H05K13/0092 - CPC Classification Index

ClassID:

234276 ⎘

H05K13/0092 - CPC Classification

Classification description:

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components Treatment of the terminal leads as a separate operation

Recent Application in this class:

20230309241

2023-09-28

METHOD FOR OPERATING A METAL DROP EJECTING THREE-DIMENSIONAL (3D) OBJECT PRINTER TO FORM VIAS IN PRINTED CIRCUIT BOARDS WITH CONDUCTIVE METAL

20220240387

2022-07-28

Metal drop ejecting three-dimensional (3D) object printer

20190134842

2019-05-09

Interchangeable spring pack for an upper die in a lead forming system

20180184553

2018-06-28

Board work machine and recognition method

20170265341

2017-09-14

External-leadwire crimping apparatus

20170165718

2017-06-15

Cleaning apparatus

20160212895

2016-07-21

Method for manufacturing electronic component

20160212873

2016-07-21

Electrical equipment, integrated circuit's loop thereof and circuit connecting method

20150325969

2015-11-12

DEVICE AND METHOD FOR SEPARATION OF A CRIMPED WIRE TERMINAL FROM A TAPE TERMINAL CARRIER STRIP

#10

20140007422

2014-01-09

Correction mechanism for pin and correction device

#11

20130042663

2013-02-21

Lead pin rectifying apparatus and lead pin rectifying method

#12

20110203082

2011-08-25

Press apparatus and method for manufacturing semiconductor device

#13

20100313411

2010-12-16

Pin regulator for electronic components

#14

20100115768

2010-05-13

Method for adapting an electronic component for surface mounting

#15

20080035368

2008-02-14

Chip holder board

#16

20060237087

2006-10-26

Method of forming leads of a packaged semiconductor device

#17

20050076967

2005-04-14

Method of forming leads of a semiconductor device