234450 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Substrate related Raised area or protrusion of metal substrate
SUBSTRATE STRUCTURE
#2Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board
#3SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
#4Heat sink with protrusions on multiple sides thereof and apparatus using the same
#5Heat sink with protrusions on multiple sides thereof and apparatus using the same
#6LED lamp having metal PCB bent polyhedrally and manufacturing method thereof
#7Heat sink with protrusions on multiple sides thereof and apparatus using the same
#8Method for controlling the assembly of a printed circuit board by riveting
#9Method for manufacturing flexible printed circuit board
#10Mounting assembly with a heatsink
#11Metallic nano structure, method of fabricating the same, and electrical apparatus having the same
#12Printed wiring board and camera module
#13Mounting structure, method for manufacturing mounting structure, and radio device
#14Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
#15Stretchable circuit board and method for manufacturing stretchable circuit board
#16Metal PCB assembly for vehicle lamp and manufacturing method thereof
#17Flexible circuit board and display apparatus
#18Heat sink with protrusions on multiple sides thereof and apparatus using the same
#19Air mixing methodology and system to reduce the temperature of LEDs of a photocatalytic reactor
#20High current switch
#21Preparation method of a boss-type metal-based sandwich rigid-flex circuit board
#22Radio frequency connection arrangement
#23Wiring substrate and semiconductor package
#24Circuit board and lighting device having the circuit board
#25Semiconductor light emitting device comprising cut-and-bent portions
#26Optical module
#27Chip support board structure
#28Method of manufacturing a chip support board structure
#29Designs and Fabrication Processes of a Heatsink
#30Circuit board, electronic device, and method of manufacturing circuit board
#31Circuit board assembly with flexible circuit board and reinforcing plate
#32Method of making a heat radiating structure for high-power LED
#33Radiant heat circuit board, heat generating device package having the same, and backlight unit
#34Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
#35LED PACKAGE MODULE
#36Semiconductor light emitting module comprising an exposed plate surface
#37Circuit board
#38MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MULTICHIP MODULE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
#39Circuit board with thermo-conductive pillar
#40Electronic control unit and method of manufacturing the same
#41Hybrid solid state emitter printed circuit board for use in a solid state directional lamp
#42Method of producing an enhanced base plate
#43Micro and millimeter waves circuit
#44Mutual capacitance and magnetic field distribution control for transmission lines
#45Illumination device with semiconductor light-emitting elements
#46OPTICAL MODULE
#47Illumination system, electro-optic device, and electronic apparatus
#48MANUFACTURING METHOD OF CIRCUIT BOARD
#49Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
#50ELECTRONIC CONTROL DEVICE
#51METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE
#52Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
#53METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE
#54SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER
#55Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
#56Printed Circuit Board with Embossed Hollow Heatsink Pad
#57Semiconductor chip assembly with post/base heat spreader with thermal via
#58Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#59Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#60Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
#61Illumination device with semiconductor light-emitting elements
#62LIGHT EMITTING DIODE AND LIGHT SOURCE MODULE HAVING SAME
#63Semiconductor chip assembly with post/base heat spreader and plated through-hole
#64Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump
#65SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP
#66Light emitting diode module and method for making the same
#67HEAT/ELECTRICITY DISCRETE METAL CORE-CHIP ON BOARD MODULE
#68SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS
#69Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
#70IMAGE SENSOR MODULE FOR CAMERA DEVICE
#71LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
#72ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS
#73Method of making a semiconductor chip assembly with a post/base/post heat spreader
#74Semiconductor chip assembly with post/base/post heat spreader
#75SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME
#76Semiconductor chip assembly with post/base heat spreader with ESD protection layer
#77Solid state light fixture with enhanced thermal cooling and color mixing
#78METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE
#79LED ILLUMINATION DEVICE
#80Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
#81Solid state light unit and heat sink, and method for thermal management of a solid state light unit
#82Structure for mounting semiconductor package
#83ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME
#84Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#85Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
#86Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
#87Semiconductor chip assembly with post/base heat spreader and dual adhesives
#88Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
#89Illumination device with semiconductor light-emitting elements
#90ELECTRO-THERMAL SEPARATION LIGHT EMITTING DIODE LIGHT ENGINE MODULE
#91SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST
#92Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
#93Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post
#94Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
#95Semiconductor chip assembly with post/base heat spreader and cavity in post
#96Chassis base and plasma display apparatus having the same
#97Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device
#98ELECTRONIC CONTROL DEVICE
#99Semiconductor chip assembly with post/base heat spreader and signal post
#100Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader
#101Method of making a semiconductor chip assembly with a post/base/cap heat spreader
#102SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER
#103Semiconductor chip assembly with post/base/cap heat spreader
#104LED interconnect assembly
#105Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity
#106Semiconductor chip assembly with post/base heat spreader and substrate
#107Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
#108Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate
#109SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE
#110Electronic Assembly and Backlight Module
#111Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
#112Semiconductor chip assembly with post/base heat spreader and horizontal signal routing
#113Printed circuit board assembly
#114Electronic component
#115Illumination system, electro-optic device, and electronic apparatus
#116ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
#117Enamel substrate for mounting light emitting elements, light emitting element module, illumination apparatus, display apparatus, and traffic signal
#118Mutual capacitance and magnetic field distribution control for transmission lines
#119Light emitting assembly
#120Illumination device comprising a heat sink
#121Device mounting structure and device mounting method
#122THERMAL SURFACE MOUNTING OF MULTIPLE LEDS ONTO A HEATSINK
#123Driver module structure
#124Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#125Image sensor module for camera device
#126Liquid crystal module
#127HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME
#128HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF
#129Ic Component Comprising a Cooling Arrangement
#130LIGHT SOURCE DEVICE ASSEMBLY
#131Printed Board Assembly With Improved Heat Dissipation
#132Control device and method of manufacturing thereof
#133Printed circuit board having vertical heat dissipating element
#134Backlighting apparatus and manufacturing process
#135Illumination device with semiconductor light-emitting elements
#136Circuit Device and Manufacturing Method of the Same
#137Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
#138ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING
#139Integrated circuit chip thermal solution
#140Light emitting diode module
#141Light emitting diode module
#142Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#143Circuit board and electrical connection box having the same
#144Heat dissipation component and diode lighting and/or signalling device equipped with a component of this type
#145Light-emitting devices and methods for manufacturing the same
#146Circuit Apparatus
#147Driver module structure with flexible circuit board
#148Support structure of electronic device and hard disk drive comprising the same
#149Circuit device
#150Metal core, package board, and fabricating method thereof
#151High thermal conducting circuit substrate and manufacturing process thereof
#152Built-in capacitor type power feed device to power pins of electrical component
#153Power feed device to power pins of electrical component
#154Circuit board and circuit apparatus using the same
#155Circuit board and circuit apparatus using the same
#156Circuit board and light souce device having same
#157Circuit assembly with surface-mount IC package and heat sink
#158Backlight module
#159System and method for mounting a light emitting diode to a printed circuit board
#160Heat spreader with multiple stacked printed circuit boards
#161Electronic module for system board with pass-thru holes
#162Processor module for system board
#163Multi-chip module with power system and pass-thru holes
#164Circuit board with reduced simultaneous switching noise
#165Heat-dissipating device
#166Backlight module
#167Electronic assembly with a heat sink in particular for a discharge lamp control module for motor vehicle headlights
#168Method and apparatus for electrically coupling a slider to a wireless suspension substrate
#169Control device and method of manufacturing thereof
#170Method for fabricating electrical connection structure of circuit board
#171Plastic packaging with high heat dissipation and method for the same
#172Cooled power switching device
#173Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink
#174Device to cool integrated circuit element and disk drive having the same
#175Power unit comprising a heat sink, and assembly method
#176Plastic packaging with high heat dissipation and method for the same