H05K2203/10 - CPC Classification Index

ClassID:

234851 ⎘

H05K2203/10 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Using electric, magnetic and electromagnetic fields; Using laser light

Sub-classes:

H05K2203/101 » Using electrical induction, e.g. for heating during soldering 53
H05K2203/101 » Using electrical induction, e.g. for heating during soldering 53
H05K2203/102 » Using microwaves, e.g. for curing ink patterns or adhesive 28
H05K2203/102 » Using microwaves, e.g. for curing ink patterns or adhesive 28
H05K2203/104 » Using magnetic force, e.g. to align particles or for a temporary connection during processing 101
H05K2203/104 » Using magnetic force, e.g. to align particles or for a temporary connection during processing 101
H05K2203/105 » Using an electrical field; Special methods of applying an electric potential 132
H05K2203/105 » Using an electrical field; Special methods of applying an electric potential 132
H05K2203/107 » Using laser light 969
H05K2203/107 » Using laser light 969

Recent Application in this class:

20260040458

2026-02-05

THIN, STRETCHABLE AND FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREFOR

20250393134

2025-12-25

METHODS OF FORMING A STRUCTURE ON A SUBSTRATE AND ASSOCIATED METHODS OF FILLING A RECESSED FEATURE ON A SUBSTRATE

20250142732

2025-05-01

CONDUCTIVE LINE REPAIRING METHOD

20240431033

2024-12-26

PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD

20240349425

2024-10-17

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE

20220312599

2022-09-29

Exposure system, circuit board, and method for making circuit board

20220298374

2022-09-22

INK COMPOSITION, KIT, METHOD OF MANUFACTURING A DEFORMABLE CONDUCTOR UTILIZING THE INK COMPOSITION, DEFORMABLE CONDUCTOR, ELECTRONIC DEVICE COMPRISING THE DEFORMABLE CONDUCTOR, METHOD OF MANUFACTURING A CONDUCTOR, CONDUCTOR AND ELECTRONIC DEVICE COMPRISING THE CONDUCTOR

20210392756

2021-12-16

Method for connecting surface-mount electronic components to a circuit board

20210251083

2021-08-12

PCB structure and electronic device including the same

#10

20210185831

2021-06-17

Selective soldering with photonic soldering technology

#11

20200113063

2020-04-09

Method for reducing thin films on low temperature substrates

#12

20190198475

2019-06-27

Laser ablation for wire bonding on organic solderability preservative surface

#13

20190171311

2019-06-06

Method of forming a composite conductive film

#14

20180139852

2018-05-17

Printed circuit board and methods to enhance reliability

#15

20180139850

2018-05-17

ELECTRICAL, PLATING AND CATALYTIC USES OF METAL NANOMATERIAL COMPOSITIONS

#16

20180103546

2018-04-12

Method for reducing thin films on low temperature substrates

#17

20180092209

2018-03-29

System with field-assisted conductive adhesive bonds

#18

20170298197

2017-10-19

Suspension polymerization compositions, methods and uses thereof

#19

20170247519

2017-08-31

Uspension polymerization compositions, methods and uses thereof

#20

20170231100

2017-08-10

CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

#21

20170228055

2017-08-10

Method of forming a composite conductive film

#22

20170202091

2017-07-13

Carrying device, wet etching apparatus and usage method thereof

#23

20170156217

2017-06-01

DESMEAR TREATMENT DEVICE AND DESMEAR TREATMENT METHOD

#24

20170094799

2017-03-30

Integrated circuit and method that utilize a shape memory material

#25

20170027063

2017-01-26

Electrical, plating and catalytic uses of metal nanomaterial compositions

#26

20160316568

2016-10-27

Metal substrate and method of manufacturing the same

#27

20160157344

2016-06-02

STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME

#28

20160007455

2016-01-07

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND CIRCUIT BOARD

#29

20150334825

2015-11-19

Methods for forming embedded traces

#30

20150257253

2015-09-10

Peelable metal substrate having modified surface and method of manufacturing the same

#31

20150181714

2015-06-25

SYSTEMS AND METHODS FOR CONTINUOUS FLASH LAMP SINTERING

#32

20150176133

2015-06-25

Method for reducing thin films on low temperature substrates

#33

20150050430

2015-02-19

ANNEALING PROCESS FOR INTEGRATED GAS SENSORS

#34

20150027759

2015-01-29

Conductive element and method of manufacturing the same, wiring element, and master copy

#35

20150000960

2015-01-01

Composite conductive films with enhanced surface hardness

#36

20140362590

2014-12-11

ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE

#37

20140332734

2014-11-13

CONDUCTIVE PATTERN FORMATION METHOD AND COMPOSITION FOR FORMING CONDUCTIVE PATTERN VIA PHOTO IRRADIATION OR MICROWAVE HEATING

#38

20140224762

2014-08-14

Substrate manufacturing method

#39

20090181184

2009-07-16

Method for reducing thin films on low temperature substrates