ClassID:

234724

H05K2203/0221 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound Perforating

Recent Application in this class:
#1
20240422896
2024-12-19

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

#2
20210014974
2021-01-14

Method for manufacturing printed wiring board and resin sheet with inorganic layer

#3
20200178402
2020-06-04

Method for manufacturing flexible circuit board

#4
20200100366
2020-03-26

Method of producing an electrical through connection between opposite surfaces of a flexible substrate

#5
20190288127
2019-09-19

Method of manufacturing a circuit board by punching

#6
20180312432
2018-11-01

GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE

#7
20170238426
2017-08-17

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

#8
20150377929
2015-12-31

Current sensing system

#9
20150296618
2015-10-15

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

#10
20150173191
2015-06-18

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

#11
20150034364
2015-02-05

Flexible printed circuit board and method for making same

#12
20130247977
2013-09-26

Method of manufacturing a circuit board by punching

#13
20090026615
2009-01-29

Semiconductor device having external connection terminals and method of manufacturing the same

#14
20080301936
2008-12-11

Method for interconnecting tracks present on opposite sides of a substrate

#15
20080258314
2008-10-23

Fabric type semiconductor device package and methods of installing and manufacturing same

#16
20080199597
2008-08-21

Method For Producing A Three-Dimensional Circuit

#17
20080113466
2008-05-15

Method of forming contact hole, method of manufacturing wiring board, method of manufacturing semiconductor device, and method of manufacturing electro-optical device

#18
20060263945
2006-11-23

Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device

#19
20060194031
2006-08-31

Method of manufacturing a wiring substrate

#20
20060118228
2006-06-08

Method and apparatus for producing a wiring board, including film-peeling

#21
20060076104
2006-04-13

Film peeling apparatus and method of manufacturing wiring board

#22
20060024957
2006-02-02

Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device

#23
20050201068
2005-09-15

Replaceable LED module