ClassID:

234587

H05K2201/1025 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Other objects, e.g. metallic pieces Metallic discs

Recent Application in this class:
#1
20260059665
2026-02-26

COMPRESSION DEFINED BROACHING MOUNTS FOR A COMPRESSION-ATTACHED MEMORY MODULE (CAMM) CONNECTOR PLATFORM

#2
20230396004
2023-12-07

CONNECTOR FOR CONNECTING AN ELECTRICAL TERMINATION ON A PRINTED CIRCUIT, CORRESPONDING ASSEMBLY METHODS

#3
20220210535
2022-06-30

Wireless headset and headset box

#4
20200263862
2020-08-20

Chip-on-board modular lighting system and method of manufacture

#5
20190195479
2019-06-27

Chip-on-board modular lighting system and method of manufacture

#6
20190050054
2019-02-14

Miniature printed circuit board mounted haptic device

#7
20150247629
2015-09-03

Light-emitting device

#8
20130333935
2013-12-19

High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment

#9
20100314161
2010-12-16

Substrate for flip chip bonding and method of fabricating the same

#10
20090321125
2009-12-31

Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction

#11
20090212423
2009-08-27

Stacked solder balls for integrated circuit device packaging and assembly

#12
20090195933
2009-08-06

HEAD ASSEMBLY

#13
20080061434
2008-03-13

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#14
20080023852
2008-01-31

Metal pad of mode dial and manufacturing method thereof

#15
20070193773
2007-08-23

Flexible printed circuit board and electronic component assembly

#16
20070084629
2007-04-19

Low stress conductive polymer bump

#17
20060043608
2006-03-02

Low stress conductive polymer bump

#18
20050239347
2005-10-27

Structure for repairing or modifying surface connections on circuit boards

#19
20050214971
2005-09-29

BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE

#20
20050048770
2005-03-03

Process for manufacturing a wiring board having a via