BAW-filter operating using bulk acoustic waves and passive components forming a balun

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayered substrate and method of manufacturing the same

CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME

Flexible display and method for manufacturing the same

Electromagnetic interference shielding structures

Electronic device and fabrication method thereof

CROSSTALK CANCELATION IN STRIPLINES

Manufacturing strain sensitive sensors and/or strain resistant conduits from a metal and carbon matrix

IMAGING ELEMENT MODULE AND METHOD FOR MANUFACTURING THE SAME

MOBILE INDEPENDENT LOADING MECHANISM

Environmental sensitive electronic device package and manufacturing method thereof

Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB

RECESSED DISCRETE COMPONENT MOUNTING ON ORGANIC SUBSTRATE

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRY

Over voltage protection for a thin oxide load circuit

Plug tail systems

Single-layer projected capacitive touch panel and method of manufacturing the same

Optical Touch Panel Having SMT Components As Optical Gates

Electronic Assembly

Touch panel having virtual function button, method of manufacturing the same, and method of identifying touch conflict on the same

Electronic component embedded substrate and manufacturing method thereof

Method of producing a cermet-containing bushing for an implantable medical device

Remotely Readable Input Forms

Multilayer wiring board and method for manufacturing the same

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing printed circuit board

Systems, methods, and devices for sealing LED light sources in a light module

SUBSTRATE INDUCTIVE DEVICE METHODS AND APPARATUS

Electronic package module and method of manufacturing the same

Heat dissipation lid having direct liquid contact conduits

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Apparatus for Detecting Particles in a Fluid and a Method of Fabricating the Same

LAMINATED BASE MATERIAL, SUBSTRATE USING LAMINATED BASE MATERIAL, AND METHOD OF MANUFACTURING SUBSTRATE

Printed circuit board, and method for manufacturing printed circuit board

Wiring board with built-in electronic component and method for manufacturing the same

Receiver optical assemblies (ROAs) having photo-detector remotely located from transimpedance amplifier, and related components, circuits, and methods

Receiver optical assemblies (ROAs) having photo-detector remotely located from transimpedance amplifier, and related components, circuits, and methods

MOSFET stack package

Printed circuit board features of a portable computer

UNIVERSAL MEASURING MODULE FOR MEDICAL APPLICATION AND METHOD FOR ASSEMBLING THE MEASURING MODULE

Circuit board incorporating electronic component and manufacturing method thereof

IN-MOLDED CAPACITIVE SWITCH

METHOD FOR INTEGRATING CAMERA ON LIQUID CRSYTAL PANEL, LIQUID CRYSTAL PANEL AND LIQUID-CRYSTAL DISPLAY DEVICE

Touch panel and manufacturing method thereof

Mixer fabrication technique and system using the same

Method of making a light-emitting-diode lamp tube

LED strobe light with peripheral pattern display

Foldable machines

Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures

Hall sensor mounting in an implantable blood pump

Surface mount zipcord connector and method of making electrical contact with zipcord conductors

Sensor mounting in an implantable blood pump

Surface mount connector for electrically isolating two insulated conductors

METHOD AND SYSTEM FOR REDUCING AUDIBLE AND/OR ELECTRICAL NOISE FROM ELECTRICALLY OR MECHANICALLY EXCITED CAPACITORS

Manufacturing method of flexible display substrate

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT

Systems, structures and materials for electronic device cooling

Thin leadframe QFN package design of RF front-ends for mobile wireless communication

Method of supplying power on a circuit board assembly

Electronic module and method for the production thereof

WIRELESS COMMUNICATIONS APPARATUS

COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONTAINING MODULE

Ejectable component assemblies in electronic devices

Wireless communications antenna assembly

3-D ANTENNA FOR WIRELESS COMMUNICATIONS

IC package and assembly

Printed wiring board and method for manufacturing printed wiring board

Method for producing base substrate, method for producing electronic device, base substrate, and electronic apparatus

High heat capacity electronic components and methods for fabricating

Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product

CIRCUIT BOARD SYSTEM WITH MECHANICAL PROTECTION

Apparatus for manufacturing camera module

Vertically separated pass through conveyor system and method in surface mount technology process equipment

Mounting structure and mounting method

Electronic device, method for producing the same, and printed circuit board comprising electronic device

TOUCHSCREEN AND MANUFACTURING PROCESS THEREOF

Transformer with planar primary winding

Heat-sink device intended for at least one electronic component and corresponding method

Electrical device

Thin multi-layered structures providing rigidity and conductivity

Grid arrays with enhanced fatigue life

Method of manufacturing a flexible electronics module

CIRCUIT MODULE AND METHOD OF MANUFACTURING SAME

ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE

Terminal with terminal bender having stable bend, wiring member, and head suspension

Coefficient of thermal expansion compensating compliant component

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process

Inverting head

METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY HAVING A SHAPED BODY

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Method and arrangement for attaching a chip to a printed conductive surface

Electrically activatable integrated mechanical anti-rollback device with one or more positions

MULTIPLE DRIVER POWER SUPPLY

Power electronic system and method of assembly

Method for assembling a circuit board

Module substrate and method for manufacturing module substrate

High performance electrical circuit structure

Storage bridge bay canister attachment system and method of forming same

MOUNTING HEAD UNIT, COMPONENT MOUNTING APPARATUS, AND METHOD OF MANUFACTURING A SUBSTRATE

PACKAGING TECHNIQUES AND CONFIGURATIONS

Circuit module and method for producing such a circuit module

Magnetic field sensor and method for manufacturing a magnetic field sensor

Area-efficient distributed device structure for integrated voltage regulators

Wiring board and method for manufacturing the same

Micro-dispensing multi-layered 3D objects with curing steps

METHOD FOR MANUFACTURING A CIRCUIT

Method for manufacturing packaged light emitting diode

Strongly coupled inorganic-graphene hybrid materials, apparatuses, systems and methods

Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight

LED lighting assembly and method of lighting for a merchandise display

METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTURE

Wiring board and method for manufacturing the same

Sensor package and method for producing a sensor package

Vertically separated pass through conveyor system and method in surface mount technology process equipment

Apparatus and method for manufacturing double-sided mounting substrate

Optical transceiver and production method thereof

Camera module and method of manufacturing same

Electronic package structure

Method of manufacturing storage apparatus

Method of manufacturing stacked mounting structure

Air cavity package configured to electrically couple to a printed circuit board and method of providing same

Optical communication module and method of manufacturing the same

THERMAL INTERFACE MATERIAL APPLICATION FOR INTEGRATED CIRCUIT COOLING

Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board

Organic light-emitting display apparatus and method of manufacturing the same

Device for converting signal

PIN ADJUSTER FOR ELECTRONIC COMPONENT

Radio-frequency modules having tuned shielding-wirebonds

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Injection molded control panel with in-molded decorated plastic film that includes an internal connector

Injection molded control panel with in-molded decorated plastic film

Wiring board and method for manufacturing same

PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF

Circuit configuration having a prescribed capacitance, and method and device for the production thereof

Enhanced modularity in heterogeneous 3D stacks

Enhanced modularity in heterogeneous 3D stacks

Enhanced Modularity in Heterogeneous 3D Stacks

Low-cost transformer assembly

Systems and methods for breakaway RFID tags

BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

Methods for combining light emitting devices in a white light emitting apparatus that mimics incandescent dimming characteristics and solid state lighting apparatus for general illumination that mimic incandescent dimming characteristics

Electronic assembly

Systems and methods for interrogator multiple radio frequency identification enabled documents

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure

Stretchable electronics modules and circuits

Thermal interface material application for integrated circuit cooling

Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures

Storage apparatus and method of manufacturing the same

Light emitting device module

Spintronic phase comparator permitting direct phase probing and mapping of electromagnetic signals

Embedded printed circuit board and method of manufacturing the same

Enhanced modularity in heterogeneous 3D stacks

Single-layer projected capacitive touch panel and method of manufacturing the same

Sensor package having a sensor chip

Plug tail systems

Quick mounting system and media for video recording

ELECTRO DEVICE EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURNG METHOD THEREOF

Circuit system with leads and method of manufacture thereof

Head nozzle and apparatus for mounting electronic parts

Actuator for maintaining alignment of die detachment tools

SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION

Area-efficient distributed device structure for integrated voltage regulators

FLUORESCENT LAMP SUPPORT

Systems and methods for stirring electromagnetic fields and interrogating stationary RFID tags

Systems and methods for stirring electromagnetic fields and interrogating stationary RFID tags

Systems, methods, and devices for sealing LED light sources in a light module

PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF

Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE STRUCTURE

Electronic control unit assembling method, electronic control unit and vehicle brake hydraulic pressure control apparatus

Cermet-containing bushing for an implantable medical device

Method of making a 3-D structure

Packaging techniques and configurations

Tear-proof circuit

Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process

Method of conveying printed circuit boards

VERTICALLY SEPARATED PASS THROUGH CONVEYOR SYSTEM AND METHOD IN SURFACE MOUNT TECHNOLOGY PROCESS EQUIPMENT

Multi-piece board and fabrication method therefor

Modular printing system having vertically separated pass through conveyor system

Method of processing electronic substrates using vertically separated pass through conveyor system

Vertically separated pass through conveyor system and method in surface mount technology process equipment

Apparatus for depositing viscous material including transport system with upper and lower tracks

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method of fabricating a circuit structure

Method of bonding two structures together with an adhesive line of controlled thickness

Method of fabricating a base layer circuit structure

Stretchable and foldable electronic devices

Structural analysis of a printed wiring substrate

Optical touch panel having SMT components as optical gates

METHODS FOR CONFIGURABLE MANUFACTURING AND APPARATUS

THIN FLEXIBLE CIRCUITS

ELECTRONIC PACKAGE STRUCTURE

Plug tail lighting switch and control system

Analyzing model creating apparatus and method, and computer-readable storage medium to create a model using a minimum part interval between parts

Composite layer for an electronic device

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

In-molded capacitive switch

Systems and methods for interrogator multiple radio frequency identification enabled documents

Systems and methods for breakaway RFID tags

Systems and methods for stirring electromagnetic fields and interrogating stationary RFID tags

Systems and methods for synchronizing a plurality of RFID interrogators in a theatre of operation

Method for manufacturing a composite layer for an electronic device

Area-efficient distributed device structure for integrated voltage regulators

Methods for making conforming shielded form for electronic component assemblies

Lead frame and method for stacking discrete components to be embedded in semiconductor device

Optoelectronically functional multilayer structure and related manufacturing method

Tamper-respondent assembly with structural material within sealed inner compartment

Higher density multi-component and serial packages

Method for forming a circuit board with a substrate made of silicon

Internally die-referenced thermal transfer plate

Package structure and manufacturing method thereof

Systems and methods for creating fluidic assembly structures on a substrate

Photonic transceiving device package structure

Electronic module with cooling system for package-on-package devices

Heat dissipation approach in chip on board assembly by using stacked copper microvias

Embedded components in a substrate

Nano-copper pillar interconnects and methods thereof

Methods of attaching components on fabrics using metal braids

Method of attaching electronic module on fabrics by stitching plated through holes

Ground lid opening on a substrate

Apparatus and methods for placement of discrete components on internal printed circuit board layers

Power distribution network

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Integrated circuit package with distributed clock network

Circuit boards defining regions for controlling a dielectric constant of a dielectric material