234457 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Substrate related Moulded substrate
ELECTRONIC DEVICE
#2SMART CONNECTOR AND METHOD OF MANUFACTURING SAME USING AN APPLICATION SPECIFIC ELECTRONICS PACKAGING MANUFACTURING PROCESS
#3PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
#4PATTERNED CONDUCTIVE ARTICLE
#5PRINTED CIRCUIT BOARD
#6Molded article, electrical product and method for producing molded article
#7BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
#8Electronic apparatus
#9Component carrier for arranging electrical components on a circuit board
#10CONNECTION MECHANISMS FOR COUPLING PRINTED CIRCUIT BOARD MODULES TO A RING IN AN AUTOMATED AND/OR MOTORIZED SPATIAL FRAME
#11Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object
#12Printed circuit board
#13METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
#14Patterned article including electrically conductive elements
#15Illumination assembly including thermal energy management
#16Patterned conductive article
#17Imaging device for connection with a circuit element
#18System for manufacturing an electromechanical structure
#19Mechanical support within moulded chip package
#20IMAGE SENSOR PACKAGES
#21Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#22Adapter board and method for making adapter board
#23Smart connector and method of manufacturing same using an application specific electronics packaging manufacturing process
#24Device and method for molding an FPC and a plastic part
#25Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
#26Electronic Device
#27Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
#28ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
#29Component carrier with embedded interposer laterally between electrically conductive structures of stack and method for manufacturing the component carrier
#30Application specific electronics packaging systems, methods and devices
#31System for manufacturing an electromechanical structure
#32Application specific electronics packaging systems, methods and devices
#33Camera module and molded circuit board assembly and manufacturing method thereof
#34Resin molded substrate and mounting structure for capacitor
#35Micro power distribution boxes and methods of manufacturing same using application specific electronics packaging techniques
#36Thermally enhanced semiconductor package with at least one heat extractor and process for making the same
#37System for manufacturing an electromechanical structure
#38Packaged semiconductor device
#39Molded circuit substrates
#40Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#41Control unit
#42Application specific electronics packaging systems, methods and devices
#43Packaged semiconductor device
#44Embedded high voltage transformer components and methods
#45Molded interconnect substrate for a cable assembly
#46Control unit
#47Component carrier for electrical/electronic parts for attachment in a motor vehicle door lock
#48Multilayer structure with embedded multilayer electronics
#49Molded interconnect device
#50Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
#51Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
#52Apparatus for making wiring board
#53PCB Assembly with Molded Matrix Core
#54Method for manufacturing an electromechanical structure and an arrangement for carrying out the method
#55Multi-planar circuit board having reduced z-height
#56Arrayed embedded magnetic components and methods
#57Surface treatment patterns to reduce radar reflection and related assemblies and methods
#58Molded Circuit Substrates
#59System for carrying out a manufacturing method on an electro chemical structure
#60Methods and apparatus for a substrate core layer
#61Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor
#62Systems and methods for assembling LED connector boards
#63Application specific electronics packaging systems, methods and devices
#64Wiring substrate and electronic component device
#65Semiconductor device and semiconductor device manufacturing method
#66Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
#67Illuminated structure and related method of manufacture
#68Method for manufacturing an electromechanical structure
#69Circuit structure
#70Method for manufacturing a printed circuit board
#71Compact microelectronic integrated gas sensor
#72Connection structure and image pickup apparatus
#73Integrated copper bar for secondary power circuit of power electronic converter
#74LED DEVICE
#75Method for manufacturing an arrangement comprising a housing part and at least two conductor paths
#76Fabrication method of circuit structure
#77Camera module with compression-molded circuit board and manufacturing method thereof
#78Method for manufacturing wiring circuit component, mold for manufacturing wiring circuit component, and resinous wiring circuit component
#79Electronic package
#80Plastic component with at least one electrical contact element and method for the manufacture thereof
#81Package structure and manufacturing method of package structure
#82Electronic power module, electronic architecture comprising same, voltage converter and electric machine comprising same
#83Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#84Method for utilizing surface mount technology on plastic substrates
#85Semiconductor structure
#86THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAME
#87Package structure
#88Method for manufacturing an electromechanical structure
#89Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object
#90LAMINATED ELECTRICAL TRACE WITHIN AN LED INTERCONNECT
#91Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#92Electronic control device and production method thereof
#93Method for gapping an embedded magnetic device
#94Package structure
#95Light source unit
#96Insert-moulded lead frame and method for the production thereof
#97Circuit board assembly, control device for a cooler fan module and method
#98Multilayer structure for accommodating electronics and related method of manufacture
#99Manufacturing method of substrate structure having embedded interconnection layers
#100Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#101Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#102Housing for electronic circuit unit
#103Methods and devices for improved space utilization in wafer based modules
#104Methods for assembling LED connector board
#105Method for manufacturing an electric product
#106Method of manufacture an electric circuit
#107Electroplated plastic chassis for electronic device
#108Arrayed embedded magnetic components and methods
#109Embedded magnetic components and methods
#110OLED diode support with elastic connection blades
#111Compact microelectronic integrated gas sensor
#112Carrier of one or more light-emitting diodes (LEDS) for a signaling module
#113Structure, wireless communication device and method for manufacturing structure
#114Package substrate structure
#115Method of forming metallic pattern on polymer substrate
#116Circuit structure and fabrication method thereof
#117Power semiconductor device
#118Laminated electrical trace within an LED interconnect
#119Electronic device and manufacturing method for same
#120Injection moulded circuit carrier having an integrated circuit board
#121Motor vehicle component support and method for the production thereof
#122Capacitive transparent touch sheet having excellent visibility and durability
#123LED device
#124Method for manufacturing a three dimensional stretchable electronic device
#125Injection molded product and method of manufacturing the same
#126Ecological method for constructing circuit boards
#127Thermoplastic composition
#128CORE OF PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#129Metalized plastic articles and methods thereof
#130High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof
#131Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound
#132Method for manufacturing three-dimensional integrated circuit
#133Aromatic polycarbonate composition
#134Circuit board assembly using metal plates as conducting medium embedded therein
#135Protection circuit module integrated cap assembly, and method of manufacturing cap assembly and secondary battery
#136Plug and method for producing same
#137Method for the production of a component or a structural part on-board a vehicle adapted to integrate electrical devices and connections, and composite material for the realization of said component or structural part
#138Mounting structure of chip component and electronic module using the same
#139Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer
#140Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
#141Three-dimensional circuit component, method of making the same, and physical-quantity measuring instrument
#142Mount board and electronic device
#143Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer
#144Assembly having a substrate, an SMD component, and a lead frame part
#145Method for making electrically conductive three-dimensional structures
#146Methods and Apparatus for a Substrate Core Layer
#147Substrate structure, semiconductor package device, and manufacturing method of substrate structure
#148Resin composition, molded object and substrate material both obtained from the resin composition, and circuit board including the substrate material
#149Method for improving plating on non-conductive substrates
#150Electrical interconnects in an electronic contact lens
#151Thermoplastic composition for use in forming a laser direct structured substrate
#152PROTECTIVE CIRCUIT MODULE AND BATTERY PACK HAVING THE SAME
#153Package carrier for a microelectronic element
#154INTERPOSER, CIRCUIT BOARD MODULE, AND METHOD FOR MANUFACTURING INTERPOSER
#155METHOD FOR FORMING CIRCUITS ON HOUSING BY SPRAYING AND LASER ENGRAVING
#156INDUCTIVE ROTATION ANGLE SENSOR AND METHOD OF MOUNTING THE SAME
#157SEMICONDUCTOR LIGHT-EMITTING ELEMENT MOUNTING MODULE, SEMICONDUCTOR LIGHT-EMITTING ELEMENT MODULE, MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT MOUNTING MODULE, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT-EMITTING ELEMENT MODULE
#158Three-Dimensionally Molded Electronic Substrate
#159BOARD AND METHOD FOR MANUFACTURING BOARD
#160SUBSTRATE AND SUBSTRATE PRODUCTION METHOD
#161CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE
#162Aromatic polycarbonate composition
#163AROMATIC POLYCARBONATE COMPOSITION
#164Electrical component of a motor vehicle
#165COUPLING DEVICE, ASSEMBLY HAVING A COUPLING DEVICE, AND METHOD FOR PRODUCING AN ASSEMBLY HAVING A COUPLING DEVICE
#166SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE
#167Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#168METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEVICE PRODUCED BY THIS METHOD
#169Metalized plastic articles and methods thereof
#170Wiring substrate, electronic device, and method of manufacturing wiring substrate
#171Circuit carrier and method for producing a circuit carrier
#172Method for Providing Inductively Coupled Radio Frequency Identification (RFID) Transponder, and RFID Transponder
#173Method of fabricating circuit board structure
#174Stretchable electronic device
#175Stretchable electronic device
#176Metalized plastic articles and methods thereof
#177Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition
#178MICRO SENSING APPARATUS
#179Methods for Plating Plastic Articles
#180Package carrier for enclosing at least one microelectronic device
#181Method of manufacturing three-dimensional circuit device
#182EXTERIOR DOOR HANDLE, PARTICULARLY FOR VEHICLES, AND METHOD FOR THE PRODUCTION THEREOF
#183Semicondutor device package placed within fitting portion of wiring member and attached to heat sink
#184MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE
#185Mount board and electronic device
#186Functional panel and method for joining same
#187Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
#188Method for improving plating on non-conductive substrates
#189Electrical device having boardless electrical component mounting arrangement
#190POLYMER MOLDED BODIES AND PRINTED CIRCUIT BOARD ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
#191Semiconductor device and method of manufacturing the same
#192ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME
#193Electric circuit configuration having an MID circuit carrier and a connecting interface connected to it
#194FPC-Based Relay Connector
#195Circuit board and semiconductor module
#196Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#197Low cost key actuators and other switching device actuators manufactured from conductive loaded resin-based materials
#198Low cost housings for vehicle mechanical devices and systems manufactured from conductive loaded resin-based materials
#199ELECTRICAL CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND METALLIC MOLD
#200Carrier Structure for Electronic Components and Fabrication Method of the same
#201Vehicle lamp with polymer conductors and mounting structures
#202Electrical device and method of manufacturing thereof
#203Plastic articles, optionally with partial metal coating
#204Metal core multi-LED SMD package and method of producing the same
#205Low cost electrical terminals manufactured from conductive loaded resin-based materials
#206IMPROVEMENTS IN AND RELATING TO MANUFACTURE OF ELECTRICAL CIRCUITS FOR ELECTRICAL COMPONENTS
#207Voice output unit
#208METHOD OF MANUFACTURING MAGENTIC BODY
#209METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE PATH ON A PLASTIC COMPONENT
#210Resin-molded article fit with a metal plate
#211Method for producing a ceramic compact
#212Multilayer three-dimensional circuit structure and manufacturing method thereof
#213METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT AND CONTACTING ELEMENT WITH AN ELECTRICAL COMPONENT
#214Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part
#215METHOD FOR MANUFACTURING THREE-DIMENSIONAL CIRCUIT
#216LED interconnect assembly
#217Electrical connection of components
#218Product with internal cavities, and method, system and mould for manufacturing such a product
#219CIRCUIT BOARD STRUCTURE
#220Method of making a molded interconnect device
#221Method for making a supporting body for the lock of a motor vehicle, and a supporting body thus obtained
#222Method for Applying Electrical Conductor Patterns to a Target Component of Plastic
#223Printed circuit board with embedded electronic components and methods for the same
#224Icemaker
#225Process for Preventing Plating on a Portion of a Molded Plastic Part
#226Monolithic molded flexible electronic assemblies without solder and methods for their manufacture
#227Grouped element transmission channel link with pedestal aspects
#228Heat dissipating wiring board and method for manufacturing same
#229Icemaker control module
#230Three-dimensional plated support frame
#231Circuit arrangements and associated apparatus and methods
#232Overmolded circuit board and method
#233Portable electronic device and transferring method of circuit element thereof
#234Molded circuit component and process for producing the same
#235Process for Producing Circuit Substrate and Circuit Substrate Obtained in Accordance With the Process
#236Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#237Methods for manufacturing magnetic components
#238Luminous module and method for producing it
#239Case structure having conductive pattern and method of manufacturing the same
#240Printed circut board for population with surface-mounted devices and also method therefor
#241Method for producing ceramic compact and ceramic part
#242Hybrid antenna structure
#243Mount Board and Electronic Device
#244Method for Forming Electroconductive Circuit
#245Molded card edge connector for attachment with a printed circuit board
#246Electric sub-assembly
#247Electronic Device, a Housing Part, and a Method of Manufacturing a Housing Part
#248Process for manufacturing a cover
#249Method of manufacturing a package carrier
#250Motor drive circuit and outdoor unit for air conditioner
#251System for attaching electronic components to molded interconnection devices
#252Printed circuit board for fitting with a punched grid
#253Single Side Package Memory Card
#254High-current traces on plated molded interconnect device
#255Resin molded component fitted with a metal plate and molding method therefor
#256Grouped element transmission channel link with pedestal aspects
#257Sun sensor using MID technology
#258Method for Making Electrically Conductive Three-Dimensional Structures
#259Electrical device having boardless electrical component mounting arrangement
#260Method for producing liquid crystal polymer molded article
#261THREE-DIMENSIONAL CIRCUIT BOARD AND FINGERPRINT SENSOR DEVICE
#262Method for forming a molded circuit board
#263PROCESS FOR MANUFACTURING A HYBRID ELECTRICAL COMPONENT
#264Method for manufacturing a miniaturized three-dimensional electric component
#265Metal carrier for LEDs in composite lamps
#266Thin multichip flex-module
#267Molded high impedance surface
#268Electriplast moldable composite capsule
#269Method for manufacturing a three dimensional circuit board
#270Metal-coated resin molded article and production method therefor
#271Resin molded article with reduced dielectric loss tangent and production method therefor
#272Injection molding method with surface modification
#273Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component
#274Electrical circuit pattern design by injection mold
#275Integration of functional layers in or on transparent plastic parts for vehicle manufacture
#276Wiring board, method of manufacturing wiring board, and liquid ejection head
#277Electronic device and method of manufacturing thereof
#278In mold manufacturing of an object comprising a functional element
#279Magnetic components
#280Methods for manufacturing optical modules having an optical sub-assembly
#281Mounting light emitting diodes
#282Method of manufacturing wiring board, and liquid ejection head having wiring board
#283Forming conductive traces
#284Control circuit device for motor, method for manufacturing the device, and motor having the device
#285Method of preparing a metal-silicone rubber composite
#286Transceiver module having a dual segment lead frame connector
#287Component mounting board structure and production method thereof
#288Molded lead frame connector with mechanical attachment members
#289Molded lead frame connector with one or more passive components
#290Flame-retardant resin composition and flame retardant resin molded item
#291Method of manufacture of ceramic composite wiring structures for semiconductor devices
#292Connector having a built-in electronic part
#293Method and apparatus for forming a metallic feature on a substrate
#294Electronic product, a body and a method of manufacturing
#295Forming electrical cables
#296Securing electrical conductors
#297SD/MMC cards
#298Method of overmolding circuit
#299Gas bag module
#300Optical transceiver module having a dual segment molded lead frame connector