234659 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Details of leads; Shape details Details of lead tips, e.g. pointed
SEMICONDUCTOR PACKAGE
#2LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THEREOF
#3Module
#4METHODS OF MAKING PRINTED STRUCTURES
#5Short interconnect assembly with strip elastomer
#6Methods of making printed structures
#7Short interconnect assembly with strip elastomer
#8Short interconnect assembly with strip elastomer
#9FPCB assembly for battery module, its manufacturing method, and battery module including the same
#10Methods of making printed structures
#11Systems and methods for providing a high speed interconnect system with reduced crosstalk
#12Discrete device
#13Methods for connecting a wire to a feedthrough pin and apparatus including a wire connected to a feedthrough pin by the method
#14Pin connector structure and method
#15Package-in-substrate, semiconductor device and module
#16Cortical implant system for brain stimulation and recording
#17Pin connector structure and method
#18Planar contact with solder
#19Semiconductor device with the leads projected from sealing body
#20Solder and lead free electronic circuit and method of manufacturing same
#21LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF
#22Planar contact with solder
#23Wiring board having lead pin, and lead pin
#24Method for manufacturing a semiconductor integrated circuit device
#25LED and the promptly fabricating material structure and the connect method thereof
#26Semiconductor device and lead frame used to manufacture semiconductor device
#27Solderability Improvement Method for Leaded Semiconductor Package
#28Electronic component with high density, low cost attachment
#29Lead(Pb)-free electronic component attachment
#30Surface mounting discharge tube has soldering tapers formed at peripheral edges of electrode side surfaces that seal and project outwardly from opposite ends of cylindrical ceramic envelope
#31Systems and methods for providing a high speed interconnect system with reduced crosstalk