Flexible printed circuit board and display device having the same

Forming compliant contact pads for semiconductor packages

Multilayer printed wiring board

Socket, method for manufacturing socket, and semiconductor device

Stencils With Removable Backings for Forming Micron-Sized Features on Surfaces and Methods of Making and Using the Same

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Anisotropic electrically conductive film and connection structure

Prepreg and its application products for low thermal expansion and low dielectric tangent

Ceramic capacitor assembly

Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof

Electrical connector having a connect portion connecting two contact portions having projections and a drainage at least partially between the projections

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Memory module, socket and mounting method providing improved heat dissipating characteristics

ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS

Probe card using thermoplastic resin

Conductive elastomeric shielding device and method of forming same

Printed circuit board assembly with shock absorbing structure

ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS

Land grid array interposer producing method

Wiring substrate and semiconductor device and method of manufacturing the same

Electronic component

Electrocoated contacts compatible with surface mount technology

SEMICONDUCTOR MODULES AND ELECTRONIC DEVICES USING THE SAME

Composite substrate

Method of producing a land grid array (LGA) interposer structure

HEAD ACTUATOR ASSEMBLY, DISK DEVICE PROVIDED WITH THE SAME, AND MANUFACTURING METHOD FOR HEAD ACTUATOR ASSEMBLY

Multilayer printed wiring board

Low temperature bonding electronic adhesives

Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers

Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods

Dielectric sheet

MANUFACTURING METHOD FOR CROSS-WIRING ELECTRODE WIRE OF FIELD EMISSION DISPLAY

Heat transfer member and connector

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

Large electronic component dampening fixation

Board-to-board connector

VIBRATION ISOLATORS FOR PRINTED WIRING BOARDS

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Light Emitting Diode Module

Land grid array fabrication using elastomer core and conducting metal shell or mesh

Substrate with low-elasticity layer and low-thermal-expansion layer

Mounting method

Compression bonding device and a mounting method

Printed circuit board reinforcement structure and integrated circuit package using the same

Inorganic hollow particle, process for producing the same, and composition containing the same

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION

Prepreg and laminate

COMPRESSION BONDING DEVICE

Method of producing a land grid array (LGA) interposer structure

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Method of producing a land grid array interposer

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Method of producing a land grid array interposer

Flexible circuit electrode array

Composite ceramic substrate

Retinal prosthesis with a new configuration

Expandable circuit carrier

FLEXIBLE CIRCUIT STRUCTURE WITH STRETCHABILITY AND METHOD OF MANUFACTURING THE SAME

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Method of forming a land grid array (LGA) interposer

Multilayer wiring substrate

Robust mounting for RFID transponder antenna

Multilayer printed wiring board

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

Mount structure, electro-optical device, and electronic apparatus

Sensor component with a cavity housing and a sensor chip and method for producing the same

SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY

Electrocoated contacts compatible with surface mount technology

Method of producing a land grid array interposer utilizing metal-on-elastomer

FLEXIBLE CIRCUIT BOARD OF LIQUID CRYSTAL DISPLAY HAVING A LIGHT ABSORBING LAYER

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

Method of forming a land grid array interposer

Compliant structure for an electronic device, method of manufacturing same, and system containing same

Electronic Equipment

Workpiece boring/cutting operation aiding plate material and molding making use of the same

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Interposer, electrical package, and contact structure and fabricating method thereof

CIRCUIT BOARD

Flame retardant resin composition for printed circuit board and printed circuit board using the same

Trans-retinal drug delivery device

Method for manufacturing wiring substrate having sheet

Circuit-connecting material and circuit terminal connected structure and connecting method

Circuit-connecting material and circuit terminal connected structure and connecting method

Flexible core for enhancement of package interconnect reliablity

Flexible core for enhancement of package interconnect reliability

Circuit-connecting material and circuit terminal connected structure and connecting method

Printed circuit board and method of manufacturing the same

Lens barrel including a flexible printed wiring board

Package for semiconductor devices

Thermosetting Resin Composition, Thermosetting Film, Cured Product of Those, and Electronic Component

Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Solder Ball Pad Structure

Serpentine and corduroy circuits to enhance the stretchablity of a stretchable electronic device

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Card connector dampening assembly

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Compressible films surrounding solder connectors

CURABLE RESIN COMPOSITION

Circuit-connecting material and circuit terminal connected structure and connecting method

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Multilayer printed wiring board

Method of making an electronic package

RESIN COMPOSITION FOR INSULATING LAYER FOR MULTI-LAYERED PRINTED BOARD

Insulation material of reactive elastomer, epoxy resin, curing agent and crosslinked rubber

Electrical connector

Mold made of amorphous fluorine resin and fabrication method thereof

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Flexible circuits having ink-resistant covercoats

Flexible circuits having ink-resistant covercoats

Recording disk drive capable of suppressing vibration of flexible printed circuit board

Recording disk drive capable of suppressing vibration of flexible printed circuit board

Device for protecting stamped conductor paths

Method of making a thermally isolated via structure

Adhesive for bonding circuit members, circuit board and process for its production

Forming compliant contact pads for semiconductor packages

Electrically conductive adhesives

Flexible ring interconnection system

Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof

Method of cooling electronic device and electronic device with improved cooling efficiency

Enhancing shock resistance in semiconductor packages

Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same

Polymer comprising silicone and metal trace

Universal wafer carrier for wafer level die burn-in

Method of fabricating a BGA package having decreased adhesion

Multilayer printed wiring board

Method of metallizing a silicone rubber substrate

Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish

Electronic package with compliant electrically-conductive ball interconnect

External contact material for external contacts of a semiconductor device and method of making the same

Retinal prosthesis with a new configuration

Trans-retinal flexible circuit electrode array

Anisotropic conductive sheet, manufacturing method thereof, and product using the same

Silicone metalization

Method of making an interposer with contact structures

Dielectric material

Method of preparing a metal-silicone rubber composite

Connecting sheet

Method of encapsulating an assembly with a low temperature silicone rubber compound

Circuit board and manufacturing method thereof

Electrically connecting structure of piezo-electric plates

Means for being electrically connected an electrode of a piezo-electric plate

FLAME RETARDANT ADHESIVE COMPOSITION, AND ADHESIVE SHEET, COVERLAY FILM AND FLEXIBLE COPPER-CLAD LAMINATE USING SAME

Flexible core for enhancement of package interconnect reliability

Method and apparatus for manufacturing electronic device using roll-to-roll rotary pressing process

Circuit materials, circuits, and methods of manufacture thereof

Polyoxyalkylene amine-modified polyamideimide resin and composition thereof

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same

Multilayer printed wiring board

Methods of producing a composite substrate

Stress absorption layer and cylinder solder joint method and apparatus

Method to accommodate increase in volume expansion during solder reflow

Electrical device allowing for increased device densities

Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith

Conductive contamination reliability solution for assembling substrates

Multilayer printed wiring board and method of manufacturing the same

Method for interconnecting semiconductor components with substrates and contact means

Electronic equipment

Layered microelectronic contact and method for fabricating same

Multilayer printed wiring board

Thermo-activated adhesive material for fpcb agglutinations

Multilayered circuit substrate, semiconductor device and method of producing same

Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same

Connector, method for manufacturing the same, and wiring board structure employing it

Flexible wiring board for tape carrier package having improved flame resistance

Method for gluing fpcb's

Flexible land grid array connector

Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products

Circuit-connecting material and circuit terminal connected structure and connecting method

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Electronic circuit including circuit-connecting material

Methods of making microelectronic assemblies including compliant interfaces

Compressible films surrounding solder connectors

Solderless component packaging and mounting

Helical microelectronic contact and method for fabricating same

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods and systems for fabricating electronic and/or microfluidic structures on elastomeric substrates

Thermally isolated via structure

Method of reforming reformable members of an electronic package and the resultant electronic package

Land grid array fabrication using elastomer core and conducting metal shell or mesh

Angular rate sensor having circuit board and package

Anisotropic conductive adhesive

Flexible contact-connection device

High-reliability solder joint for printed circuit board and semiconductor package module using the same

Electrical insulating resin composition, and laminate for circuit board

Electro-formed ring interconnection system

Flexible ring interconnection system

Method for testing using a universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level die burn-in

Method of making an electronic package

Memory module, socket and mounting method providing improved heat dissipating characteristics

Electric device where actuator unit and printed wiring board are connected using bonding parts

Printed wiring board and electric device using the same

Method for testing using a universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level die burn-in

Graduated stiffness for electrical connections in tires

Integrated circuit package with low modulus layer and capacitor/interposer

Strain-resistant electrical connection

Component mounting substrate and structure

Thermosetting resin composition for high performance laminates

Method for improving bonding of circuit substrates to metal and articles formed thereby

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Anisotropic conductive sheet and manufacture thereof

Method of fabricating film carrier

Recording disk drive capable of suppressing vibration of flexible printed circuit board

Micro pin grid array with pin motion isolation

Spacer, printed circuit board, and electronic equipment

Surface mounting of components

Fabrication of organic electronic circuits by contact printing techniques

Solder ball pad structure

Methods of making microelectronic assemblies including compliant interfaces

Microelectronic assemblies with composite conductive elements

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Bonding structure with compliant bumps

Method of making an interposer with contact structures

Integrated circuit die/package interconnect

Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component

Arrangement for improving module reliability

Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith

Flat panel display device and manufacturing method thereof

Resin composition and adhesive film for multi-layered printing wiring board

Package for semiconductor devices

Method of producing a multi-layered wiring board

Flexible hybrid electronic system and method of reducing the impact thereof

Electronic watch with obscured sensor for detecting an applied force

Device and method for protecting a connector assembly

Multilayer stretchable films for flexible printed circuits and methods of making

Formable transparent conductive films with metal nanowires