ClassID:

234656

H05K2201/10772 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Details of leads; Shape details; Bent leads Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering

Recent Application in this class:
#1
20190053376
2019-02-14

Adapter with an insulating body having a circuit board with a plurality of conductive modules surface mounted on the board

#2
20180374640
2018-12-27

Ceramic electronic component and mounting structure therefor

#3
20170288509
2017-10-05

Wiring board, electric motor, electric apparatus, and air conditioner

#4
20160086730
2016-03-24

Multilayer ceramic electronic component and board having the same

#5
20150348882
2015-12-03

Three-dimensional stack of leaded package and electronic member

#6
20150194374
2015-07-09

Package with terminal pins with lateral reversal point and laterally exposed free end

#7
20130146347
2013-06-13

High aspect ratio stacked MLCC design

#8
20110014827
2011-01-20

Lead pin for package substrate

#9
20100227506
2010-09-09

Attachment Member Surface-Mount Component Comprising the Attachment Member, and Mounting Structure Using the Attachment Member

#10
20100139970
2010-06-10

Wiring board having lead pin, and lead pin

#11
20100000761
2010-01-07

Lead pin for package boards

#12
20090250824
2009-10-08

METHOD AND APPARATUS TO REDUCE PIN VOIDS

#13
20080024960
2008-01-31

Electronic component

#14
20070117453
2007-05-24

Electrical connector and method of producing same

#15
20070054548
2007-03-08

Connector and a mounting method therefor

#16
20060216970
2006-09-28

ELECTRICAL CONNECTOR TERMINAL AND METHOD OF PRODUCING SAME

#17
20060113666
2006-06-01

Electronic component

#18
20050221636
2005-10-06

Surface mount connector and circuit board assembly with same

#19
20050127494
2005-06-16

Semiconductor package

#20
20050012187
2005-01-20

Semiconductor device including inclined cut surface and manufacturing method thereof