ClassID:

233768

H05K3/0061 - page 4 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Recent Application in this class:
#901
20050121760
2005-06-09

Semiconductor module

#902
20050117351
2005-06-02

Hybrid illuminator

#903
20050117302
2005-06-02

Module structure and module comprising it

#904
20050109534
2005-05-26

Circuit board with localized stiffener for enhanced circuit component reliability

#905
20050099778
2005-05-12

Circuit assembly and method for producing the same

#906
20050092814
2005-05-05

Electrical circuit apparatus and method

#907
20050087860
2005-04-28

Multilayered substrate for semiconductor device

#908
20050087284
2005-04-28

Method of fabricating an RF substrate with selected electrical properties

#909
20050085011
2005-04-21

Thermally enhanced packaging structure and fabrication method thereof

#910
20050083590
2005-04-21

Lens barrel and imaging apparatus

#911
20050078416
2005-04-14

FPC with via holes with filler being welded to suspension and drive apparatus

#912
20050077362
2005-04-14

Stacked small memory card

#913
20050061544
2005-03-24

Circuit board having metallic plate, printed circuit board and flexible circuit board

#914
20050056457
2005-03-17

Electronic control unit

#915
20050052858
2005-03-10

Compact radio equipment and method of mounting the same

#916
20050047095
2005-03-03

Circuit configuration member and method of fabricating the same

#917
20050032398
2005-02-10

Interconnecting module for the base of electronic equipment casing

#918
20050030823
2005-02-10

Electronic circuit device

#919
20050029546
2005-02-10

Mounting device for high frequency microwave devices

#920
20050024834
2005-02-03

Heatsinking electronic devices

#921
20050023030
2005-02-03

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

#922
20050020115
2005-01-27

Method for connecting multiple coaxial cables to a PCB

#923
20050013055
2005-01-20

Method of head stack assembly flexible circuit assembly attached to an actuator arm

#924
16285241
2020-02-04

Circuit board, semiconductor device including the same, and manufacturing method thereof

#925
16022125
2019-10-08

Microelectronic modules including thermal extension levels and methods for the fabrication thereof

#926
15862050
2019-04-02

Printed circuit board mounting with tabs

#927
14969596
2017-03-21

Integrated power module

#928
14230941
2015-08-11

Package structure and stacked package module with the same