ClassID:

234548

H05K2201/09945 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Shape or layout details not covered by a single group of - Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer

Recent Application in this class:
#1
20220104361
2022-03-31

Interposer For Printed Circuit Boards

#2
20200161268
2020-05-21

Anisotropic electrically conductive film and connection structure

#3
20200076097
2020-03-05

Resin multilayer substrate and an electronic device and a joint structure of a resin multilayer substrate

#4
20190334262
2019-10-31

Joint structure of a resin multilayer substrate and a circuit board

#5
20190327833
2019-10-24

Trace/via hybrid structure multichip carrier

#6
20190304943
2019-10-03

Anisotropic conductive film

#7
20190172782
2019-06-06

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD

#8
20190150277
2019-05-16

Electronic circuit

#9
20180310403
2018-10-25

Trace/via hybrid structure multichip carrier

#10
20180103545
2018-04-12

Circuit substrate module and flexible display device

#11
20180092205
2018-03-29

Conformal electronics including nested serpentine interconnects

#12
20170290151
2017-10-05

Archimedean spiral design for deformable electronics

#13
20160272132
2016-09-22

Electrical connection box

#14
20160143174
2016-05-19

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE HAVING THE SAME

#15
20140340857
2014-11-20

Conformal electronics including nested serpentine interconnects

#16
20110117357
2011-05-19

MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF

#17
20110095433
2011-04-28

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#18
20110095419
2011-04-28

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#19
20110013406
2011-01-20

Light emitting diode (LED) circuit board with multi-directional electrical connection

#20
20110013340
2011-01-20

Capacitor containing a large number of filamentous conductors and method of manufacturing the same

#21
20110012266
2011-01-20

Semiconductor device and method of manufacturing semiconductor device

#22
20100307808
2010-12-09

Wiring board

#23
20100294552
2010-11-25

Electronic component mounted structure

#24
20090288697
2009-11-26

Conductive adhesive film and solar cell module

#25
20090208731
2009-08-20

CONDUCTIVE ADHESIVE FILM, METHOD OF PRODUCING CONDUCTIVE ADHESIVE FILM, ELECTRONIC APPARATUS INCLUDING CONDUCTIVE ADHESIVE FILM, AND METHOD OF PRODUCING ELECTRONIC APPARATUS INCLUDING CONDUCTIVE ADHESIVE FILM

#26
20070246516
2007-10-25

Universal mold for injection molding of solder

#27
20070212521
2007-09-13

Anisotropic Conductive Film and a Method of Manufacturing the Same

#28
20060249301
2006-11-09

Anisotropic conductive coatings and electronic devices

#29
20060091544
2006-05-04

Wiring board and manufacturing method therefor

#30
20050057906
2005-03-17

Connector sheet and wiring board, and production processes of the same