234717 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Tools for processing; Objects used during processing Using a temporary spacer element or stand-off during processing
Pressure sintering device and method for manufacturing an electronic component
#2Component, positioning device and method for fastening the component by soldering
#3Method of fabricating a glass substrate with a plurality of vias
#4Filling materials and methods of filling through holes of a substrate
#5Apparatus for facilitating the separation of mated printed circuit board assemblies
#6Voiding control using solid solder preforms embedded in solder paste
#7Apparatus for mounting electronic component
#8Orientating and installing jig
#9SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE
#10Printed Wiring Board and Electronic Apparatus
#11Method for Producing Liquid Crystalline Polyester Prepreg and Liquid Crystalline Polyester Prepreg
#12OC2 oriented connections 2
#13ACCOMPANYING WINDING SPACER AND METHOD FOR MANUFACTURING STRIP TYPE MATERIALS USING THE SAME
#14Substrate
#15Electrical connector
#16Optical module
#17Multiple flexible wiring board, method for producing same, method for producing flexible wiring board, and flexible wiring board
#18Printed circuit board with interconnection terminal, a printed circuit assembly and electronic apparatus
#19Board level solder joint support for BGA packages under heatsink compression
#20Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
#21Spacer, printed circuit board, and electronic equipment
#22Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
#23Method of mounting electronic component on substrate without generation of voids in bonding material
#24Printed circuit board unit with detachment mechanism for electronic component