234522 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors covering at least two types of conductors provided for in - Staggered pads, lands or terminals; Parallel conductors in different planes
GUIDED PAD STRUCTURES FORMED IN CIRCUIT BOARD
#2REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE OF A SURFACE MOUNT CONNECTOR
#3REFLECTIVE CANCELLATIONS IN A CONNECTOR WIPE
#4Display apparatus
#5ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME
#6NON-UNIFORM SURFACE MOUNT PADS
#7Edge connector, circuit board, and connector component
#8Breakout structure for an integrated circuit device
#9Printed circuit board
#10Array substrate and method of mounting integrated circuit using the same
#11Edge connector, circuit board, and connector component
#12Transmission line substrate and electronic device
#13Printed circuit board, printed wiring board, electronic device, and image forming apparatus
#14Wiring board and method for manufacturing the same
#15High resolution display device
#16Array substrate and method of mounting integrated circuit using the same
#17Method for manufacturing flexible printed circuit board
#18FLEXIBLE ILLUMINATING MULTILAYER STRUCTURE
#19Connector and display device including same
#20FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL MODULE
#21Beveling staggered card edges
#22Transmission line substrate and electronic device
#23Communication connector to withstand power over ethernet
#24Method of manufacturing driven element chip, driven element chip, exposing device, and image forming apparatus
#25Edge connector, circuit board, and connector component
#26Non-etched wiring board for LED applications
#27Optical module
#28Multi-layer printed circuit board having a printed coil and method for the production thereof
#29Power signal transmission structure and design method thereof
#30Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
#31MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#32Array substrate and method of mounting integrated circuit using the same
#33Array substrate, and display panel and test method therefor
#34Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
#35Display device
#36Vehicle accessory control arrangement
#37Display device
#38Mounting of components on a printed circuit board
#39High resolution display device
#40Methods for connecting a wire to a feedthrough pin and apparatus including a wire connected to a feedthrough pin by the method
#41Printed circuit board and display device having the same
#42Printed circuit board and display apparatus including the same
#43Driving printed circuit board for display device and display device having the same
#44Plated terminations
#45Vehicle accessory control arrangement
#46Flexible printed circuit film and display device using the same
#47Flexible printed circuit board, method for manufacturing the same, and display device
#48Optical interconnect
#49Assembly methods and apparatus for electrically stable connectors
#50Printed wiring board and connector connecting the wiring board
#51Printed wiring board and connector connecting the wiring board
#52Printed wiring board and connector connecting the wiring board
#53Printed wiring board and connector connecting the wiring board
#54Plated terminations
#55Composite substrate and rigid substrate
#56Flexible circuit assembly and method therof
#57Array substrate and method of mounting integrated circuit using the same
#58Printed circuit board for mobile platforms
#59Electronic substrate and structure for connector connection thereof
#60Optical interconnect
#61Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
#62Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
#63Circuit board with integrated passive devices
#64Package substrate
#65Wiring board and method for manufacturing same
#66Dual side staggered surface mount dual in-line memory module
#67PRINTED CIRCUIT BOARD
#68SSD including a case, securing element, circuit board, and at least one package, and methods of forming the SSD
#69High speed differential wiring in glass ceramic MCMS
#70High speed differential wiring in glass ceramic MCMS
#71Electronic modules having grounded electromagnetic shields
#72Optical interconnect
#73Multi-layer micro-wire substrate structure
#74Vehicle accessory control arrangement
#75Hybrid interconnect
#76Display device
#77Multilayer ceramic capacitor and board having the same mounted thereon
#78Array substrate assembly and display device
#79Multilayer wiring substrate
#80Signal line pairs on a circuit board which are displaced from each other relative to a center line
#81Thermal isolation in printed circuit board assemblies
#82Multilayer wiring substrate, probe card, and method for manufacturing multilayer wiring substrate
#83High-frequency signal transmission line and electronic device
#84Touch member and method of manufacturing the same
#85Connection structure of circuit board
#86Circuit board with integrated passive devices
#87Routing design for high speed input/output links
#88Flexible printed circuit film and display device using the same
#89Electronic circuit substrate, display device, and wiring substrate
#90Printed circuit board
#91Plated terminations
#92Printed circuit board for mobile platforms
#93Printed circuits with staggered contact pads and compact component mounting arrangements
#94Elastic conformal transducer apparatus
#95CIRCUIT SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING CIRCUIT SUBSTRATE
#96LIQUID CRYSTAL DISPLAY MODULE AND A LIQUID CRYSTAL DISPLAY PANEL
#97Device including circuit board with different form factor terminal sets and assemblies including the same
#98Mini display port connector
#99Card edge connector
#100Flexible printed board
#101Contact piece of gold finger, gold finger and connector comprising the gold finger
#102Method of manufacturing an electronic module
#103Laminated wiring board
#104FLEXIBLE CIRCUIT BOARD CONNECTION STRUCTURE AND DISPLAY DEVICE
#105LOW-PROFILE INDUCATOR AND ITS FABRICATION METHOD
#106Parallel synchronous bus with non-uniform spaced conductive traces for providing equalized crosstalk
#107Light-source module and light-emitting device
#108Plug-in connector
#109Connecting structure and connecting method for flexible flat cable
#110ELECTRODE ARRAY
#111Multi-part substrate assemblies for low profile portable electronic devices
#112PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#113PCI-E module
#114Multi layer circuit board and method of manufacturing the same
#115Circuit board connector with drilling tamper detection arrangement
#116WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE
#117Multilayer printed wiring board
#118CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
#119Light-emitting device, print head and image forming apparatus
#120CONNECTION STRUCTURE, CIRCUIT DEVICE, AND ELECTRONIC EQUIPMENT
#121Light emitting device module
#122Wiring board and method for manufacturing the same
#123Wiring board and method for manufacturing the same
#124Prober unit
#125Receptacle structure, printed wiring board structure, and electronic device
#126Wiring board and liquid crystal display device
#127Semiconductor element and display device provided with the same
#128BGA footprint pattern for increasing number of routing channels per PCB layer
#129Apparatus and method for embedding components in small-form-factor, system-on-packages
#130Method and apparatus for reducing signal noise
#131PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
#132Wave guiding structures for crosstalk reduction
#133FLEXIBLE FLAT CIRCUITRY
#134WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE
#135Card edge connector and method for assembling the same
#136Backlight unit and liquid crystal display device having the same
#137Semiconductor chip package and method for designing the same
#138Electronic circuit unit
#139METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
#140Electronic card and aircraft including same
#141SUBSTRATE AND SEMICONDUCTOR DEVICE
#142Multilayer printed wiring board
#143Semiconductor device with high density optical chips and manufacturing method thereof
#144Connecting structure for circuit board and connecting method using the same
#145Multi-part substrate assemblies for low profile portable electronic devices
#146Mounting board and display device
#147Flexible printed board
#148Plasma display device
#149Plug-type connector
#150PACKAGE FOR ELECTRON ELEMENT AND ELECTRONIC COMPONENT
#151Multilayer printed wiring board
#152High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
#153Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
#154Ceramic multilayer substrate
#155Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device
#156Integrated circuit package system and method of package stacking
#157Integrated inductor
#158Golden finger for flexible printed circuitboard
#159CIRCUIT BOARDS, CONNECTORS, CASES, CIRCUIT BOARD ASSEMBLIES, CASE ASSEMBLIES, DEVICES AND METHODS OF MANUFACTURING THE SAME
#160Bistable display device
#161Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board
#162LIGHT EMITTING DIODE SYSTEM
#163Bridge connector for connecting circuit boards
#164Wiring board having efficiently arranged pads
#165Method of forming a multilayer printed wiring board having a bulged via
#166Liquid crystal display device
#167Wiring board and optical disk drive using the same
#168Mounting structure and electro optical device
#169Display device having flexible printed circuit board with particular differential signal lines connection
#170Electronic apparatus and method of manufacturing electronic apparatus
#171Multilayer wiring board with concave portion for accomodating electronic component
#172Wiring substrate, tape package having the same, and display device having the same
#173ANTI-BREAKAGE STRUCTURE FOR TRANSMITTING END FORMED ON FLEXIBLE PRINTED CIRCUITBOARD
#174Method for assigning control channels
#175Wiring substrate and display device including the same
#176Wiring substrate
#177Electrically conductive structure of circuit board and circuit board using the same
#178COF board
#179High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
#180PRINTED CIRCUIT BOARD
#181Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages
#182Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package
#183WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
#184Semiconductor chip package and method for designing the same
#185WIRING SUBSTRATE AND METHOD OF MANUFACTURING SAME, AND DISPLAY DEVICE
#186Circuit module and electrical component
#187Plasma display panel
#188Electronic control unit and method of manufacturing the same
#189ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME
#190Electronic component mounting structure
#191Circuit board and method of manufacturing same
#192Wiring substrate and electronic device
#193PRINTED CIRCUIT BOARD AND DISPLAY PANEL ASSEMBLY HAVING THE SAME
#194Circuit board with terminals arranged in a single row and disposed at board edges, cartridges with the circuit board, and methods for making same
#195Semiconductor device and package including the same
#196Electronic device and manufacturing method of the same
#197Electronic device
#198SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#199CONNECTION APPARATUS FOR CIRCUIT BOARD, INK JET TYPE RECORDING APPARATUS USING THE SAME, IC CHIP AND INK CARTRIDGE HAVING IC CHIP
#200Flexible board, electrooptic device having a flexible board, and electronic device
#201Wiring board having wiring laminate portion with via conductors embedded in resin insulating layers
#202Printed circuit board for package and manufacturing method thereof
#203Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
#204STAGGERED MEMORY LAYOUT FOR IMPROVED COOLING IN REDUCED HEIGHT ENCLOSURE
#205Liquid Crystal Display Device
#206Substrate module with high thermal conductivity and its fabrication method of same
#207Integrated inductor
#208Circuit board including hybrid via structures
#209Printed circuit board and manufacturing method thereof
#210Electronic device
#211Electronic component mounting structure
#212DRIVE IC AND DISPLAY DEVICE HAVING THE SAME
#213CONNECTION PAD LAYOUTS
#214Electronic device comprising at least one printed circuit board and comprising a plurality of semiconductor components of identical type, and method
#215Multilayer printed wiring board
#216High performance edge connector
#217Method and apparatus for electrically connecting printed circuit boards or other panels
#218Multilayer printed wiring board
#219Miniaturized co-fired electrical interconnects for implantable medical devices
#220Electrical connection pattern in an electronic panel
#221Electrical connection pattern in an electronic panel
#222Liquid crystal display device
#223Printed board for ink jet head
#224Connection apparatus for circuit board, ink jet type recording apparatus using the same, IC chip and ink cartridge having IC chip
#225Flexible circuit board
#226Method for mounting semiconductor chips on a substrate and corresponding assembly
#227Structure and method for connecting flexible printed circuit board to inkjet print head
#228Fine pitch low cost flip chip substrate
#229Double-sided flexible printed circuits
#230Flexible printed circuit and liquid crystal display device using same
#231Capacitor pad network to manage equivalent series resistance
#232Plug
#233Semiconductor device
#234Interface for a removable electronic device
#235Plasma display apparatus including electrode pad
#236Electro-optical device and electronic apparatus
#237Board having alternating rows of processors and memories
#238Fine pitch low-cost flip chip substrate
#239Thermally improved placement of power-dissipating components onto a circuit board
#240High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
#241Via structure of packages for high frequency semiconductor devices
#242Method of surface mounting a semiconductor device
#243Display device
#244Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel
#245Wiring circuit board
#246Wiring circuit board
#247Microchip controller board manufacturing method
#248Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk
#249Memory systems and methods
#250Connection pad layouts
#251Method of making multi-layer electronic components with plated terminations
#252Connection member and driving device of plasma display panel