234677 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Details of leads; Other details Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes
Localized Soldering U&C Shape with Metal Pin Design
#2ELECTRONIC DEVICE
#3POWER SEMICONDUCTOR DEVICE
#4ELECTRONIC COMPONENT
#5Coated semiconductor devices
#6Circuit board
#7MODULE
#8Coated semiconductor devices
#9Electronic device module
#10Electronic device
#11POWER MODULE AND METHOD OF MANUFACTURING THE SAME
#12Method of manufacturing wiring board and wiring board
#13Printed circuit board having reduced loss of electric signal and method of manufacturing the same
#14PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#15Attenuation reduction structure for high frequency signal connection pads of circuit board with insertion component
#16Cortical implant system for brain stimulation and recording
#17Mold module utilized as power unit of electric power steering apparatus and electric power steering apparatus
#18Non-pull back pad package with an additional solder standoff
#19Semiconductor package and mounting method thereof
#20Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
#21Non-pull back pad package with an additional solder standoff
#22Circuit board and electronic assembly
#23Package frame and semiconductor package using the same
#24Method of surface mounting a semiconductor device
#25Method of soldering electrical connection
#26Light-emitting diode lamp having a terminal portion with a notch portion
#27Semiconductor device including inclined cut surface and manufacturing method thereof