234552 ⎘
Indexing scheme relating to printed circuits covered by; Shape and layout; Shape or layout details not covered by a single group of - Metallised walls
PRINTED CIRCUIT BOARD
#2WIRING SUBSTRATE
#3PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#4Ultra-Thin Sandwich Component
#5Component Carrier For Waveguide Applications
#6Component Carrier For Waveguide Applications
#7Optical module assembly, optical module, package for optical module and flexible printed board
#8SUBSTRATE, CHIP, CIRCUIT PACKAGE AND FABRICATION PROCESS
#9Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage
#10Wiring substrate
#11Power supplies including shielded multilayer power transmission boards
#12Electronic device including connection structure for electrically connecting printed circuit board and housing
#13Flexible cable including a transmission line having an air gap configured to prevent signals from propagating to the air gap
#14Display panel and method for manufacturing display panel
#15Method of forming wiring on side portion of substrate
#16Power supplies including shielded multilayer power transmission boards
#17Structure comprising an inductor and resistor
#18Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing
#19Radio frequency coupling and transition structure
#20Method of manufacturing a package for embedding one or more electronic components
#21Noise blocking printed circuit board and manufacturing method thereof
#22Radio frequency coupling structure and a method of manufacturing thereof
#23Layered manufacturing of free-form multi-material micro-components
#24Connector pin on springs
#25Cortical implant system for brain stimulation and recording
#26Guarded printed circuit board islands
#27Making multi-layer micro-wire structure
#28Passive within via
#29Method of manufacturing wiring substrate having built-in component
#30Multilayer printed circuit board
#31RADIO MODULE AND MANUFACTURING METHOD THEREFOR
#32Circuit board having circumferential shielding layer
#33Method of manufacturing a package for embedding one or more electronic components
#34Sensor Element Having Through-Hole Plating
#35THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#36Proximity sensor
#37Method for embedding a component in a base
#38Method of embedding passive component within via
#39Multilayer printed circuit board
#40Patterning a thick film paste in surface features
#41Electronic module with feed through conductor between wiring patterns
#42Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
#43Chip part manufacturing method and chip parts
#44Electrical isolating structure for conductors in a substrate
#45Method of manufacturing multilayer printed circuit board
#46Printing shielded connections and circuits
#47LED package
#48Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
#49MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#50Method for fabricating printed circuit board
#51Method of enabling solder deposition on a substrate and electronic package formed thereby
#52Transmission line comprised of a center conductor on a printed circuit board disposed within a groove
#53Grouped element transmission channel link with pedestal aspects
#54Embedded die system and method
#55RECOGNITION MARK AND METHOD FOR MANUFACTURING CIRCUIT BOARD
#56Method for assigning control channels
#57Printed circuit board with multi layer ceramic capacitor and flat panel display device using the same
#58Quasi-waveguide printed circuit board structure
#59Planar heat pipe for cooling
#60Method of embedding passive component within via
#61SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
#62ELECTRO-OPTICAL PRINTED CIRCUIT BOARD AND A METHOD OF MAKING AN ELECTRO-OPTICAL PRINTED CIRCUIT BOARD
#63Optical communication module
#64Chip-type light emitting device and wiring substrate for the same
#65PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK
#66Printed circuit board including embedded capacitor and method of fabricating same
#67PACKAGE STRUCTURE WITH EMBEDDED CAPACITOR, FABRICATING PROCESS THEREOF AND APPLICATIONS OF THE SAME
#68Modular board device, high frequency module, and method of manufacturing the same
#69Embedded waveguide and embedded electromagnetic shielding
#70High-current traces on plated molded interconnect device
#71Method and structure for RF antenna module
#72Grouped element transmission channel link with pedestal aspects
#73Cooled Integrated Circuit
#74Plated substrate and method of manufacturing the same
#75Element substrate and method of manufacturing the same
#76Reworkable passive element embedded printed circuit board
#77METHOD FOR FABRICATING PASSIVE CIRCUIT IN CIRCUIT SUBSTRATE
#78Method of enabling solder deposition on a substrate and electronic package formed thereby
#79Method for embedding a component in a base
#80Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
#81Method of power-ground plane partitioning to utilize channel/trenches
#82Imprinted Waveguide Printed Circuit Board Structure
#83Multilayer printed circuit board
#84FLEXIBLE CIRCUIT
#85Printed circuit board waveguide
#86Method for manufacturing a miniaturized three-dimensional electric component
#87Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise
#88LED MOUNTING STRUCTURES
#89Multi-layer circuit board having ground shielding walls
#90Molded high impedance surface
#91Ball grid array substrate having window and method of fabricating same
#92Method for embedding a component in a base
#93Transmission line with a transforming impedance and solder lands
#94Electromagnetically shielded slot transmission line
#95LED package
#96Quasi-waveguide printed circuit board structure
#97Imprinted waveguide printed circuit board structure
#98Embedded waveguide printed circuit board structure
#99Apparatus to send biological fluids through a printed wire board
#100Semiconductor package and manufacturing method therefor
#101CIRCUIT BOARD WITH MICROELECTRONIC ELEMENTS ASSEMBLED THEREON AND METHOD FOR PRODUCING SUCH CIRCUIT BOARD
#102Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate
#103Wiring board
#104Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head
#105Method and system for attachment of light emitting diodes to circuitry for use in lighting
#106Method of manufacturing wiring board, and liquid ejection head having wiring board
#107Circuit substrate and method of manufacturing plated through slot thereon
#108METHOD OF MANUFACTURING A DEVICE, DEVICE, NON-CONTACT TYPE CARD MEDIUM, AND ELECTRONIC EQUIPMENT
#109Apparatus and method for an embedded air dielectric for a package and a printed circuit board
#110Backlight assembly, display device having the same, and method thereof
#111Methods for making microwave circuits
#112Method of manufacturing a device, device, non-contact type card medium, and electronic equipment
#113Method for contacting circuit board conductors of a printed circuit board
#114Printed circuit board having reduced mounting height
#115Semiconductor package device having reduced mounting height and method for manufacturing the same
#116Printed circuit board including embedded capacitor and method of fabricating same
#117Ball grid array substrate having window and method of fabricating same
#118Wiring substrate for mounting light emitting element
#119Chip part manufacturing method and chip parts
#120Method and system for attachment of light emmiting diodes to circuitry for use in lighting
#121Method for temporarily engaging electronic component for test
#122Solderless component packaging and mounting
#123Method for shielding printed circuit board circuits
#124Transmission line with stripped semi-rigid cable
#125High frequency circuit module having non-reciprocal circuit element
#126Multi-layer integrated RF/IF circuit board including a central non-conductive layer
#127Illuminator and production method
#128Dielectric-filled transmission lines
#129Reducing or eliminating cross-talk at device-substrate interface
#130Shield wire
#131Modular board device, high frequency module, and method of manufacturing same
#132Wiring board, magnetic disc apparatus, and manufacturing method of wiring board
#133Grouped element transmission channel link termination assemblies
#134Wireless substrate-like sensor
#135Method of embedding passive component within via
#136Method for embedding a component in a base
#137Wireless substrate-like sensor
#138Wireless substrate-like sensor
#139Uphill screen printing in the manufacturing of microelectronic components
#140Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics
#141Methods for making microwave circuits including a ground plane
#142Grouped element transmission channel link with pedestal aspects
#143Transmission line having a transforming impedance
#144Quasi-coax transmission lines
#145Double density quasi-coax transmission lines
#146Electromagnetically shielded slot transmission line
#147Transmission line with a transforming impedance and solder lands
#148Method for making a package substrate without etching metal layer on side walls of die-cavity
#149Grouped element transmission channel link termination assemblies
#150Grooved coaxial-type transmission line, manufacturing method and packaging method thereof
#151Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same
#152Method of making a microstructure using a circuit board
#153Connection substrate and interposer substrate including the same