ClassID:

234450

H05K2201/09054 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Substrate related Raised area or protrusion of metal substrate

Recent Application in this class:
#1
20250089162
2025-03-13

SUBSTRATE STRUCTURE

#2
20240244755
2024-07-18

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board

#3
20240090137
2024-03-14

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

#4
20220369498
2022-11-17

Heat sink with protrusions on multiple sides thereof and apparatus using the same

#5
20210059069
2021-02-25

Heat sink with protrusions on multiple sides thereof and apparatus using the same

#6
20200318826
2020-10-08

LED lamp having metal PCB bent polyhedrally and manufacturing method thereof

#7
20200093028
2020-03-19

Heat sink with protrusions on multiple sides thereof and apparatus using the same

#8
20190343014
2019-11-07

Method for controlling the assembly of a printed circuit board by riveting

#9
20190254161
2019-08-15

Method for manufacturing flexible printed circuit board

#10
20190254157
2019-08-15

Mounting assembly with a heatsink

#11
20180324947
2018-11-08

Metallic nano structure, method of fabricating the same, and electrical apparatus having the same

#12
20180310401
2018-10-25

Printed wiring board and camera module

#13
20180206324
2018-07-19

Mounting structure, method for manufacturing mounting structure, and radio device

#14
20180139841
2018-05-17

Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board

#15
20180092206
2018-03-29

Stretchable circuit board and method for manufacturing stretchable circuit board

#16
20180010775
2018-01-11

Metal PCB assembly for vehicle lamp and manufacturing method thereof

#17
20170196076
2017-07-06

Flexible circuit board and display apparatus

#18
20170188481
2017-06-29

Heat sink with protrusions on multiple sides thereof and apparatus using the same

#19
20170130947
2017-05-11

Air mixing methodology and system to reduce the temperature of LEDs of a photocatalytic reactor

#20
20170048971
2017-02-16

High current switch

#21
20160381783
2016-12-29

Preparation method of a boss-type metal-based sandwich rigid-flex circuit board

#22
20160087326
2016-03-24

Radio frequency connection arrangement

#23
20150230328
2015-08-13

Wiring substrate and semiconductor package

#24
20150092446
2015-04-02

Circuit board and lighting device having the circuit board

#25
20140319552
2014-10-30

Semiconductor light emitting device comprising cut-and-bent portions

#26
20140286614
2014-09-25

Optical module

#27
20140116757
2014-05-01

Chip support board structure

#28
20140115888
2014-05-01

Method of manufacturing a chip support board structure

#29
20140069695
2014-03-13

Designs and Fabrication Processes of a Heatsink

#30
20140029216
2014-01-30

Circuit board, electronic device, and method of manufacturing circuit board

#31
20140020934
2014-01-23

Circuit board assembly with flexible circuit board and reinforcing plate

#32
20130298396
2013-11-14

Method of making a heat radiating structure for high-power LED

#33
20130206459
2013-08-15

Radiant heat circuit board, heat generating device package having the same, and backlight unit

#34
20130188359
2013-07-25

Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight

#35
20130113369
2013-05-09

LED PACKAGE MODULE

#36
20130105849
2013-05-02

Semiconductor light emitting module comprising an exposed plate surface

#37
20130062717
2013-03-14

Circuit board

#38
20130021769
2013-01-24

MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#39
20130020606
2013-01-24

Circuit board with thermo-conductive pillar

#40
20130003306
2013-01-03

Electronic control unit and method of manufacturing the same

#41
20120327670
2012-12-27

Hybrid solid state emitter printed circuit board for use in a solid state directional lamp

#42
20120320529
2012-12-20

Method of producing an enhanced base plate

#43
20120243185
2012-09-27

Micro and millimeter waves circuit

#44
20120234582
2012-09-20

Mutual capacitance and magnetic field distribution control for transmission lines

#45
20120201028
2012-08-09

Illumination device with semiconductor light-emitting elements

#46
20120082420
2012-04-05

OPTICAL MODULE

#47
20120081895
2012-04-05

Illumination system, electro-optic device, and electronic apparatus

#48
20120080137
2012-04-05

MANUFACTURING METHOD OF CIRCUIT BOARD

#49
20120064672
2012-03-15

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

#50
20120002374
2012-01-05

ELECTRONIC CONTROL DEVICE

#51
20110311831
2011-12-22

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

#52
20110287563
2011-11-24

Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader

#53
20110284914
2011-11-24

METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

#54
20110278638
2011-11-17

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER

#55
20110275180
2011-11-10

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

#56
20110272179
2011-11-10

Printed Circuit Board with Embossed Hollow Heatsink Pad

#57
20110227122
2011-09-22

Semiconductor chip assembly with post/base heat spreader with thermal via

#58
20110201157
2011-08-18

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

#59
20110198662
2011-08-18

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

#60
20110183472
2011-07-28

Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole

#61
20110182073
2011-07-28

Illumination device with semiconductor light-emitting elements

#62
20110175512
2011-07-21

LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME

#63
20110175136
2011-07-21

Semiconductor chip assembly with post/base heat spreader and plated through-hole

#64
20110171785
2011-07-14

Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump

#65
20110163348
2011-07-07

SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP

#66
20110157897
2011-06-30

Light emitting diode module and method for making the same

#67
20110157834
2011-06-30

HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE

#68
20110156090
2011-06-30

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

#69
20110151626
2011-06-23

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

#70
20110134314
2011-06-09

IMAGE SENSOR MODULE FOR CAMERA DEVICE

#71
20110127912
2011-06-02

LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof

#72
20110120770
2011-05-26

ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS

#73
20110104856
2011-05-05

Method of making a semiconductor chip assembly with a post/base/post heat spreader

#74
20110101410
2011-05-05

Semiconductor chip assembly with post/base/post heat spreader

#75
20110095310
2011-04-28

SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

#76
20110089465
2011-04-21

Semiconductor chip assembly with post/base heat spreader with ESD protection layer

#77
20110012512
2011-01-20

Solid state light fixture with enhanced thermal cooling and color mixing

#78
20110003437
2011-01-06

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE

#79
20100327723
2010-12-30

LED ILLUMINATION DEVICE

#80
20100327310
2010-12-30

Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange

#81
20100315813
2010-12-16

Solid state light unit and heat sink, and method for thermal management of a solid state light unit

#82
20100309635
2010-12-09

Structure for mounting semiconductor package

#83
20100254093
2010-10-07

ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME

#84
20100218985
2010-09-02

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

#85
20100210049
2010-08-19

Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives

#86
20100203679
2010-08-12

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post

#87
20100193830
2010-08-05

Semiconductor chip assembly with post/base heat spreader and dual adhesives

#88
20100190297
2010-07-29

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

#89
20100188852
2010-07-29

Illumination device with semiconductor light-emitting elements

#90
20100188848
2010-07-29

ELECTRO-THERMAL SEPARATION LIGHT EMITTING DIODE LIGHT ENGINE MODULE

#91
20100181594
2010-07-22

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST

#92
20100167438
2010-07-01

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

#93
20100167436
2010-07-01

Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post

#94
20100163921
2010-07-01

Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace

#95
20100155768
2010-06-24

Semiconductor chip assembly with post/base heat spreader and cavity in post

#96
20100149765
2010-06-17

Chassis base and plasma display apparatus having the same

#97
20100139088
2010-06-10

Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device

#98
20100103622
2010-04-29

ELECTRONIC CONTROL DEVICE

#99
20100096662
2010-04-22

Semiconductor chip assembly with post/base heat spreader and signal post

#100
20100087020
2010-04-08

Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader

#101
20100075448
2010-03-25

Method of making a semiconductor chip assembly with a post/base/cap heat spreader

#102
20100072511
2010-03-25

SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER

#103
20100072510
2010-03-25

Semiconductor chip assembly with post/base/cap heat spreader

#104
20100072505
2010-03-25

LED interconnect assembly

#105
20100071936
2010-03-25

Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity

#106
20100059786
2010-03-11

Semiconductor chip assembly with post/base heat spreader and substrate

#107
20100055812
2010-03-04

Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace

#108
20100055811
2010-03-04

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate

#109
20100052005
2010-03-04

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

#110
20100046201
2010-02-25

Electronic Assembly and Backlight Module

#111
20100003787
2010-01-07

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

#112
20100001309
2010-01-07

Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

#113
20100000766
2010-01-07

Printed circuit board assembly

#114
20090279276
2009-11-12

Electronic component

#115
20090268434
2009-10-29

Illumination system, electro-optic device, and electronic apparatus

#116
20090236707
2009-09-24

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

#117
20090225544
2009-09-10

Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal

#118
20090223707
2009-09-10

Mutual capacitance and magnetic field distribution control for transmission lines

#119
20090159905
2009-06-25

Light emitting assembly

#120
20090129076
2009-05-21

Illumination device comprising a heat sink

#121
20090122495
2009-05-14

Device mounting structure and device mounting method

#122
20090116252
2009-05-07

THERMAL SURFACE MOUNTING OF MULTIPLE LEDS ONTO A HEATSINK

#123
20090097209
2009-04-16

Driver module structure

#124
20090079061
2009-03-26

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

#125
20090040368
2009-02-12

Image sensor module for camera device

#126
20080297686
2008-12-04

Liquid crystal module

#127
20080278917
2008-11-13

HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME

#128
20080257590
2008-10-23

HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF

#129
20080253090
2008-10-16

Ic Component Comprising a Cooling Arrangement

#130
20080205057
2008-08-28

LIGHT SOURCE DEVICE ASSEMBLY

#131
20080174969
2008-07-24

Printed Board Assembly With Improved Heat Dissipation

#132
20080165511
2008-07-10

Control device and method of manufacturing thereof

#133
20080151506
2008-06-26

Printed circuit board having vertical heat dissipating element

#134
20080144315
2008-06-19

Backlighting apparatus and manufacturing process

#135
20080128739
2008-06-05

Illumination device with semiconductor light-emitting elements

#136
20080123299
2008-05-29

Circuit Device and Manufacturing Method of the Same

#137
20080116567
2008-05-22

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

#138
20080080142
2008-04-03

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

#139
20070297155
2007-12-27

Integrated circuit chip thermal solution

#140
20070290328
2007-12-20

Light emitting diode module

#141
20070290307
2007-12-20

Light emitting diode module

#142
20070279873
2007-12-06

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

#143
20070277999
2007-12-06

Circuit board and electrical connection box having the same

#144
20070268703
2007-11-22

Heat dissipation component and diode lighting and/or signalling device equipped with a component of this type

#145
20070267642
2007-11-22

Light-emitting devices and methods for manufacturing the same

#146
20070252270
2007-11-01

Circuit Apparatus

#147
20070188692
2007-08-16

Driver module structure with flexible circuit board

#148
20070165385
2007-07-19

Support structure of electronic device and hard disk drive comprising the same

#149
20070164766
2007-07-19

Circuit device

#150
20070126112
2007-06-07

Metal core, package board, and fabricating method thereof

#151
20070126093
2007-06-07

High thermal conducting circuit substrate and manufacturing process thereof

#152
20070076388
2007-04-05

Built-in capacitor type power feed device to power pins of electrical component

#153
20070075431
2007-04-05

Power feed device to power pins of electrical component

#154
20070044999
2007-03-01

Circuit board and circuit apparatus using the same

#155
20070023202
2007-02-01

Circuit board and circuit apparatus using the same

#156
20070018311
2007-01-25

Circuit board and light souce device having same

#157
20060274512
2006-12-07

Circuit assembly with surface-mount IC package and heat sink

#158
20060268580
2006-11-30

Backlight module

#159
20060250270
2006-11-09

System and method for mounting a light emitting diode to a printed circuit board

#160
20060133043
2006-06-22

Heat spreader with multiple stacked printed circuit boards

#161
20060133042
2006-06-22

Electronic module for system board with pass-thru holes

#162
20060133041
2006-06-22

Processor module for system board

#163
20060133040
2006-06-22

Multi-chip module with power system and pass-thru holes

#164
20060108690
2006-05-25

Circuit board with reduced simultaneous switching noise

#165
20060104034
2006-05-18

Heat-dissipating device

#166
20060098441
2006-05-11

Backlight module

#167
20060098416
2006-05-11

Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights

#168
20060087768
2006-04-27

Method and apparatus for electrically coupling a slider to a wireless suspension substrate

#169
20060077643
2006-04-13

Control device and method of manufacturing thereof

#170
20060000877
2006-01-05

Method for fabricating electrical connection structure of circuit board

#171
20050221537
2005-10-06

Plastic packaging with high heat dissipation and method for the same

#172
20050206357
2005-09-22

Cooled power switching device

#173
20050158916
2005-07-21

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

#174
20050152118
2005-07-14

Device to cool integrated circuit element and disk drive having the same

#175
20050105277
2005-05-19

Power unit comprising a heat sink, and assembly method

#176
20050073044
2005-04-07

Plastic packaging with high heat dissipation and method for the same