234465 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Edge details Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
Localized Soldering U&C Shape with Metal Pin Design
#2DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS
#3MODULE
#4Devices and methods related to metallization of ceramic substrates for shielding applications
#5Optical module and method for manufacturing the same
#6Electronic component
#7Communication module
#8Module and method for manufacturing the same
#9Methods related to metallization of ceramic substrates for shielding applications
#10Interconnection including a hybrid cable assembly and a circuit board assembly
#11Optical module and method for manufacturing the same
#12Display device and method for manufacturing same
#13Printed circuit board with embedded lateral connector
#14Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
#15Power module assembly structure
#16Printed circuit board with embedded lateral connector
#17Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards
#18High-frequency module
#19Display device and method for manufacturing same
#20Electromagnetic shield structure for electronic device
#21Flexible flat cable
#22Structure for connecting board and connector, board, and method for connecting board and connector
#23Signal transmission component and electronic device
#24EMI shielding structure
#25Integrated circuit chip packaging including a heat sink topped cavity
#26Transmission line cable
#27Package structure and manufacturing method of package structure
#28Printed circuit board and display device including the same
#29Redirection of electromagnetic signals using substrate structures
#30High-frequency signal line and manufacturing method thereof
#31Semiconductor structure
#32Cable connection structure and endoscope device
#33Package structure
#34Electromagnetic shield structure for electronic device
#35Package structure
#36Printed circuit board with embedded electronic component and manufacturing method thereof
#37High-frequency module
#38Printed circuit board having electronic component embedded
#39Flexible circuit assembly and method therof
#40Devices and methods related to metallization of ceramic substrates for shielding applications
#41Signal transmission component and electronic device
#42Package-in-substrate, semiconductor device and module
#43Package substrate structure
#44Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board
#45Board assembly for transmitting high-speed signal and method of manufacturing the same
#46Embedded printed circuit board
#47Manufacturing method of part-mounting package
#48Wiring substrate, manufacturing method therefor, and semiconductor package
#49ESD protection device
#50Substrate for semiconductor package and semiconductor package having the same
#51Method of manufacturing printed circuit board having electronic component embedded
#52Connection member, semiconductor device, and stacked structure
#53Multi-layer micro-wire substrate structure
#54High-frequency signal line and manufacturing method thereof
#55Electronic unit with a PCB and two housing parts
#56Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
#57Connector for multi-layered board
#58High-frequency module
#59Electronic device and fabrication method thereof
#60Wiring substrate and multi-piece wiring substrate
#61Printed circuit board comprising an electrode configuration of a capacitive sensor
#62Electronic module and method for same
#63Golden finger and board edge interconnecting device
#64Wiring board, manufacturing method for wiring board, and image pickup apparatus
#65Wiring board
#66Printed wiring board assembly and related methods
#67Multilayer wiring board
#68Redirection of electromagnetic signals using substrate structures
#69SYSTEM IN PACKAGE MODULE AND METHOD OF FABRICATING THE SAME
#70Systems and methods for providing vias through a modular component
#71PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
#72Switch structure on sidewall of circuit board for electronic device
#73Card edge connector
#74Module with exposed parts of copper foil and process for production thereof
#75Module board
#76Electronic device with edge surface antenna elements and related methods
#77Printed circuit boards with embedded components
#78SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
#79SIDE PACKAGED TYPE PRINTED CIRCUIT BOARD
#80PRINTED CIRCUIT BOARD
#81SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#82Hybrid structure of multi-layer substrates and manufacture method thereof
#83Hybrid structure of multi-layer substrates and manufacture method thereof
#84Circuit board, semiconductor device including the same, memory module, memory system, and manufacturing method of circuit board
#85Systems and methods for providing vias through a modular component
#86High-speed transmission circuit board connection structure
#87CIRCUIT BOARD AND METHOD FOR A LOW PROFILE WIRE CONNECTION
#88METHOD AND SYSTEM FOR ELECTRICALLY COUPLIING AN INFORMATION CARRIER TO A CONTACT ELEMENT
#89Semiconductor memory module and electronic component socket for coupling with the same
#90Switch device for use in electronic device
#91Semiconductor device and semiconductor device mounted structure
#92Voice output unit
#93INTERFERENCE SHIELDED ELECTRONICS MODULE AND METHOD FOR PROVIDING THE SAME
#94Edge connector
#95Electrical Interconnection System
#96Interconnect System without Through-Holes
#97Printed circuit board and manufacturing method therefor
#98Printed circuit board with improved via design
#99Electronic device with edge surface antenna elements and related methods
#100Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof
#101Circuit boards
#102Method of manufacturing wiring circuit board
#103Printed wiring board assembly and related methods
#104PRINTED CIRCUIT BOARD WITH EDGE MARKINGS
#105Producing method of wired circuit board
#106Electrical component with a sensor element, method for the encapsulation of a sensor element, and method for production of a plate arrangement
#107Multi-layered wiring substrate and method of manufacturing the same
#108MULTILAYER, THERMALLY-STABILIZED SUBSTRATE STRUCTURES
#109Method of forming a circuit board with improved via design
#110Covered multilayer module
#111METHOD FOR INDICATING QUALITY OF A CIRCUIT BOARD
#112Printed circuit board and manufacturing method thereof
#113Package substrate strip, metal surface treatment method thereof and chip package structure
#114Module board
#115PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY MODULE USING THE SAME
#116Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein
#117Hybrid structure of multi-layer substrates and manufacture method thereof
#118Method of manufacturing hybrid structure of multi-layer substrates
#119Method of manufacturing circuit board
#120Method of packaging a device using a dielectric layer
#121Wiring board
#122Printed circuit board for package and manufacturing method thereof
#123Printed Circuit Board With Improved Via Design
#124Light-emitting heat-dissipating device and packaging method thereof
#125Method of forming a printed circuit board with improved via design
#126Method for fabricating multi-layered printed circuit board without via holes
#127Side switch for a contact exposed on an edge of a circuit board and method
#128Component with Encapsulation Suitable for Wlp and Production Method
#129Rigid-flexible board and method for manufacturing the same
#130Circuit board and electrical connection box having the same
#131Integrated circuit chip packaging
#132Printed circuit board minimizing undesirable signal reflections in a via and methods therefor
#133Heat dissipation system for a miniaturized form factor communications card
#134Camera module, method of manufacturing the same, and printed circuit board for the camera module
#135Direct power delivery into an electronic package
#136Connection arrangement and method for optical communications
#137Printed circuit board having metal core
#138Circuit Board Manufacturing Technique and Resulting Circuit Board
#139Circuit board and method of manufacture thereof
#140Edge connector including internal layer contact, printed circuit board and electronic module incorporating same
#141Wiring pattern determination method and computer program product thereof
#142High density interconnect assembly comprising stacked electronic module
#143Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly
#144Connecting sheet
#145Circuit board device and method of interconnecting wiring boards
#146Method of manufacturing shielded electronic circuit units
#147Printed circuit board and manufacturing method therefor
#148Electronic module and method for the production thereof
#149Rechargeable battery, printed circuit board therefor, and method of fabricating the same
#150Single or multi-layer printed circuit board with improved edge via design
#151Metal-core substrate and apparatus utilizing the same
#152Edge connector including internal layer contact, printed circuit board and electronic module incorporating same
#153Method for making a neo-layer comprising embedded discrete components
#154Circuit boards, electronic devices, and methods of manufacturing thereof
#155Method of connecting internal silver traces to external gold to produce a gold external side metal for an LTCC package
#156Memory cards and method of fabricating the memory cards
#157Laminated ceramic substrate and manufacturing method therefor
#158Printed wiring board
#159Edge plated printed wiring boards
#160Method and structure for creating printed circuit boards with stepped thickness
#161Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
#162Connecting substrate, connecting structure. connection method and electronic apparatus
#163Multi-layered circuit board assembly with improved thermal dissipation
#164Method of making a circuit board
#165Method of forming printed circuit card
#166Board mounted heat sink using edge plating
#167Circuit board with quality-indicator mark and method for indicating quality of the circuit board
#168Fusion bonded assembly with attached leads
#169High-density connection between multiple circuit boards
#170Multilayer expansion card for electronic apparatus and relative production method
#171Interconnect system without through-holes
#172Method for manufacturing ceramic multilayer substrate
#173Single or multi-layer printed circuit board with improved via design
#174Stair step printed circuit board structures for high speed signal transmissions
#175Ceramic multilayer substrate and method for manufacturing the same
#176Card manufacturing technique and resulting card
#177Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device
#178Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof