H05K13/027 - CPC Classification Index

ClassID:

234284 ⎘

H05K13/027 - CPC Classification

Classification description:

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components; Feeding of components Fluid transport of components

Recent Application in this class:

20250133664

2025-04-24

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

20250133663

2025-04-24

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

20210320089

2021-10-14

Apparatus and method for manufacturing light-emitting display device

20210090929

2021-03-25

Substrate chuck for self-assembling semiconductor light emitting diodes

20210090925

2021-03-25

Device for self-assembling semiconductor light-emitting diodes

20180006543

2018-01-04

Component mounting device head unit

20170223880

2017-08-03

Surface mount device for control of holding and moving printed circuit board in the priority order

20150259143

2015-09-17

Apparatus for handling electronic components

20150048148

2015-02-19

Electromagnetic field assisted self-assembly with formation of electrical contacts

#10

20130199831

2013-08-08

ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS

#11

20100119346

2010-05-13

Feed mechanism and method for feeding minute items

#12

20100061811

2010-03-11

Bulk component feeder

#13

20060280564

2006-12-14

Method for supplying a component and a component supplying device

#14

20060269689

2006-11-30

Method and apparatus for moving blocks