ClassID:

233794

H05K3/064 - page 2 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process; Etching masks Photoresists

Recent Application in this class:
#301
20080232077
2008-09-25

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME

#302
20080220373
2008-09-11

Method for forming a photoresist-laminated substrate, method for plating an insulating substrate, method for surface treating of a metal layer of a circuit board, and method for manufacturing a multi layer ceramic condenser using metal nanoparticles aerosol

#303
20080216313
2008-09-11

Method for fabricating IC board without ring structure

#304
20080210661
2008-09-04

Method For Forming Via Hole in Substrate For Flexible Printed Circuit Board

#305
20080209722
2008-09-04

Method for forming via hole having fine hole land

#306
20080202803
2008-08-28

Wiring structure, forming method of the same and printed wiring board

#307
20080202801
2008-08-28

Method for manufacturing a circuit board structure

#308
20080178464
2008-07-31

METHOD FOR FABRICATING CIRCUIT BOARD

#309
20080153041
2008-06-26

Exposure Method and Apparatus

#310
20080118681
2008-05-22

PRINTED WIRING BOARD MANUFACTURING APPARATUS, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND ELECTRONIC DEVICE

#311
20080106880
2008-05-08

Wiring board and method of manufacturing the same

#312
20080075841
2008-03-27

Apparatus and method incorporating discrete passive components in an electronic package

#313
20080052903
2008-03-06

Method of Forming Aluminum Based Alloy Wiring Circuit and Method of Forming Element Structure of Display Device

#314
20080037198
2008-02-14

Methods of forming individual formed-on-foil thin capacitors for embedding inside printed wiring boards and semiconductor packages

#315
20080026316
2008-01-31

Photoresist composition with antibacterial agent

#316
20080014530
2008-01-17

Graft Pattern-Forming Method, Graft Pattern Material, Lithography Method, Conductive Pattern - Forming Method, Conductive Pattern, Color Filter Producing Method, Color Filter, and Mircrolens Producing Method

#317
20080014409
2008-01-17

Method of making a circuitized substrate

#318
20080013679
2008-01-17

Marking apparatus used in a process for producing multi-layered printed circuit board

#319
20080010823
2008-01-17

Method for increasing a production rate of printed wiring boards

#320
20080010822
2008-01-17

Method for increasing a production rate of printed wiring boards

#321
20080005902
2008-01-10

Method for increasing a production rate of printed wiring boards

#322
20080003527
2008-01-03

Wiring line structure and method for forming the same

#323
20080003351
2008-01-03

Method for the manufacture of printed circuit boards with plated resistors

#324
20080002165
2008-01-03

Method And Apparatus For Producing Printed-Circuit-Board

#325
20070295606
2007-12-27

Manufacturing process of embedded type flexible or rigid printed circuit board

#326
20070287285
2007-12-13

Manufacturing method of circuit board

#327
20070281459
2007-12-06

Multilayer substrate manufacturing method

#328
20070281390
2007-12-06

Manufacturing method of a package substrate

#329
20070266555
2007-11-22

Apparatus for making circuitized substrates in a continuous manner

#330
20070235218
2007-10-11

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

#331
20070218676
2007-09-20

Method for forming metal bumps

#332
20070207607
2007-09-06

Ball grid array substrate having window and method of fabricating same

#333
20070194456
2007-08-23

Flexible circuit substrate for flip-chip-on-flex applications

#334
20070181994
2007-08-09

Circuit board manufacturing method and circuit board

#335
20070169958
2007-07-26

Mask for exposure

#336
20070163111
2007-07-19

Method for manufacturing a multilayer flexible wiring board

#337
20070138603
2007-06-21

Apparatus and method incorporating discrete passive components in an electronic package

#338
20070132087
2007-06-14

Via hole having fine hole land and method for forming the same

#339
20070120229
2007-05-31

Wet etched insulator and electronic circuit component

#340
20070117339
2007-05-24

Via including multiple electrical paths

#341
20070117261
2007-05-24

Multilayer printed wiring board and method for producing the same

#342
20070102396
2007-05-10

Method of making a circuitized substrate

#343
20070093049
2007-04-26

Electronic interconnects and methods of making same

#344
20070087457
2007-04-19

METHOD FOR INSPECTING AND MENDING DEFECT OF PHOTO-RESIST AND MANUFACTURING PROCESS OF PRINTED CIRCUIT BOARD

#345
20070072129
2007-03-29

METHOD FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARDS

#346
20070062730
2007-03-22

CONTROLLED DEPTH ETCHED VIAS

#347
20070048447
2007-03-01

SYSTEM AND METHOD FOR FORMING PATTERNED COPPER LINES THROUGH ELECTROLESS COPPER PLATING

#348
20070034596
2007-02-15

Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask

#349
20070029204
2007-02-08

Manufacturing process of emboss type flexible or rigid printed circuit board

#350
20070026662
2007-02-01

Semiconductor device and method of manufacturing the same

#351
20070017090
2007-01-25

Method of forming metal plate pattern and circuit board

#352
20060261489
2006-11-23

Semiconductor memory card and method of fabricating the same

#353
20060246713
2006-11-02

Wiring line structure and method for forming the same

#354
20060240641
2006-10-26

Apparatus and method for making circuitized substrates in a continuous manner

#355
20060240364
2006-10-26

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

#356
20060236534
2006-10-26

Method for manufacturing printed wiring board

#357
20060231198
2006-10-19

Manufacturing process: how to construct constraining core material into printed wiring board

#358
20060219567
2006-10-05

Fabrication method of conductive bump structures of circuit board

#359
20060200332
2006-09-07

CAD system for a printed circuit board

#360
20060199394
2006-09-07

Etching solution, method of etching and printed wiring board

#361
20060169486
2006-08-03

Wired circuit board assembly

#362
20060137904
2006-06-29

Method of manufacturing a multilayer printed wiring board

#363
20060131729
2006-06-22

Ball grid array substrate having window and method of fabricating same

#364
20060127690
2006-06-15

Metal photoetching product and production method thereof

#365
20060124583
2006-06-15

Method for the manufacture of printed circuit boards with plated resistors

#366
20060115770
2006-06-01

Printed circuit board including embedded capacitor and method of fabricating same

#367
20060101639
2006-05-18

Innerlayer panels and printed wiring boards with embedded fiducials

#368
20060079127
2006-04-13

Structure and method of making interconnect element, and multilayer wiring board including the interconnect element

#369
20060065439
2006-03-30

Wiring board and wiring board manufacturing method

#370
20060060960
2006-03-23

Printed circuit board having chip package mounted thereon and method of fabricating same

#371
20060057341
2006-03-16

Multilayer substrate and manufacturing method thereof

#372
20060049516
2006-03-09

Nickel/gold pad structure of semiconductor package and fabrication method thereof

#373
20060030140
2006-02-09

Method of making bondable leads using positive photoresist and structures made therefrom

#374
20060011382
2006-01-19

Method of manufacturing a wiring board

#375
20050282309
2005-12-22

Fabrication process circuit board with embedded passive component

#376
20050274007
2005-12-15

Method for increasing a production rate of printed wiring boards

#377
20050242997
2005-11-03

Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit

#378
20050236275
2005-10-27

Method of using an etchant solution for removing a thin metallic layer

#379
20050196902
2005-09-08

METHOD OF FABRICATING FILM CARRIER

#380
20050196707
2005-09-08

Patterned conductive coatings

#381
20050194349
2005-09-08

Method of fabricating film carrier

#382
20050175385
2005-08-11

Method of producing printed circuit board with embedded resistor

#383
20050161426
2005-07-28

Image-recording apparatus and image-recording process

#384
20050161250
2005-07-28

Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board

#385
20050153567
2005-07-14

Method of forming patterns

#386
20050142551
2005-06-30

Fabrication of a high resolution biological molecule detection device with aluminum electrical conductors

#387
20050133918
2005-06-23

Via including multiple electrical paths

#388
20050130431
2005-06-16

Method for making a package substrate without etching metal layer on side walls of die-cavity

#389
20050124091
2005-06-09

Process for making circuit board or lead frame

#390
20050111206
2005-05-26

Method of making interlayer panels

#391
20050104205
2005-05-19

Encapsulated lead having step configuration

#392
20050101136
2005-05-12

Etching method and method of manufacturing circuit device using the same

#393
20050082280
2005-04-21

Flexible electric circuit for heating comprising a metallised fabric

#394
20050067378
2005-03-31

Method for micro-roughening treatment of copper and mixed-metal circuitry

#395
20050037281
2005-02-17

Light-sensitive sheet comprising support, first and second light-sensitive layers and barrier layer

#396
20050036783
2005-02-17

Pattern production system, exposure system, and exposure method

#397
20050025946
2005-02-03

Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer

#398
20050008360
2005-01-13

Chemical processing apparatus for manufacturing circuit substrates

#399
20050006763
2005-01-13

Circuit substrate, semiconductor module and method of manufacturing circuit substrate

#400
20050003607
2005-01-06

Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages

#401
16879951
2020-10-27

Manufacturing method for circuit board and circuit board thereof

#402
14604956
2016-03-29

Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole