ClassID:

233711

H05K1/056 - page 4 - CPC Classification

Classification description:

Printed circuits; Details; Use of materials for the substrate; Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer

Recent Application in this class:
#901
20050272252
2005-12-08

Circuit device

#902
20050268547
2005-12-08

Plant cultivating method, cultivating device, and its lighting device

#903
20050263911
2005-12-01

Circuit device and manufacturing method thereof

#904
20050263905
2005-12-01

Method for manufacturing circuit device

#905
20050263895
2005-12-01

Circuit device and manufacturing method thereof

#906
20050263880
2005-12-01

Circuit device and manufacturing method thereof

#907
20050263846
2005-12-01

Circuit device with dummy elements

#908
20050263482
2005-12-01

Method of manufacturing circuit device

#909
20050263320
2005-12-01

Circuit device and manufacturing method thereof

#910
20050260391
2005-11-24

Wired circuit board

#911
20050254220
2005-11-17

Electronics unit

#912
20050254175
2005-11-17

Method for making noble metal conductive leads for suspension assemblies

#913
20050248885
2005-11-10

Suspension board with circuit

#914
20050236177
2005-10-27

Multilayer printed wiring board

#915
20050231922
2005-10-20

Functional printed circuit board module with an embedded chip

#916
20050221537
2005-10-06

Plastic packaging with high heat dissipation and method for the same

#917
20050219009
2005-10-06

Circuitry module

#918
20050218503
2005-10-06

Multilayer wiring board incorporating carbon fibers and glass fibers

#919
20050213308
2005-09-29

Hybrid integrated circuit device

#920
20050212113
2005-09-29

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

#921
20050208789
2005-09-22

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

#922
20050195528
2005-09-08

Coined ground features for integrated lead suspensions

#923
20050186332
2005-08-25

Production method of suspension board with circuit

#924
20050184376
2005-08-25

System in package

#925
20050176175
2005-08-11

Method of manufacturing hybrid integrated circuit device

#926
20050175850
2005-08-11

Flexible metal laminate and heat-resistant adhesive composition

#927
20050167281
2005-08-04

Production method of suspension board with circuit

#928
20050161782
2005-07-28

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

#929
20050161251
2005-07-28

Hybrid integrated circuit device and method of manufacturing the same

#930
20050158916
2005-07-21

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

#931
20050155789
2005-07-21

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

#932
20050124196
2005-06-09

Single or multi-layer printed circuit board with improved via design

#933
20050122627
2005-06-09

Suspension board having a circuit and a flying lead portion

#934
20050117257
2005-06-02

Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material

#935
20050116235
2005-06-02

Illumination assembly

#936
20050088783
2005-04-28

Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive

#937
20050087509
2005-04-28

Metal laminate and etching method therefor

#938
20050083665
2005-04-21

Power conversion module device and power unit using the same

#939
20050073044
2005-04-07

Plastic packaging with high heat dissipation and method for the same

#940
20050067186
2005-03-31

Hybrid integrated circuit device and method of manufacturing the same

#941
20050063183
2005-03-24

Modular mounting arrangement and method for light emitting diodes

#942
20050061542
2005-03-24

Suspension board with circuit and producing method thereof

#943
20050056922
2005-03-17

Expansion constrained die stack

#944
20050051359
2005-03-10

Coupler resource module

#945
20050040513
2005-02-24

Interconnection circuit and electronic module utilizing same

#946
20050037543
2005-02-17

Method of manufacturing heat conductive substrate

#947
20050029658
2005-02-10

Circuit board and semiconductor device using the same

#948
20050023030
2005-02-03

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

#949
20050018352
2005-01-27

Flexible printed circuit for spindle motor and disk drive having the same

#950
20050006138
2005-01-13

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

#951
17133597
2022-04-19

Metal circuit on polymer composite substrate surface and method for manufacturing the same

#952
16051127
2019-12-10

Printed circuit board

#953
16022366
2019-10-08

Flexible circuit board substrate and method of manufacturing the same