234727 ⎘
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH PRECISION STUB REMOVAL IN A PRINTED CIRCUIT BOARD
#2Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
#3Pin array including segmented pins for forming selectively plated through holes
#4Cavities containing multi-wiring structures and devices
#5PCB back drill detection method and PCB plating
#6Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
#7Cavities containing multi-wiring structures and devices
#8Connector footprints in printed circuit board (PCB)
#9Circuit board having plated thru-holes and ground columns
#10Process for making stubless printed circuit boards
#11Cavities containing multi-wiring structures and devices
#12Circuit boards with vias exhibiting reduced via capacitance
#13Multiple layer printed circuit board with unplated vias
#14Metal core board for vehicle-mountable junction box
#15CIRCUIT BOARD
#16Relief plug-in connector and multilayer circuit board
#17Package substrate having a through hole and method of fabricating the same
#18Method of fabricating a circuit board
#19Spark gap apparatus
#20Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
#21Multi-tiered Circuit Board and Method of Manufacture
#22PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#23Ceramic substrate and manufacturing method thereof
#24Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly
#25Wiring board having via and method forming a via in a wiring board
#26SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES
#27Substrate and manufacturing method of the same
#28RECOGNITION MARK AND METHOD FOR MANUFACTURING CIRCUIT BOARD
#29Printed circuit board, fabrication method and apparatus
#30High-speed router with backplane using muli-diameter drilled thru-holes and vias
#31Configurable printed circuit board
#32Printed circuit board and method of manufacturing the same
#33Process for making stubless printed circuit boards
#34Device for repair of a contact pad of a printed circuit board
#35Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
#36WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#37WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#38Method and device for repair of a contact pad of a printed circuit board
#39Method of processing a circuit board
#40Reworkable passive element embedded printed circuit board
#41Manufacture of printed circuit boards with stubless plated through-holes
#42Circuit board provided with digging depth detection structure and transmission device with the same mounted
#43Circuit board having a multi-signal via
#44Electrical isolation of PCBs gasketing using controlled depth drilling
#45Circuit board having a multi-signal via
#46Circuit board having a backdrilled multi-signal via
#47Closed loop backdrilling system
#48Apertures for signal shaping using ground and signal PTH back-drilling
#49Manufacturing method of a multi-layered circuit board
#50Rapid fire test board
#51Electrical isolation of PCBs gasketing using controlled depth drilling
#52Structure for repairing or modifying surface connections on circuit boards
#53Closed loop backdrilling system
#54Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
#55Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
#56Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate