ClassID:

234693

H05K2201/2063 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of printed circuits not provided for in - mixed adhesion layer containing metallic/inorganic and polymeric materials

Recent Application in this class:
#1
20250019572
2025-01-16

ADHESIVE COMPOSITION, ADHESIVE SHEET, ELECTROMAGNETIC WAVE SHIELD FILM, LAMINATE, AND PRINTED CIRCUIT BOARD

#2
20240292542
2024-08-29

Information handling systems with a flexible printed circuit tensioning system and methods of making the same

#3
20230042192
2023-02-09

Display device

#4
20210259097
2021-08-19

Display device

#5
20180298206
2018-10-18

Method of manufacturing anisotropic conductive film using vertical ultrasonic waves

#6
20150218425
2015-08-06

STRETCH RELEASE CONDUCTIVE ADHESIVE

#7
20150195921
2015-07-09

Circuit board and method for manufacturing same

#8
20150144385
2015-05-28

Circuit board and electronic apparatus including the same

#9
20150138739
2015-05-21

SUSPENSION BOARD WITH CIRCUIT

#10
20150090482
2015-04-02

CURABLE COMPOSITION FOR PRINTED CIRCUIT BOARD, CURED COATING FILM USING THE SAME, AND PRINTED CIRCUIT BOARD

#11
20120037312
2012-02-16

MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURE

#12
20110318602
2011-12-29

Metal-Coated Polyimide Resin Substrate with Excellent Thermal Aging Resistance Properties

#13
20110005817
2011-01-13

CAPACITOR-FORMING MATERIAL AND PRINTED WIRING BOARD PROVIDED WITH CAPACITOR

#14
20100323097
2010-12-23

Dielectric device and method of manufacturing the same

#15
20080193742
2008-08-14

Polyimide Film with Improved Surface Activity

#16
20080188366
2008-08-07

Multilayer ceramic substrate

#17
20070138128
2007-06-21

Dielectric device and method of manufacturing the same

#18
20070110973
2007-05-17

Resin substrate having a resin-metal composite layer and method for manufacturing thereof

#19
20070093035
2007-04-26

Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof

#20
20050221103
2005-10-06

Polyimide complex sheet

#21
20050214551
2005-09-29

Metallized polyimide film and manufacturing method therefor