ClassID:

234456

H05K2201/09109 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Substrate related Locally detached layers, e.g. in multilayer

Recent Application in this class:
#1
20250203764
2025-06-19

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

#2
20240224417
2024-07-04

Method for producing a carrier arrangement

#3
20220322518
2022-10-06

Device having circuit members between overlapping sealing members

#4
20220095450
2022-03-24

CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT

#5
20200084883
2020-03-12

Protective film of conductive adhesive, circuit board, and method for assembling display device

#6
20190020138
2019-01-17

Pocket connector

#7
20180277956
2018-09-27

Orthogonally polarized dual frequency co-axially stacked phased-array patch antenna apparatus and article of manufacture

#8
20180103538
2018-04-12

Tamper-respondent assemblies with bond protection

#9
20170352960
2017-12-07

Orthogonally polarized dual frequency co-axially stacked phased-array patch antenna apparatus and article of manufacture

#10
20170305741
2017-10-26

Deformable apparatus and method

#11
20170303401
2017-10-19

Hybrid printed circuit assembly with low density main core and embedded high density circuit regions

#12
20170265298
2017-09-14

Self-decap cavity fabrication process and structure

#13
20150282304
2015-10-01

Flexible printed circuits with bend retention structures

#14
20150131253
2015-05-14

Multilayer ceramic electronic component and board having the same mounted thereon

#15
20150070840
2015-03-12

Flexible printed circuit cables with service loops and overbending prevention

#16
20140305683
2014-10-16

Compact rigid-flexible printed circuit board and method for manufacturing same

#17
20130319732
2013-12-05

Multi-layer microwave corrugated printed circuit board and method

#18
20130256004
2013-10-03

Deformable apparatus and method

#19
20120061023
2012-03-15

Implementing interleaved-dielectric joining of multi-layer laminates

#20
20120055702
2012-03-08

Compliant printed flexible circuit

#21
20110214905
2011-09-08

Circuit board with flexible region and method for production thereof

#22
20110143625
2011-06-16

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

#23
20110139329
2011-06-16

Thin multi-chip flex module

#24
20110138617
2011-06-16

Thin multi-chip flex module

#25
20110124155
2011-05-26

Hybrid structure of multi-layer substrates and manufacture method thereof

#26
20110124154
2011-05-26

Hybrid structure of multi-layer substrates and manufacture method thereof

#27
20110116244
2011-05-19

Thin multi-chip flex module

#28
20110094790
2011-04-28

Flexible flat circuit cable with gapped section

#29
20110024160
2011-02-03

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

#30
20110005811
2011-01-13

METHOD OF MANUFACTURING RIGID-FLEX CIRCUIT BOARD, AND THE RIGID-FLEX CIRCUIT BOARD

#31
20100330830
2010-12-30

Vertical probe intrface system

#32
20100282497
2010-11-11

CIRCUIT BOARD

#33
20100263462
2010-10-21

Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder

#34
20100232115
2010-09-16

Electronic circuit device

#35
20100202119
2010-08-12

STRUCTURE FOR FIXING FLEXIBLE WIRING BOARD

#36
20100143848
2010-06-10

Patterning methods for stretchable structures

#37
20100084727
2010-04-08

Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device

#38
20100051326
2010-03-04

FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE

#39
20100026952
2010-02-04

Display device and method for manufacturing same

#40
20090317048
2009-12-24

Electrical and optical hybrid film, and electronic apparatus receiving the same

#41
20090314524
2009-12-24

Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof

#42
20090273076
2009-11-05

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

#43
20090168374
2009-07-02

Thin multi-chip flex module

#44
20090168366
2009-07-02

Thin multi-chip flex module

#45
20090168363
2009-07-02

Thin multi-chip flex module

#46
20090168362
2009-07-02

Thin multi-chip flex module

#47
20090166065
2009-07-02

Thin multi-chip flex module

#48
20090161022
2009-06-25

Wiring board with groove in which wiring can move, image display apparatus, and image reproducing apparatus

#49
20090133906
2009-05-28

FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#50
20080289860
2008-11-27

Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board

#51
20080150657
2008-06-26

Tunable high impedance surface device

#52
20080138575
2008-06-12

Hybrid structure of multi-layer substrates and manufacture method thereof

#53
20080137317
2008-06-12

Method and system for angled RF connection using a flexible substrate

#54
20080136021
2008-06-12

Method of manufacturing hybrid structure of multi-layer substrates

#55
20070262447
2007-11-15

Circuit board, method for manufacturing the same, and semiconductor device

#56
20070202306
2007-08-30

Connection configuration for rigid substrates

#57
20070187139
2007-08-16

Bus structure

#58
20070145587
2007-06-28

SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

#59
20070123078
2007-05-31

Foldable information processing apparatus having protected crank-type structured flexible printed circuit board

#60
20070095562
2007-05-03

Flexible circuit board with reinforcing board

#61
20070062722
2007-03-22

Hinge board and method for producing the same

#62
20070012555
2007-01-18

Membrane switch

#63
20060213683
2006-09-28

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

#64
20060198994
2006-09-07

Ceramic circuit substrate and manufacturing method thereof

#65
20060193970
2006-08-31

Rigid flexible printed circuit board and method of fabricating same

#66
20060116005
2006-06-01

Reinforced flexible printed circuit board

#67
20060048969
2006-03-09

Bus structure

#68
20060019075
2006-01-26

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

#69
20050112910
2005-05-26

Apparatus for deforming flexible cable sections extending between rigid printed circuit boards