PRINTED CIRCUIT BOARD

INTEGRATED HEAT SINK FOR COMPUTING STRUCTURE

ELECTRONIC DEVICE

VERTICAL INTEGRATED VOLTAGE REGULATOR WITH CIRCUIT BOARD CUTOUT

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MOTOR CONTROLLER HEAT DISSIPATING SYSTEMS AND METHODS

Electronic control and command assembly and groundskeeping tool provided with said electronic control and command assembly

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD

Heatsink techniques for optical and electrical modules

PRINTED CIRCUIT BOARD

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPANSION CAPABILITY

Heatsink techniques for optical and electrical modules

Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

Component Carrier With an Embedded Thermally Conductive Block and Manufacturing Method

SEMICONDUCTOR STORAGE DEVICE

Systems and methods providing high-density memory arrangements with high-speed interconnects in a condensed form factor

Substrate for mounting electronic element, electronic device, and electronic module

Circuit board and method of manufacturing the same

Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupled

Circuit board structure

METHOD OF MANUFACTURING CIRCUIT BOARD

Axial field rotary energy device with PCB stator with thermal expansion capability

Inductor and power module

Metal member-equipped circuit board, circuit assembly, and electrical junction box

Illumination assembly including thermal energy management

Shape memory thermal capacitor and methods for same

Heat sink and circuit device

Component carrier with an embedded thermally conductive block and manufacturing method

Motor controller heat dissipating systems and methods

Multi-stack cooling structure for radiofrequency component

Power distribution from point-of-load with cooling

A KETTLE

Circuit board having heat-dissipation block and method of manufacturing the same

Axial field rotary energy device with PCB stator panel having thermally conductive layer

Axial field rotary energy device having PCB stator with non-linear traces

Axial field rotary energy device with PCB stator having interleaved PCBS

Axial field rotary energy device with segmented PCB stator having thermally conductive layer

ELECTRICAL CONNECTOR

METAL MEMBER-EQUIPPED CIRCUIT BOARD, CIRCUIT ASSEMBLY, AND ELECTRICAL JUNCTION BOX

Heat dissipating device

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Reel-to-reel laser ablation methods and devices in FPC fabrication

Secondary side heatsink techniques for optical and electrical modules

Substrate for mounting electronic element, electronic device, and electronic module

Electronic component module and method for manufacturing the same

Circuit board heat sink structure and method therefor

Power stage device with carrier frame for power stage module and integrated inductor

Voltage regulator module

Assembly and sub-assembly for thermal control of electronic devices

Circuit board and optical module having such circuit board

Conductive member, circuit assembly, and method for manufacturing conductive member

High-speed hybrid circuit

Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof

Printed circuit board with heat sink

Electric motor with printed circuit connector

Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board

Microwave module

Combination parallel path heatsink and EMI shield

Circuit substrate with embedded heat sink

Multilayer substrate, electronic device, and a method for manufacturing a multilayer substrate

Electronic component carrier for carrying and cooling a heat generating electronic component

Electrical power supply device for at least one LED and at least one electronic component, comprising a circuit for driving the electrical power supply equipped with an insert

Cooling a heat-generating electronic device

Multilayer board and electronic device

Evacuated core circuit board

Electronic device with laterally extending thermally conductive body and related methods

Mounting structure, method for manufacturing mounting structure, and radio device

Printed circuit board and solid state drive apparatus having the same

Circuit board with embedded metal pallet and a method of fabricating the circuit board

Circuit carrier and a method for producing a circuit carrier

Manufacturing method of package carrier

Method for manufacturing a printed circuit board element and printed circuit board element

Chip packaging and composite system board

Microwave generator for a microwave device and microwave device

Printed circuit body

Dual-sided die packages

Circuit board and manufacturing method thereof

Circuit assembly

Wiring substrate

Package with SoC and integrated memory

Cooling assembly for electronics assembly of imaging system

Method for producing a circuit board and circuit board

Combination parallel path heatsink and EMI shield

Heat radiating member and printed circuit board including same

Printed circuit board and electronic device

Power module

Printed board and electronic apparatus

Circuit substrate with embedded heat sink

Wiring substrate and method for manufacturing the same

Circuit board and circuit board assembly

Circuit board

Circuit substrate and method for manufacturing the same

Package with SoC and integrated memory

Circuit board

Circuit board

Method of fabricating heat dissipating board

Substrate for mounting electronic component and method for manufacturing the same

Cooled printed circuit with multi-layer structure and low dielectric losses

Electronic modular unit, in particular capacitive proximity sensor for a vehicle and method of producing the modular unit

Electronic component mounting structure, manufacturing method and electronic component product

Manufacturing method of circuit structure embedded with heat-dissipation block

Architecture of drive unit employing gallium nitride switches

Low profile drive unit for elevator system

Printed circuit board with integrated coil, and magnetic device

Magnetic device

Circuit substrate and method for manufacturing the same

Power semiconductor module with current sensor

Circuit substrate and method for manufacturing the same

THERMALLY ENHANCED WIRING BOARD HAVING METAL SLUG AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME

Component carrier and component carrier arrangement

Wiring board and electronic device

Connector pin on springs

Package with SoC and integrated memory

Circuit board with ceramic inlays

Semiconductor device

Advanced grounding scheme

Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board

Solder wettable flanges and devices and systems incorporating solder wettable flanges

PWB cooling system with heat dissipation through posts

Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board

Switching board of novel structure, and battery module containing the same

Wiring substrate and electronic device

Illumination device and liquid crystal display device

LED COOLING STRUCTURE

Printed circuit board assembly and a method for manufacturing the printed circuit board assembly

High performance vertical interconnection

Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components

Golden finger and board edge interconnecting device

Wiring board, manufacturing method for wiring board, and image pickup apparatus

Thermal management circuit board for stacked semiconductor chip device

Package carrier and manufacturing method thereof

Method for assembling a circuit board

Ceramic circuit board and method of making the same

Thermal connector

Method of fabricating PCB board and PCB board

Electronic device having member which functions as ground conductor and radiator

METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD

FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Circuit board with thermo-conductive pillar

Light emitting device

Component-embedded substrate

Method for fabricating heat dissipation substrate

Light emitting diode package and light emitting device having the same

Light diode with cooling body

Wiring substrate, electronic device, and method of manufacturing wiring substrate

SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT MODULE USING THE SAME

Stacked semiconductor chip device with thermal management

Thermal pad and method of forming the same

ELECTRONIC CONTROL DEVICE

HIGH POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSCEIVER, AND METHOD FOR MOUNTING HIGH POWER AMPLIFIER

Power inductor structure

Method and apparatus for providing hermetic electrical feedthrough

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device for electromagnetic shielding and dissipation of heat released by an electronic component, and corresponding electronic circuit

ALTERNATING CURRENT DRIVEN LIGHT EMITTING DIODE

Apparatus and method for embedding components in small-form-factor, system-on-packages

CIRCUIT BOARD ARRANGEMENT FOR THERMALLY STRESSED ELECTRONIC COMPONENTS, IN PARTICULAR IN MOTOR VEHICLE CONTROL APPARATUS

Light emitting diode

Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner

Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board

LED Light Source Module and Method for Producing the Same

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

Ceramic circuit board and method of making the same

Device for reducing thermal stress on connection points

Light emitting diode lamp

Printed circuit board, manufacturing method thereof and radio-frequency device

Adjustable threaded cores for LED thermal management

Multi-layer circuit board, method of manufacturing the same, and communication device

MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME

MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME

ELECTRONIC CONTROL DEVICE

Light emitting diode apparatus and optical engine using the same

Multilayer circuit substrate

LED COOLING SYSTEM

Electronic Assembly and Backlight Module

LIGHTING DEVICE

Semiconductor device and manufacturing process thereof

Printed Circuit Board With Additional Functional Elements, Method of Production and Use

Printed circuit board

Electronic component mounting board, method for manufacturing the same and electronic circuit unit

Semiconductor package with embedded magnetic component and method of manufacture

Method for the production of a metal-ceramic substrate

Light emitting assembly

Wiring substrate and method of manufacturing the same

Printed board

Circuit Carrier Structure with Improved Heat Dissipation

Dual cavity, high-heat dissipating printed wiring board assembly

Miniature circuitry and inductive components and methods for manufacturing same

Wired circuit board and producing method thererof

Heat-dissipating device for an LED

Plasma display device

Socket for electronic component

LED cooling system

SURFACE MOUNT CIRCUIT BOARD, METHOD FOR MANUFACTURING SURFACE MOUNT CIRCUIT BOARD, AND METHOD FOR MOUNTING SURFACE MOUNT ELECTRONIC DEVICES

HEAT-DISSIPATING MODULE

LED package, method of fabricating the same, and backlight unit having the same

LED heat sink

Printed Board Assembly With Improved Heat Dissipation

Printed Board Assembly with Improved Heat Dissipation

Thermal Management system and method for semiconductor lighting systems

Method for manufacturing an antenna

Method and structure for RF antenna module

Light-emitting heat-dissipating device and manufacturing method thereof

Miniature circuitry and inductive components and methods for manufacturing same

Integrated circuit chip thermal solution

Methods for manufacturing miniature circuitry and inductive components

Miniature circuitry and inductive components and methods for manufacturing same

Light emitting diode module

Methods and apparatus for thermal management in a multi-layer embedded chip structure

ELECTRICAL CONNECTION BOX

Microelectronic substrates with thermally conductive pathways and methods of making same

Touch panel and protective panel for display window of electronic device using the same

Semiconductor device and electronic component module using the same

Manufacturing method of flexible printed wiring board

Heat sink board and manufacturing method thereof

Heat spreaders with vias

Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus

Method of manufacturing a PCB having improved cooling

Module with built-in circuit elements

FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME

Method and apparatus for providing hermetic electrical feedthrough

System and method for mounting a light emitting diode to a printed circuit board

Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material

Forming buried via hole substrates

Miniature circuitry and inductive components and methods for manufacturing same

Intelligent high-power amplifier module

Conductor board and method for producing a conductor board

Circuit board inductor

Multi-layered flexible print circuit board and manufacturing method thereof

Multilayer circuit board

Plasma display device

Magnetic attachment method for LED light engines

Printed wiring boards possessing regions with different coefficients of thermal expansion

Circuit arrangement for cooling of surface mounted semi-conductors

Printed circuit board and method for producing such a printed circuit board

PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board

Circuit board

Forming buried via hole substrates

Heat management in circuit card assemblies

Method of manufacturing wiring substrate

Backlight module and heat dissipation structure thereof

Low thermal stress composite heat sink assembly

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Device to cool integrated circuit element and disk drive having the same

Power supply component assembly on a printed circuit and method for obtaining same

Method for electrical interconnection between printed wiring board layers using through holes with solid core conductive material

Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process

Electronic transformer/inductor devices and methods for making same

Reel-to-reel slug removal methods and devices in FPC fabrication

Stiffener cooling structure