Electrical connector

Nanoscale metal paste for interconnect and method of use

Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate

HEAT SINK DEVICE

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

Manufacturing method of semiconductor device

PRINTED WIRING BOARD

Semiconductor package and mounting method thereof

Component with bonding adhesive

Electrocoated contacts compatible with surface mount technology

Electrical connection between cable and printed circuit board for high data speed and high signal frequency

PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

Display apparatus and method for reducing electromagnetic interference thereof

Dome switch, method of manufacturing the same, and keypad assembly having the same

METHOD OF COUPLING PHOTOVOLTAIC CELLS AND FILM FOR IMPLEMENTING IT

Stackable electronic component

Shield structure

Printed circuit board

Printed board with component mounting pin

Printed board with component mounting pin

Board mounted structure of vibration motor

Surface mounted heat sink and electromagnetic shield

INTERCONNECT JOINT

Camera device and electronic device including the same

Method for preventing void formation in a solder joint

Printed circuit board and display device using the same

Electronic apparatus having self-diagnosis capability

Structure of tag integrated circuit flexible board

Surface mount type vibration motor and fixation structure

Semiconductor package and method for fabricating the same

Method for manufacturing a tag integrated circuit flexible board

Electronic component and manufacturing method therefor

Electronic device with a base plate

Method of bonding probes and method of manufacturing a probe card using the same

Assembling lighting elements onto a substrate

Transferable micro spring structure

Conductive hook and loop printed circuit board attachment

Carrier For Electrical Components With Soldered-On Cooling Body

Quad flat no-lead chip carrier with standoff

Method using a carrier for manufacturing a memory device and manufacturing method of a memory device using the same and memory device using the same

Mounting clips for use with electromagnetic interference shielding and methods of using the same

Method for evaluating solder joint portion

Gas venting component mounting pad

Circular electrical connector

Soldering method and method of manufacturing semiconductor device including soldering method

QUAD FLAT NO-LEAD CHIP CARRIER WITH STAND-OFF

SEMICONDUCTOR DEVICE AND PACKAGING STRUCTURE THEREFOR

Method for producing a printed circuit board with a heat radiating structure and a printed circuit board with a heat radiating structure

Fly's Eye Lens Short Focal Length Solar Concentrator

Electronic component for an electronic carrier substrate

Surface mount testing system

Circuit module and process for producing the same

Materials for use with interconnects of electrical devices and related methods

Electrocoated contacts compatible with surface mount technology

Process control method, data registration program, and method for manufacturing electronic device

Printed Wiring Board, Printed Circuit Board, and Method of Inspecting Joint of Printed Circuit Board

Printed Board Assembly with Improved Heat Dissipation

Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement

Method of manufacturing and warpage correcting of printed circuit board assembly

Surface mount board-stacking connector

Thermally Conductive Low Profile Bonding Surfaces

Method and apparatus for integrated hierarchical electronics analysis

Non-pull back pad package with an additional solder standoff

Securing object relative to PC board using retention device attached to surface-mounted attachment mechanisms

Method for sealing vias in a substrate

Board connector

Lead plate-attached coin-type battery whose lead plate is attached to exclusively either an outer can or a cap

Circuit module

ELECTRONIC DEVICES WITH ENHANCED HEAT SPREADING

Electrical Circuit Package

Method for preventing solder rise to electric contact and electric contact produced by the same

Clad aluminum connector

Coaxial cable connecting board, converter, and high frequency apparatus

Functional device-mounted module and a method for mounting functional device-mounted module

High density electronic packages

Reliability enhancement process

Circuit board with cooling function

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

SI-SUBSTRATE AND STRUCTURE OF OPTO-ELECTRONIC PACKAGE HAVING THE SAME

Solderable compact camera module and method of manufacture thereof

Magnetic device

Quad flat no-lead chip carrier with stand-off

System and method of attaching an integrated circuit assembly to a printed wiring board

Circuit board with heat radiating sheet

Increased interconnect density electronic package and method of fabrication

Method of manufacturing circuit module, collective board for circuit module, and circuit module manufactured by the method

Semiconductor power module including epoxy resin coating

Multilayer printed wiring board and component mounting method thereof

Solder layer and electronic device bonding substrate and submount using the same

METHOD OF MANUFACTURING CIRCUIT DEVICE

Method of self-assembly on a surface

Printed circuit board apparatus and method for assembly

Circuit device and method of manufacturing the same

Electronic device

Printed board with a pin for mounting a component

Printed wiring board with component mounting pin and electronic device using the same

Low temperature co-fired ceramic module and method of manufacturing the same

Circular electrical connector

Printed circuit board and method of use thereof

Electronic component mounting method, and circuit substrate and circuit substrate unit used in the method

Circuit board and electronic assembly

Method of attaching a high power surface mount transistor to a printed circuit board

Attachment of a QFN to a PCB

Heat sink board and manufacturing method thereof

Cable clamp

Electronic apparatus with wiring plates fixed directly to columns to space wiring circuit from base

Mounting flexible circuits onto integrated circuit substrates

ELECTRICAL CIRCUIT APPARATUS

Printed circuit board with interconnection terminal, a printed circuit assembly and electronic apparatus

Electrical Connector For A Window Pane Of A Vehicle

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Connector and a mounting method therefor

Method for conserving space in a circuit

Package frame and semiconductor package using the same

Method for high-precision fixing of a miniaturized component on a support plate

High frequency electronic component

Electrical circuit apparatus and method for assembling same

Mounting substrate and microphone mounted thereon

Light emitting diode package in backlight unit for liquid crystal display device

Circuit substrate

System and method for venting pressure from an integrated circuit package sealed with a lid

Multi-substrate RF module for wireless communication devices

Surface mount light emitting diode (LED) assembly with improved power dissipation

System for attaching a substantially three-dimensional structure to a substantially two-dimensional structure

Electronic assembly with controlled solder joint thickness

Lead-free semiconductor device

Circuit board device and manufacturing method thereof

Electrical connector with retaining device

Circular electrical connector

Semiconductor device and insulating substrate utilizing a second conductor with a non-joint area

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Integrated circuit package

Semiconductor device package

Structure using soldering and soldering method

Land grid array package

Semiconductor device and manufacturing method thereof

High frequency unit

Surface-mounting type electronic circuit unit without detachment of solder

Semiconductor device with micro connecting elements and method for producing the same

Forming buried via hole substrates

Electronic circuit board

System-in-package wireless communication device comprising prepackaged power amplifier

Semiconductor device and method for producing the same

Method to manufacture a universal footprint for a package with exposed chip

Enhanced reliability semiconductor package

Metal fixing member for fixing a connector to a wiring board

Selective application of conductive material to substrates by pick and place of compliant contact arrays

Method for soldering miniaturized components to a baseplate

Semiconductor device and method of fabricating the same

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Mounting method for surface-mount components on a printed circuit board

Electrical connector for a window pane of a vehicle

Method of manufacturing a resilient contact

Surface mount heat sink

Method of retaining a solder mass on an article

Main board and fixing component thereof

Semiconductor attachment method

Manufacture of RFID tags and intermediate products therefor

Wiring board and magnetic disk apparatus

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Printed circuit board

Circuit board

Battery holder

Forming buried via hole substrates

Structure of terminal member

Mounting element

Plant cultivating method, cultivating device, and its lighting device

Circuit board assembly employing solder vent hole

Structure for fixing an electronic device to a substrate

Method for attaching a shield can to a PCB and a shield can therefor

Solder flow stops for semiconductor die substrates

Power module and electric transportation apparatus incorporating the same

Microelectronic assembly having variable thickness solder joint

Systems and methods for laser soldering flat flexible cable

Circular electrical connector

Selective area solder placement

Land grid array connector with reinforcement stiffener

Resin encapsulated semiconductor device and the production method

Method for attaching shields on substrates

Package with stacked substrates

Circuit board

Circuit board mounting bracket

Control unit with thermal protection and an electrical heating device comprising the control unit

Soldering method of nonaqueous-electrolyte secondary-battery

Semiconductor device with a solder creep-up prevention zone

Method of manufacturing mounting boards

Populated printed wiring board and method of manufacture

System and method for improving solder joint reliability in an integrated circuit package

Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process

Transferable micro spring structure

Electrical circuit apparatus and methods for assembling same

Semiconductor module

Apparatus for immobilizing a solid solder element to a contact surface of interest

Module structure and module comprising it

Method of mounting a circuit component and joint structure therefor

Electrical circuit apparatus and method

Joining material stencil and method of use

Ball grid array package with external leads

Semiconductor device and method of fabricating the same

Camera

Semiconductor device and method for production thereof

Selective application of conductive material to circuit boards by pick and place

Printed circuit board connection for integrated circuits using two routing layers

Printed circuit board connection for integrated circuits using two routing layers

Electrical unit

Fabric with woven wire braid

All-metal side-inserted female connector having guide hole and elastic pieces for guiding wire

PCB with two rows of solder pads including both SMT-based and DIP-based structures

Knit fabric with electrical components

Wire bonded electronic devices to round wire

Electronic devices wire bonded to substrate through an adhesive layer and method of making the same

Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die