ClassID:

234821

H05K2203/074 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Treatments involving liquids, e.g. plating, rinsing; Methods for applying liquids, e.g. spraying Features related to the fluid pressure

Recent Application in this class:
#1
20240431037
2024-12-26

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

#2
20240139764
2024-05-02

Automated pressure control system and method for a cleaner

#3
20200214126
2020-07-02

Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure

#4
20180154573
2018-06-07

Circuit board and component fabrication apparatus

#5
20180021803
2018-01-25

Fluid discharge device, fluid discharge method, and fluid application device

#6
20120103222
2012-05-03

Method for producing metal thin film

#7
20120000382
2012-01-05

Method for producing metal thin film

#8
20110221075
2011-09-15

Method of manufacturing electronic device and electronic device

#9
20110027539
2011-02-03

IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS

#10
20100187700
2010-07-29

Method and apparatus for manufacturing an electronic module, and electronic module

#11
20100085723
2010-04-08

Mounting method using dilatancy fluid

#12
20100018743
2010-01-28

Electronic device for a flexible display device and method the same

#13
20090232972
2009-09-17

Method for the production of a metal-ceramic substrate

#14
20090218386
2009-09-03

Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device

#15
20090154969
2009-06-18

Pressure-controlled steam oven for asymptotic temperature control of continuous feed media

#16
20090020591
2009-01-22

Conductive ball mounting method

#17
20090001054
2009-01-01

BONDING METHOD AND BONDING APPARATUS

#18
20080307991
2008-12-18

Method for producing metal thin film

#19
20080211143
2008-09-04

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

#20
20080211086
2008-09-04

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

#21
20080073765
2008-03-27

IC chip package having automated tolerance compensation

#22
20070257090
2007-11-08

Method and device for applying a solder to a substrate

#23
20070151845
2007-07-05

Apparatus for forming metal film

#24
20060113680
2006-06-01

Microelectronic packages with solder interconnections

#25
20060086269
2006-04-27

Method and apparatus for printing conductive ink