234513 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors; Conductive through-holes or vias Special connections between adjacent vias, not for grounding vias
MANUFACTURING METHOD FOR A CIRCUIT BOARD AND CIRCUIT BOARD
#2PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD
#3SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#4PRINTED CIRCUIT BOARD AND ELECTRONIC CONTROL DEVICE
#5NOVEL HIGH-SPEED VIA IMPEDANCE MATCHING METHODOLOGY USING LOW DIELECTRIC CONSTANT BACKDRILL FILLING MATERIAL
#6RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURING METHOD OF THE POWER MODULE
#7MULTILAYER SUBSTRATE AND JIG
#8FLEXIBLE CIRCUIT BOARD AND ROTATING ELECTRICAL MACHINE
#9POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE
#10Electronic device having multilayered substrate and manufacturing method thereof
#11ROUTING A COMMUNICATION BUS WITHIN MULTIPLE LAYERS OF A PRINTED CIRCUIT BOARD
#12WIRING BOARD, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING THEREOF
#13Magnetic Inlay With Electrically Conductive Vertical Through Connections for a Component Carrier
#14Method and circuit for controlling quality of metallization of a multilayer printed circuit board
#15Printed circuit board, optical module, and optical transmission equipment
#16Method for producing a printed circuit board having thermal through-contacts
#17PRINTED CIRCUIT BOARD
#18PRINTED CIRCUIT BOARD USING TWO-VIA GEOMETRY
#19Printed circuit board, optical module, and optical transmission equipment
#20Printed wiring board and method for manufacturing same
#21Anti-pad for signal and power vias in printed circuit board
#22Multilayer wiring substrate
#23Printed wiring board, printed circuit board, and electronic apparatus
#24Multi-layer circuit structure
#25Systems and methods for controlled effective series resistance component
#26Method for manufacturing printed wiring board and printed wiring board
#27Circuit structure
#28Wiring board assembly and method for producing same
#29Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card
#30Printed wiring board and printed circuit board
#31Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor
#32Element housing package and mounting structure body
#33Using time-domain reflectometry to identify manufacturing information for a passive printed circuit board
#34Printed wiring board and electric tool switch provided therewith
#35Wiring substrate and semiconductor device
#36Diplexer design using through glass via technology
#37Printed circuit board, design method thereof and mainboard of terminal product
#38Printed circuit board
#39Suspension board assembly sheet with circuits and method for manufacturing the same
#40Semiconductor device and circuit board
#41Systems and methods for providing vias through a modular component
#42Multilayer printed wiring board
#43Semiconductor package with embedded spiral inductor
#44Capacitor-incorporated substrate and component-incorporated wiring substrate
#45Electromagnetic bandgap structure and printed circuit board
#46SPLIT WAVE COMPENSATION FOR OPEN STUBS
#47Printed wiring board with crossing wiring pattern
#48Non-contact power receiving apparatus
#49Filter based on a combined via structure
#50Multilayer printed wiring board and manufacturing method thereof
#51Interconnect for high-frequency printed circuit
#52STRUCTURE, ELECTRONIC DEVICE, AND CIRCUIT BOARD
#53ELECTROMAGNETIC BANDGAP STRUCTURE AND CIRCUIT BOARD
#54Apparatus and method for embedding components in small-form-factor, system-on-packages
#55ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD COMPRISING THE SAME
#56Circuit board and chip package structure
#57Multilayer printed wiring board
#58Electromagnetic interference noise reduction board using electromagnetic bandgap structure
#59Printed circuit board having electromagnetic bandgap structure
#60Printed circuit board having electromagnetic bandgap structure
#61Electromagnetic interference noise reduction board using electromagnetic bandgap structure
#62Printed circuit board having electromagnetic bandgap structure
#63Rib reinforcement of plated thru-holes
#64Method for manufacturing interposer
#65Electromagnetic interference noise reduction board using electromagnetic bandgap structure
#66METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF
#67Systems and methods for providing vias through a modular component
#68ELECTRO-MAGNETIC BAND-GAP STRUCTURE, METHOD FOR MANUFACTURING THE SAME, FILTER ELEMENT AND PRINTED CIRCUIT BOARD HAVING EMBEDDED FILTER ELEMENT
#69Multilayer wiring board and method of manufacturing the same
#70Printed Circuit Board and Manufacturing Method Thereof
#71ELECTROMAGNETIC WAVE SHIELDING SUBSTRATE
#72PRINTED CIRCUIT BOARD
#73Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly
#74Printed wiring board and electronic-component package
#75Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards
#76High frequency and wide band impedance matching via
#77BONDED HERMETIC FEED THROUGH FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
#78Spacer-connector and circuit board assembly
#79Electromagnetic bandgap structure and printed circuit board having the same
#80Electromagnetic bandgap structure and printed circuit board having the same
#81Electronic component module
#82RING OF POWER VIA
#83Electromagnetic interference noise reduction board using electromagnetic bandgap structure
#84Circuit board and structure using the same
#85Circuit board and structure using the same
#86Circuit board
#87Arrangement structure of electromagnetic band-gap for suppressing noise and improving signal integrity
#88Fabrication method of circuit board
#89Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
#90SUBSTRATE HAVING ELECTROMAGNETIC SHIELDING MEMBER
#91Electromagnetic bandgap structure and circuit board
#92Electromagnetic bandgap structure and printed circuit board
#93Electromagnetic bandgap structure and printed circuit board
#94ELECTROMAGNETIC BANDGAP STRUCTURE AND PRINTED CIRCUIT BOARD
#95Electromagnetic bandgap structure and printed circuit board
#96Wiring board, semiconductor device and semiconductor element
#97Printed circuit board and optical transmission device
#98Integrated inductor
#99Printed circuit board and method of manufacturing the same
#100Printed wiring board and electronic device
#101Printed circuit board and method of manufacturing the same
#102Soldering Strategies for Printed Circuit Board Assemblies
#103Printed Circuit Boards, Printed Circuit Board Capacitors, Electronic Filters, Capacitor Forming Methods, and Articles of Manufacture
#104Semiconductor package with embedded spiral inductor
#105Filter circuit element and electronic circuit device
#106Memory module and topology of circuit board
#107Optical transceiver
#108Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density
#109PRINTED CIRCUIT BOARD ARRANGEMENT
#110Wiring board having via and method forming a via in a wiring board
#111Electromagnetic bandgap structure and printed circuit board
#112Apparatus for silencing electromagnetic noise
#113Electromagnetic bandgap structure and printed circuit board
#114MULTILAYER SUBSTRATE
#115Testbed for testing electronic circuits and components
#116Heat dissipation structure of a print circuit board
#117Flexible multilayer printed circuit assembly with reduced EMI emissions
#118Substrate and manufacturing method of the same
#119Substrate and electronic device using the same
#120Printed wiring board with notched conductive traces
#121S-TURN VIA AND METHOD FOR REDUCING SIGNAL LOSS IN DOUBLE-SIDED PRINTED WIRING BOARDS
#122Integrated circuit package for high-speed signals
#123Orthogonal Backplane Connector
#124Wiring pattern characteristic evaluation mounting board
#125Electrically conductive structure of circuit board and circuit board using the same
#126Systems, methods, and apparatus for multilayer superconducting printed circuit boards
#127Layout of a circuit board with stacked signal and reference layers and an opening in the reference layer
#128Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
#129Electromagnetic bandgap structure and printed circuit board including multi-via
#130Electromagnetic bandgap structure and printed circuit board
#131Electromagnetic bandgap structure and printed circuit board
#132Heat-conductive package structure
#133MULTILAYER PWB AND A METHOD FOR PRODUCING THE MULTILAYER PWB
#134Printed circuit board and display device using the same
#135Electromagnetic bandgap structure and printed circuit board
#136Multilayered printed wiring board
#137Split wave compensation for open stubs
#138PRINTED CIRCUIT BOARD
#139Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
#140Semiconductor package substrate
#141PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
#142Conductive dome probes for measuring system level multi-GHZ signals
#143Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards
#144Optimizing ASIC pinouts for HDI
#145Connection an integrated circuit on a surface layer of a printed circuit board
#146Substrate including wiring for transmitting signal, apparatus and system including the substrate
#147Printed circuit board, design method thereof and mainboard of terminal product
#148PRINTED WIRING BOARD AND ELECTRIC APPARATUS
#149WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#150Multilayer printed wiring board
#151Universal systems printed circuit board for interconnections
#152Interconnection structure for improving signal integrity
#153Wiring board
#154Multi-layer printed wiring board
#155Laterally Interconnected IC Packages and Methods
#156Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
#157Memory module
#158Method and system for placing multiple loads in a high-speed system
#159Composite via structures and filters in multilayer printed circuit boards
#160Apparatus and method for a printed circuit board that reduces capacitance loading of through-holes
#161Printed circuit boards for countering signal distortion
#162Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers
#163Micro-via structure design for high performance integrated circuits
#164Device mounting board and semiconductor module
#165Interposer and method for manufacturing the same
#166Flexible backplane and methods for its manufacture
#167Multi-layer printed wiring board and manufacturing method thereof
#168Multi-layer printed wiring board and manufacturing method thereof
#169Multi-layer wiring board
#170Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
#171Partially plated through-holes and achieving high connectivity in multilayer circuit boards using the same
#172Method of making an interposer
#173Multilayer interconnection board
#174High-speed signal transmission structure having parallel disposed and serially connected vias
#175Substrate module with high thermal conductivity and its fabrication method of same
#176Testing a high speed serial bus within a printed circuit board
#177Integrated inductor
#178Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
#179Circuit board including hybrid via structures
#180High frequency module utilizing a plurality of parallel signal paths
#181Signal Routing in a Multilayered Printed Circuit Board
#182Printed circuit board
#183Fabricating substrates having low inductance via arrangements
#184Field device incorporating circuit card assembly as environmental and EMI/RFI shield
#185Printed Circuit Board and Manufacturing Method Thereof
#186Incorporation of Isolation Resistor(s) into Probes using Probe Tip Spring Pins
#187Process for checking the quality of the metallization of a printed circuit
#188Interposer for compliant interfacial coupling
#189Printed board, electronic board and electronic device
#190Interposer and test assembly for testing electronic devices
#191Miniaturized co-fired electrical interconnects for implantable medical devices
#192Semiconductor memory module with error correction
#193Printed circuit board and soldering method and apparatus
#194High speed interface design
#195Connector-to-pad printed circuit board translator and method of fabrication
#196Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
#197Zero ATE insertion force interposer daughter card
#198Semiconductor device
#199Technique for accommodating electronic components on a multilayer signal routing device
#200Interposer for use with test apparatus
#201BGA-type multilayer circuit wiring board
#202Multilayer printed wiring board
#203Printed wiring board and information processing apparatus
#204Orthogonal backplane connector
#205Via connection structure with a compensative area on the reference plane
#206Routing vias in a substrate from bypass capacitor pads
#207Surface-acoustic-wave-device mount substrate, high-frequency module using the same, and communication apparatus
#208Circuit board for reducing crosstalk of signals
#209Printed wiring board having a solder pad and a method for manufacturing the same
#210High frequency and wide band impedance matching via
#211Printed circuit board for connection with an external connector
#212Capacitor pad network to manage equivalent series resistance
#213Multi-layer printed circuit board comprising a through connection for high frequency applications
#214Multilayered circuit board for high-speed, differential signals
#215Method of producing wiring board
#216Component with ultra-high frequency connections in a substrate
#217Apparatus and method for improving printed circuit board signal layer transitions
#218Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
#219Circuit board having an overlapping via
#220Routing vias in a substrate from bypass capacitor pads
#221Routing power and ground vias in a substrate
#222Field device incorporating circuit card assembly as environmental and EMI/RFI shield
#223Wiring board providing impedance matching
#224Routing differential signal lines in a substrate
#225Incorporation of isolation resistor(s) into probes using probe tip spring pins
#226Printed circuit board
#227Revenue meter bayonet assembly and method of attachment
#228Wiring base board, method of producing thereof, and electronic device
#229Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
#230Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
#231Optimized power delivery to high speed, high pin-count devices
#232Multi-layer wiring board
#233Printed wiring board with wiring pattern having narrow width portion
#234Flexible printed circuit board
#235Microwave filter distributed on circuit board of wireless communication product
#236High density microvia substrate with high wireability
#237Printed circuit board for a three-phase power device having embedded directional impedance control channels
#238Via and via landing structures for smoothing transitions in multi-layer substrates
#239Techniques for high-speed signal layer transition
#240Measuring effective dielectric constant using via-stub resonance