Patents-Review.com
ClassID:

234438 ⎘

H05K2201/0776 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Electric details Resistance and impedance

Sub-classes:
Recent Application in this class:
#1
20260129755
2026-05-07

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

 #2
20260032808
2026-01-29

PRINTED CIRCUIT BOARD WITH IMPEDANCE MATCHING THROUGH CONNECTIONS

 #3
20250113438
2025-04-03

WIRING BOARD AND SEMICONDUCTOR DEVICE

 #4
20250106999
2025-03-27

ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME

 #5
20250062061
2025-02-20

COIL DEVICE AND PRINTED WIRING BOARD

 #6
20250024599
2025-01-16

CERAMIC WIRING MEMBER

 #7
20250024592
2025-01-16

CERAMIC WIRING MEMBER

 #8
20240215150
2024-06-27

PACKAGE COMPONENT

 #9
20240196515
2024-06-13

SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE CALIBRATOR

 #10
20240179831
2024-05-30

ELECTRONIC MODULE AND ELECTRONIC DEVICE

 #11
20240074054
2024-02-29

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

 #12
20230345622
2023-10-26

Package component and forming method thereof

 #13
20220240377
2022-07-28

Method and circuit for controlling quality of metallization of a multilayer printed circuit board

 #14
20210227685
2021-07-22

Structure for circuit interconnects

 #15
20210084751
2021-03-18

Printed Wiring Board

 #16
20200343621
2020-10-29

Substrate for medical device and medical device

 #17
20200190350
2020-06-18

Conductive composition and wiring board using the same

 #18
20200113049
2020-04-09

Population of metal oxide nanosheets, preparation method thereof, and electrical conductor and electronic device including the same

 #19
20200029424
2020-01-23

Spread weave induced skew minimization

 #20
20200026186
2020-01-23

Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display device

 #21
20190373716
2019-12-05

Printed Wiring Board

 #22
20190357351
2019-11-21

Electronic apparatus having package base substrate

 #23
20190335579
2019-10-31

Structure for circuit interconnects

 #24
20190274215
2019-09-05

Circuit board and manufacturing method thereof

 #25
20190098855
2019-04-04

Apparatus and methods for via connection with reduced via currents

 #26
20180359854
2018-12-13

POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, AND ELECTRICAL CONDUCTOR AND ELECTRONIC DEVICE INCLUDING THE SAME

 #27
20180302056
2018-10-18

Filter

 #28
20180192517
2018-07-05

Apparatus and methods for via connection with reduced via currents

 #29
20170358881
2017-12-14

Electrical contact pad for electrically contacting a connector

 #30
20170294703
2017-10-12

Substrate for medical device and medical device

 #31
20170245366
2017-08-24

Dual printed circuit board assembly, printed circuit board and modular printed circuit board

 #32
20170135211
2017-05-11

Systems and methods for controlled effective series resistance component

 #33
20170135208
2017-05-11

Population of metal oxide nanosheets, preparation method thereof, and electrical conductor and electronic device including the same

 #34
20160192477
2016-06-30

Conductive transparent substrate manufacturing method, and conductive transparent substrate

 #35
20150313005
2015-10-29

PRINTED CIRCUIT BOARD

 #36
20150263694
2015-09-17

PCB FOR REDUCING ELECTROMAGNETIC INTERFERENCE OF ELECTRIC VEHICLE

 #37
20150114686
2015-04-30

PRINTED CIRCUIT BOARD

 #38
20150107884
2015-04-23

Multilayer wiring board with enclosed Ur-variant dual conductive layer

 #39
20150086789
2015-03-26

TRANSPARENT CONDUCTIVE FILM

 #40
20150034368
2015-02-05

ELECTRODE ELEMENT USING SILVER NANO-WIRE AND MANUFACTURING METHOD THEREOF

 #41
20150014023
2015-01-15

Conductive film and touch panel including the same

 #42
20140332259
2014-11-13

Wiring substrate and method of manufacturing wiring substrate

 #43
15399664
2018-02-06

Apparatus and methods for via connection with reduced via currents