ClassID:

234597

H05K2201/10325 - page 2 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Other objects, e.g. metallic pieces Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support

Recent Application in this class:
#301
20070007638
2007-01-11

MEMORY ARRAY MODULE MOUNTING STRUCTURE

#302
20070004240
2007-01-04

System and method for processor power delivery and thermal management

#303
20060291180
2006-12-28

PCI mezzanine card

#304
20060279375
2006-12-14

Attenuator adapter

#305
20060274513
2006-12-07

Power delivery to base of processor

#306
20060267615
2006-11-30

Zero ATE insertion force interposer daughter card

#307
20060261839
2006-11-23

Methods of testing memory devices

#308
20060227522
2006-10-12

Inductor

#309
20060220051
2006-10-05

System and method for surface mountable display

#310
20060172573
2006-08-03

Electronic component pin connectors

#311
20060171131
2006-08-03

Adapter module

#312
20060156540
2006-07-20

Method for aligning a component on a printed circuit board

#313
20060141828
2006-06-29

Overmolded electronic assembly and overmoldable interface component

#314
20060139889
2006-06-29

Apparatus of optical display module for fixing circuit board

#315
20060131068
2006-06-22

Surface mounted resistor with improved thermal resistance characteristics

#316
20060125504
2006-06-15

Printed circuit board for burn-in testing

#317
20060125485
2006-06-15

Accelerating PCB development and debug in advance of platform ASIC prototype samples

#318
20060067041
2006-03-30

Hybrid compression socket connector for integrated circuits

#319
20060057781
2006-03-16

Plastic leadframe and compliant fastener

#320
20060050493
2006-03-09

LSI package with interface module, transmission line package, and ribbon optical transmission line

#321
20060023441
2006-02-02

Modularized circuit component

#322
20060014444
2006-01-19

Reducing loadline impedance in a system

#323
20060007638
2006-01-12

Sheet capacitor, IC socket using the same, and manufacturing method of sheet capacitor

#324
20050277310
2005-12-15

System and method for processor power delivery and thermal management

#325
20050276029
2005-12-15

Mounting a voltage regulator on top of a processor

#326
20050236707
2005-10-27

Integrated circuit package with improved power signal connection

#327
20050218035
2005-10-06

Infrared transmissive integrated circuit socket cap

#328
20050207131
2005-09-22

Delivery regions for power, ground and I/O signal paths in an IC package

#329
20050202725
2005-09-15

Apparatus for providing controlled impedance in an electrical contact

#330
20050194607
2005-09-08

High power light emitting diode

#331
20050144584
2005-06-30

Programmable logic module and upgrade method thereof

#332
20050136852
2005-06-23

Wireless transceiver for automotive vehicle

#333
20050093120
2005-05-05

Detachable on package voltage regulation module

#334
20050028041
2005-02-03

Motherboard memory slot ribbon cable and apparatus

#335
20050016767
2005-01-27

Electronic module with dual connectivity

#336
19290351
2026-04-21

Electrical to optical converter module with dedicated high speed substrate

#337
19209651
2025-09-30

Electrical to optical converter module

#338
16552049
2020-11-10

Barrier for hybrid socket movement reduction

#339
16425637
2020-06-09

Plug board module with circuit board

#340
16265229
2019-11-12

Device for driving light-emitting diodes (LEDs)

#341
16165960
2019-12-03

Liquid-cooled integrated circuit system

#342
15963434
2020-01-14

Apparatus, system, and method for achieving PCB-compatible power sockets

#343
15934826
2019-10-22

Grid array pattern for crosstalk reduction

#344
15911194
2018-10-16

Light guide heat dissipation module and electronic device

#345
15825717
2019-03-19

Apparatus, system, and method for securing expansion cards to printed circuit boards

#346
15657254
2018-02-27

PCB with two rows of solder pads including both SMT-based and DIP-based structures