234722 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound Partly drilling through substrate until a controlled depth, e.g. with end-point detection
BACKDRILL TIP OPTIMIZATION
#2PRINTED CIRCUIT BOARD BACKDRILL QUALITY VERIFICATION
#3Component Carrier, Method and Apparatus for Manufacturing the Component Carrier
#4ZERO CLEARANCE BACKDRILLED PRINTED CIRCUIT BOARDS
#5METHODS AND SYSTEMS FOR PROVIDING SHORT STRUCTURES FOR BACKDRILL VALIDATION
#6CONTROLLING DEPTH OF PENETRATION OF BACKDRILL CAVITY FILLING BY ADJUSTING INITIAL AMBIENT PRESSURE
#7METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTILAYER PCB FABRICATION PROCESS
#8CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
#9CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
#10POWER VIA RESONANCE SUPPRESSION
#11System and method to eliminate via striping
#12BACK DRILLING VIAS OF A PRINTED CIRCUIT BOARD
#13Method for machining workpieces
#14Method and Drill for Removing Partial Metal Wall of Hole
#15Method for detecting and adjusting poor back drills in printed circuit boards
#16Printed wiring board and manufacturing method for printed wiring board
#17METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH PRECISION STUB REMOVAL IN A PRINTED CIRCUIT BOARD
#18PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL
#19Machining station and method for machining workpieces
#20Metal sublayer sensing in multi-layer workpiece hole drilling
#21Laser cutting system
#22Resin substrate and electronic device
#23Electronic board comprising SMDS soldered on buried solder pads
#24Printed circuit board and communications device
#25Clearance size reduction for backdrilled differential vias
#26Metal sublayer sensing in multi-layer workpiece hole drilling
#27Additive manufacturing technology (AMT) low profile signal divider
#28Stepped vias for next generation speeds
#29DUAL-DRILL PRINTED CIRCUIT BOARD VIA
#30High speed signal fan-out method for BGA and printed circuit board using the same
#31Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
#32Metal sublayer sensing in multi-layer workpiece hole drilling
#33Back-drilled through-hole printed circuit board (PCB) systems
#34Printed circuit board and electronic device with the same
#35Dual-drill printed circuit board via
#36Component carrier comprising a deformation counteracting structure
#37Disconnect cavity by plating resist process and structure
#38Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board
#39Drilling method for PCBs with high hole position precision
#40Solder void reduction between electronic packages and printed circuit boards
#41Circuit board, electronic device, and method of manufacturing circuit board
#42Residual material detection in backdrilled stubs
#43Method for back-drilling a through-hole onto a printed circuit board (PCB)
#44Manufacturing method for back drilling hole in PCB and PCB
#45Printed circuit board copper plane repair
#46Backdrill reliability anchors
#47Structure for isolating high speed digital signals in a high density grid array
#48Residual material detection in backdrilled stubs
#49Method of making a printed circuit board copper plane repair
#50PCB back drill detection method and PCB plating
#51Backdrilling method, and backdrilling apparatus
#52Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
#53Printed circuit board copper plane repair
#54Solder void reduction for component attachment to printed circuit boards
#55Solder void reduction between electronic packages and printed circuit boards
#56Method for implementing high-precision backdrilling stub length control
#57Printed circuit board method
#58Methods of segmented through hole formation using dual diameter through hole edge trimming
#59Implementing reduced drill smear
#60Device and a Method for Machining Printed Circuit Boards
#61Connector footprints in printed circuit board (PCB)
#62Printed circuit board, and method and apparatus for drilling printed circuit board
#63Circuit board multi-functional hole system and method
#64Circuit board having plated thru-holes and ground columns
#65Printed circuit board having a non-plated hole with limited drill depth
#66Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
#67PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
#68Signal Wiring Board and Signal Transmission Circuit
#69Method of fabricating a circuit board
#70WIRING BOARD HAVING A PLURALITY OF VIAS
#71Back Drill Verification Feature
#72Method for backdrilling via stubs of multilayer printed circuit boards with reduced backdrill diameters
#73Circuit board having improved ground vias
#74Wiring board
#75Method of connecting components to a printed circuit board
#76PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#77Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly
#78LASER PROCESSING DEVICE
#79Printed circuit board and manufacturing method therefor
#80Radio frequency multilayer substrate and manufacturing method of radio frequency multilayer substrate
#81SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES
#82High-speed router with backplane using muli-diameter drilled thru-holes and vias
#83Printed circuit board and method of manufacturing the same
#84RECESS FORMATION METHOD, RECESS FORMATION DEVICE, AND FORMATION MATERIAL FOR RECESS
#85WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#86WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#87Printed circuit board, light emitting apparatus having the same and manufacturing method thereof
#88Method of processing a circuit board
#89Circuit board and manufacturing method of the circuit board
#90Circuit board provided with digging depth detection structure and transmission device with the same mounted
#91Counterboring method with carbon dioxide gas laser
#92Circuit board having a multi-signal via
#93Electrical isolation of PCBs gasketing using controlled depth drilling
#94Circuit board having a multi-signal via
#95Circuit board having a backdrilled multi-signal via
#96Closed loop backdrilling system
#97Printed circuit board and manufacturing method therefor
#98Apertures for signal shaping using ground and signal PTH back-drilling
#99Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate
#100Manufacturing method of a multi-layered circuit board
#101Apparatus and method for improving printed circuit board signal layer transitions
#102Electrical isolation of PCBs gasketing using controlled depth drilling
#103Printed board drilling method and printed board machining apparatus
#104Circuit board integrated optical coupling elements
#105HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#106Forming thin layer structures by ablation
#107Closed loop backdrilling system