H05K2203/13 - CPC Classification Index

ClassID:

234884 ⎘

H05K2203/13 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by Moulding and encapsulation; Deposition techniques; Protective layers

Sub-classes:

H05K2203/1305 » Moulding and encapsulation 60
H05K2203/1305 » Moulding and encapsulation 60
H05K2203/1333 » Deposition techniques, e.g. coating 20
H05K2203/1333 » Deposition techniques, e.g. coating 20
H05K2203/1377 » Protective layers 52
H05K2203/1377 » Protective layers 52

Recent Application in this class:

20250203767

2025-06-19

PRINTED WIRING BOARD

20230276570

2023-08-31

Printed wiring board

20210076507

2021-03-11

Multilayer circuit board and manufacturing method therefor

20210045240

2021-02-11

Manufacturing method of insulated metal substrate

20210045239

2021-02-11

Insulated metal substrate

20200396840

2020-12-17

IN-MOLD ELECTRONICS AND THEIR METHODS OF MANUFACTURE

20200229303

2020-07-16

Insulated metal substrate and manufacturing method thereof

20170316295

2017-11-02

Printing system architecture for encoding chip-less RFID tags in real time

20160358058

2016-12-08

Printing system architecture for encoding chip-less RFID tags in real time

#10

20150181709

2015-06-25

Electronic module subassemblies