Patents-Review.com
ClassID:

234921 ⎘

H05K2203/1554 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Position of the PCB during processing Rotating or turning the PCB in a continuous manner

Recent Application in this class:
#1
20260129768
2026-05-07

FLIPPING DEVICE AND ELECTROPLATING PRODUCTION LINE

 #2
20240314936
2024-09-19

PLATING APPARATUS

 #3
20240155773
2024-05-09

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

 #4
20230269881
2023-08-24

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR CONTROLLING ETCHING THEREOF

 #5
20200221579
2020-07-09

Apparatus for manufacturing printed circuit boards

 #6
20200107455
2020-04-02

Method for connecting stacked circuit boards

 #7
20200043696
2020-02-06

Substrate side-deposition apparatus

 #8
20180093328
2018-04-05

Component mounting apparatus and component mounting method

 #9
20140150257
2014-06-05

Method of manufacturing a circuit board

 #10
20140120245
2014-05-01

Plating method

 #11
20140015183
2014-01-16

Rotary conveying equipment for exposing substrate

 #12
20130342592
2013-12-26

INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELATED APPARATUS AND METHOD

 #13
20120292377
2012-11-22

Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board

 #14
20120211267
2012-08-23

PRINTED CIRCUIT BOARD SUBSTRATE

 #15
20110056074
2011-03-10

APPARATUS AND METHOD FOR ELECTRONIC CIRCUIT MANUFACTURE

 #16
20100327014
2010-12-30

APPARATUS AND METHOD FOR FLUID DISPENSING

 #17
20100278638
2010-11-04

Rotating device

 #18
20100215843
2010-08-26

METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SURFACES

 #19
20100206227
2010-08-19

Method and apparatus for applying electronic circuits to curved surfaces

 #20
20100206188
2010-08-19

Apparatus for applying electronic circuits to curved surfaces

 #21
20100170087
2010-07-08

Method of manufacturing a circuit board

 #22
20100031501
2010-02-11

METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD WITH FILLER

 #23
20090260867
2009-10-22

Method for manufacturing printed circuit board

 #24
20090181226
2009-07-16

METHOD FOR MANUFACTURING METAL LINE EMBEDDED IN SUBSTRATE AND METHOD FOR MANUFACTURING DISPLAY PANEL HAVING THE EMBEDDED METAL LINE

 #25
20090166061
2009-07-02

PCB strip, PCB strip assembly device using the PCB strip, a method of using the PCB strip assembly device, and a method of fabricating a PCB strip

 #26
20090140426
2009-06-04

Flip chip package and method for manufacturing the same

 #27
20090032962
2009-02-05

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

 #28
20080197493
2008-08-21

Integrated circuit including conductive bumps

 #29
20080028956
2008-02-07

Method for applying electronic circuits to curved surfaces

 #30
20070169341
2007-07-26

Method of manufacturing a circuit board

 #31
20060177568
2006-08-10

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

 #32
20050037138
2005-02-17

Process for partial coating of printed circuit boards and device for carrying out the process

 #33
20050034893
2005-02-17

Circuit board design