H05K3/187 - CPC Classification Index

ClassID:

233829 ⎘

H05K3/187 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Recent Application in this class:

20250340994

2025-11-06

PROCESS FOR WET-CHEMICAL FORMATION OF A STABLE TIN OXIDE LAYER FOR PRINTED CIRCUIT BOARDS

20240407107

2024-12-05

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMICONDUCTORS

20190360104

2019-11-28

Method for formation of electro-conductive traces on polymeric article surface

20190048472

2019-02-14

Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias

20190024238

2019-01-24

Wet type processing apparatus for resin film

20190010608

2019-01-10

METHOD FOR PRODUCING ELECTROCONDUCTIVE LAMINATE, LAMINATE, AND ELECTROCONDUCTIVE LAMINATE

20180347038

2018-12-06

Elimination of H2S in immersion tin plating solution

20180340261

2018-11-29

PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM

20180340260

2018-11-29

Plating bath composition and method for electroless plating of palladium

#10

20170342566

2017-11-30

WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER

#11

20170251557

2017-08-31

HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH IONIC CATALYSTS

#12

20170171988

2017-06-15

ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES

#13

20170145567

2017-05-25

Method for electroless plating of palladium phosphorus directly on copper, and a plated component therefrom

#14

20170135222

2017-05-11

METHOD FOR PRODUCING PLATED COMPONENT

#15

20170121823

2017-05-04

Plating bath composition and method for electroless plating of palladium

#16

20160374210

2016-12-22

MICROELECTRONIC BUILD-UP LAYERS AND METHODS OF FORMING THE SAME

#17

20160348246

2016-12-01

Pre-treatment process for electroless plating

#18

20160316558

2016-10-27

Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same

#19

20160278206

2016-09-22

PRINTED CIRCUIT BOARD

#20

20160102413

2016-04-14

Tin or tin alloy plating liquid

#21

20160090251

2016-03-31

Electrostatic adsorptive belt and method of manufacturing thereof, assembly, and conveyance system

#22

20150376795

2015-12-31

Formaldehyde free electroless copper plating compositions and methods

#23

20150334825

2015-11-19

Methods for forming embedded traces

#24

20150197856

2015-07-16

Use of titania precursor composition pattern

#25

20150124040

2015-05-07

Electrostatic adsorptive belt and method of manufacturing thereof, assembly, and conveyance system

#26

20140226346

2014-08-14

Wiring board and light emitting device

#27

20140178572

2014-06-26

Formaldehyde free electroless copper plating compositions and methods

#28

20140102910

2014-04-17

Method for copper plating

#29

20120298515

2012-11-29

METHOD AND DEVICE FOR THE WET-CHEMICAL TREATMENT OF MATERIAL TO BE TREATED

#30

20120119352

2012-05-17

Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same

#31