H05K2201/09581 - CPC Classification Index

#1

20260068048

2026-03-05

PRINTED CIRCUIT BOARD

#2

20250254790

2025-08-07

GLASS CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND IMAGING DEVICE

#3

20250247957

2025-07-31

CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING THE SAME

#4

20250106997

2025-03-27

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

#5

20240404934

2024-12-05

THROUGH-HOLE ELECTRODE SUBSTRATE

#6

20240040699

2024-02-01

Electronic component and manufacturing method thereof

#7

20220246512

2022-08-04

Through-hole electrode substrate

#8

20220151069

2022-05-12

ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND ELECTRICAL INSPECTION METHOD

#9

20210259107

2021-08-19

Wiring substrate

#10

20200357733

2020-11-12

Through-hole electrode substrate

#11

20200315020

2020-10-01

Circuit assembly

#12

20200260594

2020-08-13

Creating in-via routing with a light pipe

#13

20200245466

2020-07-30

Thin film capacitors for core and adjacent build up layers

#14

20200152564

2020-05-14

Through-hole electrode substrate

#15

20190172780

2019-06-06

Through-hole electrode substrate

#16

20190150287

2019-05-16

Thin film capacitors for core and adjacent build up layers

#17

20190123413

2019-04-25

Non-reciprocal circuit element and method for manufacturing the same

#18

20190027405

2019-01-24

Substrate conductor structure and method

#19

20180301831

2018-10-18

Conductor connection structure of laminated wiring body

#20

20180277471

2018-09-27

Through-hole electrode substrate

#21

20180160525

2018-06-07

CIRCUIT BOARD DEVICE

#22

20180098428

2018-04-05

Non-planar on-package via capacitor

#23

20170290165

2017-10-05

Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet

#24

20160336223

2016-11-17

Substrate conductor structure and method

#25

20160329273

2016-11-10

Through-hole electrode substrate

#26

20160276257

2016-09-22

Through-hole electrode substrate and semiconductor device using through-hole electrode substrate

#27

20160259139

2016-09-08

Semiconductor device with optical and electrical vias

#28

20160135289

2016-05-12

Printed circuit board and method of manufacturing the same

#29

20160102404

2016-04-14

Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines

#30

20150357699

2015-12-10

Multilayer wiring plate and method for fabricating same

#31

20150342063

2015-11-26

Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines

#32

20140124258

2014-05-08

Printed circuit board and method of manufacturing the same

#33

20130341772

2013-12-26

Substrate conductor structure and method

#34

20130328214

2013-12-12

Through-hole electrode substrate

#35

20130269986

2013-10-17

Package carrier and manufacturing method thereof

#36

20130026653

2013-01-31

Method for manufacturing semiconductor device

#37

20120261801

2012-10-18

Wiring board, semiconductor device, and method for manufacturing wiring board

#38

20120234587

2012-09-20

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD UNIT, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

#39

20120180312

2012-07-19

CORE VIA FOR CHIP PACKAGE AND INTERCONNECT

#40

20120111726

2012-05-10

Sensor Element Having Through-Hole Plating

#41

20120077359

2012-03-29

Wiring structure having a plurality of circuit boards with an insulating sleeve in a terminal insertion hole

#42

20110249535

2011-10-13

METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE

#43

20110232953

2011-09-29

CIRCUIT BOARD AND STRUCTURE USING THE SAME

#44

20110194260

2011-08-11

SEMICONDUCTOR PACKAGE MODULE HAVING SELF-ASSEMBLED INSULATION THIN FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE MODULE

#45

20110131807

2011-06-09

Process for forming an isolated electrically conductive contact through a metal package

#46

20110102122

2011-05-05

Inductor and electric power supply using it

#47

20110094788

2011-04-28

PRINTED CIRCUIT BOARD WITH INSULATING AREAS

#48

20110056740

2011-03-10

Method of manufacturing a through-hole electrode substrate

#49

20110035939

2011-02-17

Method of manufacturing multilayer wiring board

#50

20100326716

2010-12-30

Core via for chip package and interconnect

#51

20100243311

2010-09-30

Substrate with metal film and method for manufacturing the same

#52

20100243305

2010-09-30

Method for manufacturing substrate with metal film

#53

20100193229

2010-08-05

Barrier layer to prevent conductive anodic filaments

#54

20100159193

2010-06-24

COMBINED ELECTRICAL AND FLUIDIC INTERCONNECT VIA STRUCTURE

#55

20100156997

2010-06-24

Drop generating apparatus

#56

20100118503

2010-05-13

Electric drive with a circuit board

#57

20100117779

2010-05-13

Inductor and electric power supply using it

#58

20100096750

2010-04-22

Packaging substrate

#59

20090225525

2009-09-10

Inductor and electric power supply using it

#60

20090224863

2009-09-10

Inductor and electric power supply using it

#61

20090095511

2009-04-16

Circuit board and method of producing the same

#62

20090095509

2009-04-16

CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME

#63

20090094825

2009-04-16

Method of producing substrate

#64

20090090548

2009-04-09

CIRCUIT BOARD AND FABRICATION METHOD THEREOF

#65

20090061182

2009-03-05

Composite substrate and method for manufacture thereof

#66

20080289178

2008-11-27

Process for forming an isolated electrically conductive contact through a metal package

#67

20080261396

2008-10-23

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

#68

20080164057

2008-07-10

Printed Wiring Board And Method Of Manufacturing Same

#69

20070257761

2007-11-08

Inductor and electric power supply using it

#70

20070240901

2007-10-18

Wiring board and method for fabricating the same

#71

20070181994

2007-08-09

Circuit board manufacturing method and circuit board

#72

20070169959

2007-07-26

Microelectronic device with mixed dielectric

#73

20070114653

2007-05-24

Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate

#74

20070020904

2007-01-25

Selectively filling microelectronic features

#75

20070009718

2007-01-11

Layered board and electronic apparatus having the layered board

#76

20060185141

2006-08-24

Method of manufacturing a multilayer wiring board

#77

20060175084

2006-08-10

Wiring board and method for fabricating the same

#78

20060096781

2006-05-11

Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same

#79

20060083904

2006-04-20

Wiring apparatus, protecting cap for device package using the same, and a method for manufacturing them

#80

20060068573

2006-03-30

Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus

#81

20060018588

2006-01-26

Layered board, and apparatus incorporated such layered board

#82

20050281008

2005-12-22

Extended thin film capacitor (TFC)

#83

20050263895

2005-12-01

Circuit device and manufacturing method thereof

#84

20050213281

2005-09-29

Extended thin film capacitor (TFC)

#85

20050196898

2005-09-08

Process of plating through hole

#86

20050029012

2005-02-10

Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby

#87

20050012566

2005-01-20

High frequency laminated component and its manufacturing method

#88

20050012217

2005-01-20

Multilayer wiring board and manufacture method thereof

#89

20050003076

2005-01-06

Method of producing a multi-layered wiring board