H05K2203/08 - CPC Classification Index

ClassID:

234839 ⎘

H05K2203/08 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Treatments involving gases

Sub-classes:

H05K2203/081 » Blowing of gas, e.g. for cooling or for providing heat during solder reflowing 100
H05K2203/081 » Blowing of gas, e.g. for cooling or for providing heat during solder reflowing 100
H05K2203/082 » Suction, e.g. for holding solder balls or components 155
H05K2203/082 » Suction, e.g. for holding solder balls or components 155
H05K2203/083 » Evaporation or sublimation of a compound, e.g. gas bubble generating agent 39
H05K2203/083 » Evaporation or sublimation of a compound, e.g. gas bubble generating agent 39
H05K2203/085 » Using vacuum or low pressure 127
H05K2203/085 » Using vacuum or low pressure 127
H05K2203/086 » Using an inert gas 41
H05K2203/086 » Using an inert gas 41
H05K2203/087 » Using a reactive gas 90
H05K2203/087 » Using a reactive gas 90
H05K2203/088 » Using a vapour or mist, e.g. cleaning using water vapor 15
H05K2203/088 » Using a vapour or mist, e.g. cleaning using water vapor 15

Recent Application in this class:

20250331109

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD

20240188228

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD

20220304166

Method for manufacturing printed wiring board

20180110128

Drying apparatus

20150263432

Cavity-backed artificial magnetic conductor

20150103499

Electronic component-embedded module and communication terminal device