H05K2203/056 - CPC Classification Index

ClassID:

234789 ⎘

H05K2203/056 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Patterning and lithography; Masks; Details of resist; Masks Using an artwork, i.e. a photomask for exposing photosensitive layers

Recent Application in this class:

20180014401

2018-01-11

Wired circuit board and producing method thereof

20170362361

2017-12-21

Photosensitive resin composition, and film and printed circuit board using same

20170290146

2017-10-05

Wired circuit board and producing method thereof

20170127528

2017-05-04

Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB

20160011514

2016-01-14

Method of manufacturing substrate and substrate and mask film

20140293258

2014-10-02

Manufacturing apparatus of electronic component and manufacturing method thereof

20130126213

2013-05-23

Conductive film

20120211273

2012-08-23

VIA STUB ELIMINATION

20120125676

2012-05-24

Three-dimensional circuit board

#10

20120052417

2012-03-01

Circuit apparatus having a rounded trace

#11

20120048600

2012-03-01

Method to manufacture a circuit apparatus having a rounded differential pair trace

#12

20100304298

2010-12-02

Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method

#13

20100300729

2010-12-02

Pattern exposure method, conductive film producing method, and conductive film

#14

20100044887

2010-02-25

Method for producing circuit substrate, and circuit substrate

#15

20100044096

2010-02-25

Method of forming a substrate having a plurality of insulator layers

#16

20100044095

2010-02-25

Method for via stub elimination

#17

20100015409

2010-01-21

PHOTOIMAGING METHOD AND APPARATUS

#18

20100012352

2010-01-21

Photoimaging method and apparatus

#19

20090266582

2009-10-29

Three-dimensional circuit board and its manufacturing method

#20

20090188890

2009-07-30

SOLDER VOID REDUCTION ON CIRCUIT BOARDS

#21

20090159565

2009-06-25

Method to pattern metallized substrates using a high intensity light source

#22

20090059195

2009-03-05

Exposure device with mechanism for forming alignment marks and exposure process conducted by the same

#23

20090014410

2009-01-15

Producing method of suspension board with circuit

#24

20090011142

2009-01-08

Method for manufacturing patterned thin-film layer

#25

20080032209

2008-02-07

Long length flexible circuits and method of making same

#26

20070169958

2007-07-26

Mask for exposure

#27

20070163111

2007-07-19

Method for manufacturing a multilayer flexible wiring board

#28

20070068622

2007-03-29

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

#29

20070034596

2007-02-15

Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask

#30

20060234424

2006-10-19

Technique for compensating for substrate shrinkage during manufacture of an electronic assembly

#31

20060231198

2006-10-19

Manufacturing process: how to construct constraining core material into printed wiring board

#32

20060200332

2006-09-07

CAD system for a printed circuit board

#33

20060050254

2006-03-09

Projection exposure apparatus and method for producing a printed circuit board