H05K13/0478 - CPC Classification Index

ClassID:

234305 ⎘

H05K13/0478 - CPC Classification

Classification description:

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components; Mounting of components, e.g. of leadless components Simultaneously mounting of different components

Sub-classes:

H05K13/0482 » {using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached} 8
H05K13/0482 » {using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached} 8

Recent Application in this class:

20250240935

2025-07-24

COMPONENT MOUNTING EQUIPMENT

20230356520

2023-11-09

MICRO-TRANSFER PRINTING FROM ADHESIVE SURFACES

20210384062

2021-12-09

Transfer tool and method for transferring semiconductor chips

20210090929

2021-03-25

Substrate chuck for self-assembling semiconductor light emitting diodes

20210090925

2021-03-25

Device for self-assembling semiconductor light-emitting diodes

20210015012

2021-01-14

Component mounting line

20200013656

2020-01-09

Flip chip bonding device and bonding method

20190373783

2019-12-05

Control device, mounting device and control method

20180338397

2018-11-22

METHOD AND DEVICES FOR PICKING AND PLACING WORKPIECES INTO DEVICES UNDER MANUFACTURE USING DUAL ROBOTS

#10

20180242485

2018-08-23

Component mounting line

#11

20180124962

2018-05-03

Component mounting method

#12

20170127582

2017-05-04

Electronic component mounting method

#13

20160330883

2016-11-10

ASSEMBLING APPARATUS FOR BACKLIGHT

#14

20150350502

2015-12-03

WAFER-LEVEL CAMERA MODULE AND MANUFACTURING METHOD THEREOF

#15

20150321359

2015-11-12

Picker assembly

#16

20140263581

2014-09-18

Electronic component bonding method

#17

20140263575

2014-09-18

Element pressing apparatus and heating system using element pressing apparatus

#18

20140259633

2014-09-18

Apparatus for assembly of microelectronic devices

#19

20140241845

2014-08-28

Apparatus and method of batch assembly

#20

20130110277

2013-05-02

COMPONENT MOUNTING APPARATUS, INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND PRODUCTION METHOD FOR A SUBSTRATE

#21

20120260752

2012-10-18

Assembly and method for IC unit engagement

#22

20120200100

2012-08-09

Equipment for the simultaneous manipulation of several components

#23

20120036711

2012-02-16

Apparatus of mounting component

#24

20100313415

2010-12-16

Rotary clip bonder

#25

20100236053

2010-09-23

Apparatus and method for manufacturing semiconductor device

#26

20100229378

2010-09-16

Method and apparatus for electronic component mounting

#27

20100132187

2010-06-03

Part mounting method

#28

20100071201

2010-03-25

Component placement apparatus, component placement setting calculation apparatus, program, and component placement setting calculation method

#29

20090238671

2009-09-24

Equidistance pick-and-place device for ICs

#30

20080000078

2008-01-03

Device for assembling pins onto a circuit board background

#31

20070183184

2007-08-09

Apparatus and method for manufacturing semiconductor device

#32

16370771

2022-01-04

Pickup head with touch down sensor

#33

14868320

2018-07-31

Method and devices for picking and placing workpieces into devices under manufacture using dual robots