234320 ⎘
Indexing scheme relating to printed circuits covered by; Dielectrics; Properties and characteristics in general Shrinkable, e.g. heat-shrinkable polymer
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#2LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#3LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUDED FILM FOR STRETCH TREATMENT, LCP STRETCHED FILM, HEAT-SHRINKABLE LCP STRETCHED FILM, INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
#4FILM AND LAMINATE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC SUBSTRATE INCLUDING SAME
#5Plastic film/sheet as replacement for typical conformal coatings
#6METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES
#7METHOD FOR FABRICATING PRINTED ELECTRONICS
#8Method for manufacturing layered electronic devices
#9Light emitting device module
#10METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE
#11Method for mounting electronic-component module
#12Technique for compensating for substrate shrinkage during manufacture of an electronic assembly
#13Printed circuits on shrink film
#14Electromagnetically shielded circuit device and shielding method therefor
#15Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed
#16Printed circuits on shrink film