ClassID:

234847

H05K2203/09 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Treatments involving charged particles

Sub-classes:
Recent Application in this class:
#1
20180153044
2018-05-31

WIRING SUBSTRATE METHOD OF MANUFACTURING, WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING DEVICE

#2
20150342050
2015-11-26

Origami enabled manufacturing systems and methods

#3
20150296628
2015-10-15

Biocompatible bonding method suitable for implantation

#4
20130009825
2013-01-10

Micropatterning of conductive graphite particles using microcontact printing

#5
20110118808
2011-05-19

Biocompatible bonding method and electronics package suitable for implantation

#6
20100237037
2010-09-23

Ceramic substrate metalization process

#7
20100052995
2010-03-04

MICROPATTERNING OF CONDUCTIVE GRAPHITE PARTICLES USING MICROCONTACT PRINTING

#8
20100052697
2010-03-04

Repairing defects

#9
20090268183
2009-10-29

CONDUCTIVE PATTERN FORMING APPARATUS

#10
20080296540
2008-12-04

Metallic particles for electrokinetic or electrostatic deposition

#11
20080073026
2008-03-27

Method of supplying liquid bonding material, method of manufacturing electronic circuit board, liquid bonding material supply apparatus and liquid bonding material

#12
20070021787
2007-01-25

Biocompatible bonding method and electronics package suitable for implantation

#13
20070005112
2007-01-04

Biocompatible bonding method and electronics package suitable for implantation

#14
20060260943
2006-11-23

Mask and method for electrokinetic deposition and patterning process on substrates

#15
20060192182
2006-08-31

Preparation of metallic particles for electrokinetic or electrostatic deposition

#16
20050106329
2005-05-19

Method of applying a pattern of particles to a substrate