

#405
20050070685
2005-03-31

Low molecular weight polyphenylene ether

#406
20050065295
2005-03-24

Epoxy resin compositions, processes utilizing same and articles made therefrom

#407
20050065241
2005-03-24

Polyphenylene ether oligomer compound, derivatives thereof and use thereof

#408
20050064140
2005-03-24

Base film for membrane switch and membrane switch

#409
20050054787
2005-03-10

Phenolic resins

#410
20050042466
2005-02-24

Resin composition and prepreg for laminate and metal-clad laminate

#411
20050020801
2005-01-27

Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins

#412
20050009980
2005-01-13

Phenolic resin systems for fiber reinforced composite manufacture

#413
20050008882
2005-01-13

Phenol resin composition and phenol resin copper-clad laminate

#414
20050004339
2005-01-06

Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins

#415
20050003202
2005-01-06

N-substituted arylamino-phenol-formaldehyde condensates

#416
15874649
2019-09-24

Micro-pad array to thread flexible attachment

#417
15623032
2018-09-04

Multilayer stretchable films for flexible printed circuits and methods of making

#418
14601973
2017-05-09

Coreless organic substrate

#419
14515209
2015-11-03

Flexible printed circuit board having gold fingers