H05K2201/10924 - CPC Classification Index

ClassID:

234676 ⎘

H05K2201/10924 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Details of leads; Other details Leads formed from a punched metal foil

Recent Application in this class:

20150345727

2015-12-03

Optoelectronic component and method for the production thereof

20150116973

2015-04-30

Electronic package structure

20150116960

2015-04-30

Electronic package structure

20140151146

2014-06-05

Mold module utilized as power unit of electric power steering apparatus and electric power steering apparatus

20130328181

2013-12-12

Electronic system with a composite substrate

20130283608

2013-10-31

Planar contact with solder

20130141886

2013-06-06

Electronic package structure

20130069427

2013-03-21

CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE

20130010442

2013-01-10

CIRCUIT ARRANGEMENT AND ASSOCIATED CONTROLLER FOR A MOTOR VEHICLE

#10

20120300404

2012-11-29

Resin-sealed electronic controller and method of fabricating the same

#11

20120262145

2012-10-18

Power supply module

#12

20120236519

2012-09-20

Electronic package structure

#13

20120120610

2012-05-17

SEMICONDUCTOR DEVICE

#14

20120084977

2012-04-12

METHOD OF MANUFACTURING BLOCK MODULE

#15

20120075808

2012-03-29

Electronic package structure

#16

20120018187

2012-01-26

Conductor grid for electronic housings and manufacturing method

#17

20120014079

2012-01-19

Electronic package structure

#18

20110290535

2011-12-01

Method for manufacturing wiring substrate

#19

20110199746

2011-08-18

Electronic system with a composite substrate

#20

20110182048

2011-07-28

ELECTRONIC ASSEMBLY AND METHOD FOR ITS MANUFACTURE

#21

20110101393

2011-05-05

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

#22

20110090648

2011-04-21

ELECTRONIC PACKAGE STRUCTURE

#23

20110068460

2011-03-24

Integration of SMD components in an IC housing

#24

20110044009

2011-02-24

Semiconductor device

#25

20100289130

2010-11-18

Method and Apparatus for Vertical Stacking of Integrated Circuit Chips

#26

20100236815

2010-09-23

Planar contact with solder

#27

20100181890

2010-07-22

Lighting device and method for making the same

#28

20100172114

2010-07-08

SURFACE MOUNTING COMPONENT

#29

20100170706

2010-07-08

ELECTRONIC MODULE AND METHOD FOR MANUFACTURING AN ELECTRONIC MODULE

#30

20090207574

2009-08-20

ELECTRONIC PACKAGE STRUCTURE

#31

20090190320

2009-07-30

Semiconductor device

#32

20090162976

2009-06-25

Method of manufacturing pins of miniaturization chip module

#33

20090158584

2009-06-25

Cable termination methods

#34

20090135572

2009-05-28

Circuit device and method of manufacturing the same

#35

20090035957

2009-02-05

Method for producing a circuit board comprising a lead frame

#36

20090011548

2009-01-08

Hybrid integrated circuit device and manufacturing method thereof

#37

20090004774

2009-01-01

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

#38

20080305650

2008-12-11

CONDUCTING TERMINAL MOUNTING STRUCTURE

#39

20080179722

2008-07-31

ELECTRONIC PACKAGE STRUCTURE

#40

20080158824

2008-07-03

Electric circuit device and the manufacturing method

#41

20080142571

2008-06-19

ELECTRONIC DEVICE

#42

20080119065

2008-05-22

Circuit device

#43

20080099922

2008-05-01

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

#44

20080074829

2008-03-27

Electronic controller

#45

20080061410

2008-03-13

Electronic device having wiring substrate and lead frame

#46

20080009153

2008-01-10

Semiconductor package and method of making the same

#47

20070296116

2007-12-27

PROCESS FOR MANUFACTURING A HYBRID ELECTRICAL COMPONENT

#48

20070278639

2007-12-06

Semiconductor device stack and method for its production

#49

20070218710

2007-09-20

Structure and process for a contact grid array formed in a circuitized substrate

#50

20070207635

2007-09-06

Electronic component with high density, low cost attachment

#51

20070193027

2007-08-23

Method of manufacturing circuit device

#52

20070090513

2007-04-26

Power module fabrication method and structure thereof

#53

20070036490

2007-02-15

Methods for manufacturing optical modules having an optical sub-assembly

#54

20070003195

2007-01-04

Transceiver module having a dual segment lead frame connector

#55

20060203455

2006-09-14

Metal-core substrate and apparatus utilizing the same

#56

20060189032

2006-08-24

Process for assembling a double-sided circuit component

#57

20060055024

2006-03-16

Adapted leaded integrated circuit module

#58

20060024005

2006-02-02

Optical transceiver module having a dual segment molded lead frame connector

#59

20050247759

2005-11-10

Methods for manufacturing optical modules using lead frame connectors

#60

20050232641

2005-10-20

Methods for manufacturing lead frame connectors for optical transceiver modules

#61

20050231925

2005-10-20

Semiconductor device

#62

20050221637

2005-10-06

Dual segment molded lead frame connector for optical transceiver modules

#63

20050212113

2005-09-29

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

#64

20050205970

2005-09-22

Package with stacked substrates

#65

20050189400

2005-09-01

Methods for manufacturing optical modules using lead frame connectors

#66

20050188535

2005-09-01

Methods for manufacturing lead frame connectors for optical transceiver modules

#67

20050179121

2005-08-18

IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless

#68

20050161251

2005-07-28

Hybrid integrated circuit device and method of manufacturing the same

#69

20050151229

2005-07-14

Electronic device having wiring substrate and lead frame

#70

20050142694

2005-06-30

Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges

#71

20050018410

2005-01-27

Printed circuit board assembly with integrated connector