H05K2203/0565 - CPC Classification Index

ClassID:

234791 ⎘

H05K2203/0565 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Patterning and lithography; Masks; Details of resist; Details of resist Resist used only for applying catalyst, not for plating itself

Recent Application in this class:

20220151081

2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20220084927

2022-03-17

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

20200344895

2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20200329567

2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20200258827

2020-08-13

Electroless metal-defined thin pad first level interconnects for lithographically defined vias

20190306991

2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

20180332713

2018-11-15

PATTERNING OF ELECTROLESS METALS BY SELECTIVE DEACTIVATION OF CATALYSTS

20170354040

2017-12-07

Patterning of electroless metals by selective deactivation of catalysts

20160113121

2016-04-21

Patterning of electroless metals by selective deactivation of catalysts

#10

20150156873

2015-06-04

Circuit board, and semiconductor device having component mounted on circuit board

#11

20150034366

2015-02-05

Circuit board

#12

20150008379

2015-01-08

Resin composition and method for producing circuit board

#13

20130337188

2013-12-19

Resin composition and method for producing circuit board

#14

20120292083

2012-11-22

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD

#15

20120285736

2012-11-15

Method of producing multilayer circuit board

#16

20120211273

2012-08-23

VIA STUB ELIMINATION

#17

20120206891

2012-08-16

Circuit board, and semiconductor device having component mounted on circuit board

#18

20110247860

2011-10-13

Method of producing circuit board, and circuit board obtained using the manufacturing method

#19

20110091697

2011-04-21

Method of fabricating a solder pad structure

#20

20110023297

2011-02-03

MULTI-LAYERED PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

#21

20110017495

2011-01-27

Method for preparing a patterned electric circuit

#22

20100044096

2010-02-25

Method of forming a substrate having a plurality of insulator layers

#23

20100044095

2010-02-25

Method for via stub elimination

#24

20090272564

2009-11-05

Method of producing circuit board

#25

20090272562

2009-11-05

Method of producing a circuit board

#26

20090166320

2009-07-02

Selective electroless plating for electronic substrates

#27

20090123702

2009-05-14

Molded circuit component and process for producing the same

#28

20090042150

2009-02-12

Transparent electrically conductive film and process for producing the same

#29

20080314628

2008-12-25

METHOD OF FORMING METAL PATTERN, PATTERNED METAL STRUCTURE, AND THIN FILM TRANSISTOR-LIQUID CRYSTAL DISPLAYS USING THE SAME

#30

20070218193

2007-09-20

Method of manufacturing interconnect substrate

#31

20070218192

2007-09-20

Method of manufacturing interconnect substrate

#32

20070218191

2007-09-20

METHOD FOR MANUFACTURING WIRING SUBSTRATE

#33

20070212876

2007-09-13

Method for manufacturing wiring substrate

#34

20070212871

2007-09-13

Method of manufacturing interconnect substrate

#35

20070160810

2007-07-12

Method for manufacturing patterned porous molded product or nonwoven fabric, and electric circuit component

#36

20070153488

2007-07-05

Multi-layer printed circuit board and method for fabricating the same

#37

20060141159

2006-06-29

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.