ClassID:

233878

H05K3/3447 - page 3 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering Lead-in-hole components

Recent Application in this class:
#601
20050103826
2005-05-19

Via heat sink material

#602
20050103522
2005-05-19

Stair step printed circuit board structures for high speed signal transmissions

#603
20050077610
2005-04-14

Ball grid array package with external leads

#604
20050074243
2005-04-07

Optical module

#605
20050072828
2005-04-07

Jet nozzle structure for soldering apparatus

#606
20050067472
2005-03-31

Method for connecting connection members to board

#607
20050067189
2005-03-31

Soldering method and solder joint member

#608
20050067178
2005-03-31

Electronic assembly with thermally separated support

#609
20050061544
2005-03-24

Circuit board having metallic plate, printed circuit board and flexible circuit board

#610
20050057865
2005-03-17

Shunt connection to a PCB of an energy management system employed in an automotive vehicle

#611
20050048825
2005-03-03

Soldering structure between a tab of a bus bar and a printed substrate

#612
20050048809
2005-03-03

Flexible flat cable termination structure for a clockspring

#613
20050047776
2005-03-03

Camera

#614
20050046288
2005-03-03

Actuator

#615
20050035443
2005-02-17

Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device

#616
20050018390
2005-01-27

Electronic control unit

#617
20050017054
2005-01-27

Flyback transformer wire attach method to printed circuit board

#618
20050013978
2005-01-20

Printed wiring board and electronic apparatus

#619
20050013055
2005-01-20

Method of head stack assembly flexible circuit assembly attached to an actuator arm

#620
20050000730
2005-01-06

Printed wiring board, electronic component mounting method, and electronic apparatus

#621
14589464
2018-07-03

Modular semiconductor package