Patents-Review.com
ClassID:

233786 ⎘

H05K3/041 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Recent Application in this class:
#1
20260136471
2026-05-14

Circuit and Fuse Fabrication Process for Flexible Printed Circuit Board (FPCB)

 #2
20260122777
2026-04-30

FLEXIBLE DIE-CUT CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

 #3
20260068058
2026-03-05

TAPE AND MANUFACTURING METHOD THEREOF

 #4
20240206052
2024-06-20

METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PCBA LEVEL

 #5
20230380072
2023-11-23

TAPE AND MANUFACTURING METHOD THEREOF

 #6
20230309216
2023-09-28

Method and structure for alignment of lens to optical product at PCBA level

 #7
20210092853
2021-03-25

Reel-to-reel lamination methods and devices in FPC fabrication

 #8
20210092851
2021-03-25

Reel-to-reel laser sintering methods and devices in FPC fabrication

 #9
20210092837
2021-03-25

Reel-to-reel flexible printed circuit fabrication methods and devices

 #10
20210086306
2021-03-25

Reel-to-reel laser ablation methods and devices in FPC fabrication

 #11
20180010775
2018-01-11

Metal PCB assembly for vehicle lamp and manufacturing method thereof

 #12
20170358700
2017-12-14

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

 #13
20140090698
2014-04-03

Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body

 #14
20120222290
2012-09-06

METHOD AND SYSTEM FOR PREPARING WIRELESS COMMUNICATION CHIPS FOR LATER PROCESSING

 #15
20120208411
2012-08-16

Method for manufacturing a foil-like electrical connector for connecting solar cells

 #16
20120137506
2012-06-07

APPARATUS FOR FORMING A WIRELESS COMMUNICATION DEVICE

 #17
20110248892
2011-10-13

FILM ANTENNA AND METHOD FOR MANUFACTURING THE SAME

 #18
20110220276
2011-09-15

Radio frequency (RF) antenna containing element and methods of making the same

 #19
20110120756
2011-05-26

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

 #20
20110116248
2011-05-19

Circuit board, its manufacturing method, and joint box using circuit board

 #21
20110050202
2011-03-03

Electric sensor web, system and a method for its manufacture

 #22
20110001670
2011-01-06

Radio frequency (RF) antenna containing element and methods of making the same

 #23
20100276182
2010-11-04

Method for hot embossing at least one conductive track onto a substrate

 #24
20100218371
2010-09-02

Apparatus for forming a wireless communication device

 #25
20100201002
2010-08-12

Semiconductor device and process for producing same

 #26
20100095519
2010-04-22

Apparatus for manufacturing a wireless communication device

 #27
20100089891
2010-04-15

Apparatus for preparing an antenna for use with a wireless communication device

 #28
20100053903
2010-03-04

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

 #29
20100000076
2010-01-07

Method and system for preparing wireless communication chips for later processing

 #30
20090242239
2009-10-01

Process for preparing a heatsink system and heatsink system obtainable by said process

 #31
20090199966
2009-08-13

Method for making radio frequency (RF) antenna containing element

 #32
20080173390
2008-07-24

Finger pattern formation for thin film solar cells

 #33
20080168647
2008-07-17

Method of producing antenna elements for a wireless communication device

 #34
20080138500
2008-06-12

Method and Machine for Manufacturing Electrical Circuits

 #35
20080116611
2008-05-22

Method of Manufacturing Multilayer Wiring Board

 #36
20080068280
2008-03-20

Mechanism of producing a conductor pattern on a substrate

 #37
20080047130
2008-02-28

METHOD FOR FABRICATING ANTENNA UNITS

 #38
20080010809
2008-01-17

Method of manufacturing a sticker type antenna

 #39
20070297162
2007-12-27

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

 #40
20070269935
2007-11-22

Fabrication of conductive micro traces using a deform and selective removal process

 #41
20070218257
2007-09-20

Circuit board, its manufacturing method, and joint box using circuit board

 #42
20070214637
2007-09-20

Method and device for manufacturing a conductive member for non-contact type data carrier

 #43
20070171129
2007-07-26

Radio frequency (RF) antenna containing element and methods of making the same

 #44
20070094874
2007-05-03

Methods for forming connection structures for microelectronic devices

 #45
20070074384
2007-04-05

Method and system for manufacturing a wireless communication device

 #46
20070060223
2007-03-15

Manufacturing method for a wireless communication device and manufacturing apparatus

 #47
20070049130
2007-03-01

Wiring substrate, method of manufacturing wiring substrate, and liquid droplet ejection head

 #48
20070012775
2007-01-18

Method of fabricating a security tag in an integrated surface processing system

 #49
20060288563
2006-12-28

Method of preparing an antenna

 #50
20060032670
2006-02-16

Connection structures for microelectronic devices and methods for forming such structures

 #51
20060026819
2006-02-09

Manufacture of RFID tags and intermediate products therefor

 #52
20050183264
2005-08-25

Method for aligning capacitor plates in a security tag and a capacitor formed thereby

 #53
20050064652
2005-03-24

Circuit forming method

 #54
20050025944
2005-02-03

Method of manufacturing multilayer wiring board

 #55
16237269
2019-12-03

Methods and systems for a flexible circuit