234535 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape or layout details not covered by a single group of - Tapered, e.g. tapered hole, via or groove
PRINTED CIRCUIT BOARD
#2PRINTED CIRCUIT BOARD
#3BOTTOM-UP THROUGH GLASS VIA PLATING FOR GLASS CORE
#4PRINTED CIRCUIT BOARD
#5PRINTED CIRCUIT BOARD
#6PRINTED CIRCUIT BOARD
#7ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#8SEMICONDUCTOR PACKAGE INCLUDING OPTICAL PRINTED CIRCUIT BOARD
#9PRINTED CIRCUIT BOARD
#10WIRING BOARD
#11PRINTED CIRCUIT BOARD
#12Inlay With Exposed Porous Layer, Component Carrier, and Manufacturing Method
#13CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
#14PRINTED CIRCUIT BOARD
#15ELECTRONIC DEVICE
#16WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
#17Component Carrier With Inorganic Carrier Having Inserted Pin Directly Encapsulated in Through Hole
#18PLANAR SOLDER JOINT WITH DIAGONAL TRACE FOR DETERMINING SOLDER DIMENSION TO PREVENT ELECTROMIGRATION
#19PRINTED CIRCUIT BOARD
#20MULTILAYER CIRCUIT BOARD
#21CIRCUIT BOARD
#22ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#23CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
#24PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#25ELECTRONIC DEVICE
#26PRINTED WIRING BOARD
#27MULTILAYER SUBSTRATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
#28CARRIER STRUCTURE AND ELECTRONIC PACKAGE HAVING THE SAME
#29CIRCUIT BOARD
#30SEMICONDUCTOR PACKAGE
#31PRINTED CIRCUIT BOARD
#32Component Carrier and Manufacturing Method
#33WIRING SUBSTRATE
#34HEAT SINK DEVICE WITH DEFINED INSERTION POINT, HEAT SINK SYSTEM, HEADLAMP, VEHICLE, AND METHOD FOR RELEASING A PRINTED CIRCUIT BOARD GLUED TO A HEAT SINK
#35INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
#36Component Carrier With Constricted Through Hole and Electrically Insulating Coating
#37WIRING BOARD
#38PRINTED CIRCUIT BOARD
#39SUBSTRATE AND MANUFACTURING METHOD THEREOF
#40PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#41PRINTED WIRING BOARD
#42CIRCUIT BOARD
#43ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
#44PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#45CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
#46PRINTED CIRCUIT BOARD
#47PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#48INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
#49PRINTED CIRCUIT BOARD
#50WIRING BOARD AND SEMICONDUCTOR DEVICE
#51PRINTED CIRCUIT BOARD
#52CIRCUIT BOARD
#53PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#54INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
#55PRINTED CIRCUIT BOARD
#56PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#57PRINTED CIRCUIT BOARD
#58PRINTED CIRCUIT BOARD
#59CIRCUIT BOARD
#60PRINTED CIRCUIT BOARD
#61FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE TRANSPARENT WIRING BOARD
#62PRINTED CIRCUIT BOARD
#63PRINTED WIRING BOARD
#64CIRCUIT BOARD
#65MULTILAYER BOARD, MULTILAYER BOARD MODULE, AND ELECTRONIC DEVICE
#66WIRING BOARD AND MOUNTING STRUCTURE USING SAME
#67GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AND GLASS SUBSTRATE MANUFACTURING METHOD
#68PRINTED CIRCUIT BOARD
#69OPTICAL MODULE AND OPTICAL TRANSCEIVER
#70WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD
#71CIRCUIT BOARD DEVICE
#72Manufacturing a Component Carrier by a Nano Imprint Lithography Process
#73WIRING SUBSTRATE
#74PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#75WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANUFACTURING SAME
#76WIRING SUBSTRATE
#77CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#78CIRCUIT BOARD
#79CIRCUIT BOARD
#80WIRING SUBSTRATE
#81WIRING SUBSTRATE
#82ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#83WIRING SUBSTRATE
#84Electronic device and method for forming the same
#85PRINTED CIRCUIT BOARD
#86PRINTED CIRCUIT BOARD
#87PRINTED CIRCUIT BOARD
#88Printed circuit board
#89PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRATED CIRCUIT PACKAGE
#90Wiring board
#91WIRING SUBSTRATE
#92ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
#93MOUNTING BOARD AND CIRCUIT BOARD
#94ELECTRONIC DEVICE
#95Beveled overburden for vias and method of making the same
#96DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
#97ELECTRONIC CONTROL DEVICE
#98PRINTED WIRING BOARD
#99PRINTED WIRING BOARD
#100Inlay With Exposed Porous Layer, Component Carrier and Manufacturing Methods
#101Component Carrier With Protruding Portions and Manufacturing Method
#102Circuit board
#103Printed circuit board and method for manufacturing the same
#104PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD WITH CARRIER AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD PACKAGE
#105Circuit board
#106Wiring circuit board and method of producing the same
#107Circuit board
#108WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
#109SELF-GUIDED PLACEMENT OF MEMORY DEVICE COMPONENT PACKAGES
#110Printed circuit board
#111Circuit board
#112WIRING BOARD, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING THEREOF
#113Structural Locating Sensors For A Sensor Module Using A Printed Circuit Board Assembly
#114Substrate having electric component embedded therein
#115Forming Through Hole in Component Carrier by Laser Drilling Blind Hole and Extending the Latter by Etching
#116Connection method for chip and circuit board, and circuit board assembly and electronic device
#117Circuit board
#118Component carrier and method of manufacturing a component carrier
#119Component carrier having dielectric layer with conductively filled through holes tapering in opposite directions
#120Wiring board having a wiring pattern that has a multi-layer structure
#121PACKAGE SUBSTRATE INCLUDING CORE WITH TRENCH VIAS AND PLANES
#122PACKAGE HAVING THICK GLASS CORE WITH HIGH ASPECT RATIO VIAS
#123Circuit board preparation method
#124Wiring substrate and method for manufacturing wiring substrate
#125Method for Designing PCB Pads, Device and Medium
#126Wiring substrate and method for manufacturing wiring substrate
#127Printed circuit board
#128Circuit board
#129Circuit board and method for producing circuit board
#130Connection structure embedded substrate
#131High speed traceless interconnect
#132ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND ELECTRICAL INSPECTION METHOD
#133Method for manufacturing multilayer substrate and multilayer substrate
#134Substrate having through via and method of fabricating the same
#135Printed circuit board and electronic package comprising the same
#136Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
#137Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#138Multilayer wiring board and method of producing the same
#139Printed circuit board
#140Hermetic metallized via with improved reliability
#141Sensor device and methods of making and using the same
#142Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and substrate with a built-in electronic component
#143Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
#144Printed wiring board and method for manufacturing printed wiring board
#145Silicon heat-dissipation package for compact electronic devices
#146Overhang-compensating annular plating layer in through hole of component carrier
#147Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
#148Tapered broadband balun
#149Glass wiring board
#150Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially
#151Wiring substrate
#152Component carrier with embedded component and horizontally elongated via
#153Manufacturing method of circuit carrier board structure
#154Substrate bonding structure
#155Wiring substrate
#156Wiring substrate
#157Wiring substrate
#158Ceramic substrate and manufacturing method therefor
#159Wiring substrate
#160Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure
#161Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
#162Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric
#163Overhang-compensating annular plating layer in through hole of component carrier
#164Manufacturing holes in component carrier material
#165PRINTED CIRCUIT BOARD
#166Hermetic metallized via with improved reliability
#167Printed wiring board
#168Multilayer wiring board
#169Printed circuit board
#170Multilayer ceramic substrate and method for manufacturing same
#171Printed circuit board composite and method for producing same
#172Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#173Multi-layer ceramic electronic component, method of producing a multi-layer ceramic electronic component, and substrate with a built-in electronic component
#174LADDER TYPE PCB FOR HIGH LAYER COUNT GOLDEN FINGER CARD DESIGN
#175Wiring substrate
#176Dual trace thickness for single layer routing
#177Circuit carrier board structure and manufacturing method thereof
#178Wiring substrate
#179PRINTED CIRCUIT BOARD STRUCTURE AND METHOD OF FORMING THE SAME
#180Electronic device
#181Two-dimensional data matrix structure and the fabrication method thereof
#182Hermetic metallized via with improved reliability
#183Memory card and electronic apparatus including the same
#184Method for manufacturing flexible printed circuit board
#185Catheter flexible printed wiring board and method for manufacturing the same
#186Wiring substrate
#187Component carrier comprising a copper filled multiple-diameter laser drilled bore
#188Memory card and electronic apparatus including the same
#189Silicon heat-dissipation package for compact electronic devices
#190Resin multilayer substrate
#191Dual-purpose vias for use in ceramic pedestals
#192Method for producing glass substrate with through glass vias and glass substrate
#193Systems and apparatuses for power electronics with high current carrying conductors
#194Printed wiring board
#195Printed wiring board
#196Multi-layer circuit structure and manufacturing method thereof
#197Electronic component, diaphragm, electronic device, and electronic component manufacturing method
#198PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
#199Flexible LED assembly with UV protection
#200Glass substrate
#201Composite component-embedded circuit board and composite component
#202Fabrication method of circuit board
#203Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
#204Glass substrate including passive-on-glass device and semiconductor die
#205Display device, touch panel and method of manufacturing display device
#206Printed wiring board
#207Wiring substrate including via interconnect whose side surface includes projection
#208Printed wiring board for mounting electronic component
#209MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#210Multilayer ceramic substrate and method for manufacturing same
#211PRINTED WIRING BOARD
#212Resin multilayer substrate and method of manufacturing the same
#213TEST SOCKET, TEST SOCKET MANUFACTURING METHOD, AND JIG ASSEMBLY FOR TEST SOCKET
#214Wiring substrate
#215Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
#216Manufacturing method of an electronic component module
#217Circuit board and circuit device
#218MULTILAYER SUBSTRATE FOR A LIGHT EMITTING SEMI-CONDUCTOR DEVICE PACKAGE
#219Dual-drill printed circuit board via
#220Suspension board with circuit having thinned insulating second portion overlapping second terminal
#221Multilayered substrate and method for manufacturing the same
#222Component carrier comprising a deformation counteracting structure
#223Electronic device and manufacturing method thereof
#224Electronic apparatus and method for manufacturing the same
#225Method for manufacturing a printed circuit board element and printed circuit board element
#226Chip packaging and composite system board
#227Electronic component device, method of mounting electronic component device on circuit board, and mounting structure of electronic component device on circuit board
#228Method for producing glass substrate with through glass vias and glass substrate
#229Printed wiring board and method of manufacturing the same
#230Method of manufacturing wiring board and wiring board
#231Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
#232Wiring body, wiring board, touch sensor and method for producing wiring body
#233Component carrier comprising a copper filled multiple-diameter laser drilled bore
#234Wiring body, wiring board, touch sensor, and method for producing wiring body
#235Printed wiring board
#236SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR RADIAL FEATURE
#237Soldered interconnect for a printed circuit board having an angular radial feature
#238Semiconductor device having polyimide layer
#239Flexible LED assembly with UV protection
#240Method for manufacturing a circuit having a lamination layer using laser direct structuring process
#241PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#242Power module
#243Printed circuit board
#244METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED METALLIZATION AND PATTERNING OF A MICROELECTRONIC SUBSTRATE
#245Glass core substrate for integrated circuit devices and methods of making the same
#246Flexible light emitting semiconductor device with large area conduit
#247Bus bar plate, electronic component unit, and wire harness
#248Multilayer substrate and method for manufacturing the same
#249Opto-electric hybrid board and method of manufacturing same
#250Printed circuit board with thermal via
#251Printed circuit board and method of manufacturing the same
#252Printed circuit board and method of manufacturing the same
#253Printed wiring board
#254Carrier substrate
#255PRINTED WIRING BOARD
#256Wiring board with built-in electronic component and method for manufacturing the same
#257Printed circuit board and method of manufacturing printed circuit board
#258Printed wiring board and semiconductor package
#259WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
#260Printed wiring board and method for manufacturing the same
#261Structure, wireless communication device and method for manufacturing structure
#262PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#263Component built-in multilayer substrate fabricating method
#264Wiring substrate and semiconductor package
#265Circuit substrate and method for manufacturing the same
#266Printed wiring board
#267Printed wiring board and method for manufacturing printed wiring board
#268Semiconductor device, and image forming apparatus and image reading apparatus using the same
#269Wiring board, wiring board with lead, and electronic device
#270Device embedded substrate and manufacturing method of device embedded substrate
#271Package, electronic device, method of manufacturing electronic device, electronic apparatus, and mobile body
#272Electronic device module and manufacturing method thereof
#273Substrate
#274Multilayer wiring board, and method for manufacturing multilayer wiring board
#275Electrical connection interface for connecting electrical leads for high speed data transmission
#276METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
#277Multilayer wiring board with built-in electronic component
#278Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
#279METHOD OF FABRICATING ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS
#280Trace structure for improved electrical signaling
#281Method for manufacturing printed wiring board
#282Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component
#283Electronic component module and manufacturing method thereof
#284Printed circuit board and method of manufacturing the same
#285Ceramic multilayer substrate
#286Wiring board with through wiring
#287Method for making conductive pattern and conductive pattern
#288Wiring board, semiconductor device, and method of manufacturing wiring board
#289Printed wiring board
#290Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same
#291Foldable display apparatus and method of manufacturing the same
#292Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
#293Wiring board and method for manufacturing the same
#294Printed circuit board having embedded electronic device and method of manufacturing the same
#295Wiring substrate and semiconductor package
#296Wiring board and manufacturing method thereof
#297Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate
#298Transparent conductive film
#299Carrier substrate and manufacturing method thereof
#300One-component, solvent-free organosiloxane composition for application to printed circuit boards by means of a cross-cut nozzle