234423 ⎘
Indexing scheme relating to printed circuits covered by Thermal details
Sub-classes:INDUCTOR STRUCTURE WITH RING FOR TEMPERATURE COMPENSATION IN A RECEIVER ANALOG FRONT-END (RX AFE)
#2ELECTRONIC DEVICE COMPRISING HEAT TRANSFER PORTION
#3COOLING MODULE FOR BACKSIDE POWER DELIVERY SYSTEM
#4SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#5Adapter for Enabling the Interchange of Integrated Circuits with Dissimilar Surface Mount Device Footprints
#6ELECTRONIC CIRCUIT
#7HEAT SINK ASSEMBLY WITH SPRING-ADJUSTABLE HEAT PIPE FOR IMPROVED HEAT DISSIPATION, AND RELATED CIRCUIT BOARD ASSEMBLIES AND ASSEMBLY METHODS
#8TEMPERATURE ADJUSTMENT MODULE AND TEMPERATURE ADJUSTMENT METHOD
#9SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
#10Display panel and display device including the same
#11SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
#12ELECTRONIC DEVICE
#13HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
#14CIRCUIT ASSEMBLY
#15Ceramic Circuit Board And Semiconductor Device Using Same
#16TEMPERATURE MEASURING DEVICE
#17Electronic Device Having Floating Support Structure
#18Heating or cooling apparatus-integrated heat sink for a computing device
#19Thermal bridge for an electrical component
#20ELECTRONIC CIRCUIT
#21METHOD FOR PRODUCING COMPOSITE BODY
#22Embedded system module thermal installation verification
#23Component carrier having dielectric layer with conductively filled through holes tapering in opposite directions
#24Display panel and display device including the same
#25Thermal bridge for an electrical component
#26Composite phase change material, application method of composite phase change material, and battery
#27Applicator with thermal contact sensors
#28Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium
#29Power conversion apparatus
#30Thermally expandable material, sheet material, circuit board, method for manufacturing circuit board, computer readable storage medium, electronic apparatus, and structure to analyze heat-generation position
#31Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium
#32Circuit substrate and semiconductor device
#33Circuit assembly
#34Light emitting package having a guiding member guiding an optical member
#35Component vertical mounting
#36HOT SWAPPABLE DEVICES
#37Thermally conductive type polyimide substrate
#38RADIATIVE COOLING STRUCTURE FOR PRINTED CIRCUIT
#39Alloy bonded graphene sheets for enhanced thermal spreaders
#40Component vertical mounting
#41Circuit substrate and semiconductor device
#42Graphene Based Conformal Heat Sink and Method Therefor
#43Fixation of heat sink on SFP/XFP cage
#44Light emitting package having a guiding member guiding an optical member
#45METHOD OF MANUFACTURING ELECTRONIC UNIT
#46Printed wiring board
#47Surface-treated copper foil
#48Plug connecetor with a metallic enclosure having heat sink member thereon
#49Electronic device heat transfer system and related methods
#50SHIELD COVER AND ELECTRONIC APPARATUS
#51Power module and manufacturing method thereof
#52Method for producing an electronic component, and electronic assembly, a heating device being provided in the substrate of the assembly
#53Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
#54System and method for thermal management of electronic devices
#55CONTROL BOARD FOR POWER CONVERSION DEVICE
#56Heat radiation adhesive, heat radiation sheet using same, and electronic device having same
#57Circuit board, particulary for a power-electronic module, comprising an electrically-conductive substrate
#58Circuit arrangement for vehicles and use of a circuit arrangement
#59PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
#60Printed circuit board and electronic apparatus
#61Sliding thermal contact for pluggable optic modules
#62Electronic power module with enhanced thermal dissipation and manufacturing method thereof
#63Laminate and circuit board
#64Light emitting package having a guiding member guiding an optical member
#65Flexible printed circuit having a low emissivity
#66Vertical radio frequency module
#67Heat dissipating structure
#68Thermal stabilization of temperature sensitive components
#69Fixation of heat sink on SFP/XFP cage
#70Wiring board, method for manufacturing wiring board, and electronic device
#71Semiconductor device wiring pattern and connections
#72ELECTRICAL APPARATUS
#73Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board
#74Copper foil composite, formed product and method of producing the same
#75WIRING BOARD STRUCTURE
#76Graphitic substrates with ceramic dielectric layers
#77PRINTED CIRCUIT BOARD SET HAVING HIGH-EFFICIENCY HEAT DISSIPATION
#78Configurable heat conducting path for portable electronic device
#79THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD OF PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
#80PRINTED CIRCUIT BOARD
#81Passive layer for attenuation of near-field electromagnetic waves and heatdissipation including graphene, and electromagnetic device including the same
#82Light emitting package
#83Light emitting package
#84Package for light emitting device
#85Package for light emitting device
#86Package for light emitting device
#87Light emitting package having screen layer
#88Package for light emitting device with metal base to conduct heat
#89Adapter for removable computer expansion devices
#90Solder alloy free electronic (SAFE) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture
#91Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
#92Alloy bonded graphene sheets for enhanced thermal spreaders
#93Cooling conductive trace with pressurized air or gas
#94Graphite sheet to protect SMT components from thermal exposure