ClassID:

233882

H05K3/3468 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering; Solder materials or compositions; Methods of application thereof Applying molten solder

Recent Application in this class:
#1
20260052633
2026-02-19

Localized Soldering U&C Shape with Metal Pin Design

#2
20250133664
2025-04-24

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

#3
20250133663
2025-04-24

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE

#4
20250128344
2025-04-24

SOLDERING SYSTEM AND METHOD OF USE

#5
20240373563
2024-11-07

Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole

#6
20240276651
2024-08-15

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

#7
20230164966
2023-05-25

On-demand method of making PCB pallets using additive manufacturing

#8
20230141137
2023-05-11

On-demand method of making PCB pallets using additive manufacturing

#9
20230121381
2023-04-20

Systems and methods for providing an interface on a printed circuit board using pin solder enhancement

#10
20220369473
2022-11-17

Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

#11
20220248540
2022-08-04

High-resolution soldering

#12
20220044988
2022-02-10

Soldering structure with groove portion and power module comprising the same

#13
20210144863
2021-05-13

Method for discharging fluid

#14
20210107080
2021-04-15

Systems and methods for providing an interface on a printed circuit board using pin solder enhancement

#15
20200305283
2020-09-24

Electronic device comprising an electronic component mounted on a support substrate and assembly method

#16
20200180060
2020-06-11

WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING

#17
20200180059
2020-06-11

Wave solder pallets for optimal solder flow and methods of manufacturing

#18
20200170155
2020-05-28

Flux residue detection

#19
20190394914
2019-12-26

On-demand method of making PCB pallets using additive manufacturing

#20
20190381590
2019-12-19

Wave solder nozzle with automated adjustable sliding plate to vary solder wave width

#21
20190335583
2019-10-31

THREE-DIMENSIONAL PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#22
20190174629
2019-06-06

Method for manufacturing a circuit board

#23
20190160570
2019-05-30

Systems and methods for attaching printed circuit board to pallet

#24
20190132960
2019-05-02

Method for correcting solder bump

#25
20190090392
2019-03-21

Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturing

#26
20180376600
2018-12-27

Fluid discharge device

#27
20180160544
2018-06-07

Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method

#28
20180153040
2018-05-31

Joining part and board unit

#29
20180129134
2018-05-10

PRODUCTION PROCESS FOR SOLDER ELECTRODE AND USE THEREOF

#30
20180126475
2018-05-10

Method of manufacturing a wave solder pallet

#31
20180126474
2018-05-10

Soldering apparatus and method for manufacturing electronic unit

#32
20180116080
2018-04-26

Work machine

#33
20180042121
2018-02-08

CIRCUIT BOARD WITH SOLDER THIEVES

#34
20170367195
2017-12-21

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#35
20170347463
2017-11-30

Conductive particle, and connection material, connection structure, and connecting method of circuit member

#36
20170273227
2017-09-21

Electronic component mounting system

#37
20170142845
2017-05-18

Increasing solder hole-fill in a printed circuit board assembly

#38
20170127533
2017-05-04

PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART

#39
20170127531
2017-05-04

LEAD-FREE SOLDER ALLOY

#40
20170072492
2017-03-16

Jet nozzle and jet soldering apparatus

#41
20170066072
2017-03-09

Viscous fluid coating device

#42
20160338209
2016-11-17

Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container

#43
20160324000
2016-11-03

Mounting structure of leaded electronic component which reduces occurrence of blow hole

#44
20160297022
2016-10-13

Increasing solder hole-fill in a printed circuit board assembly

#45
20160297021
2016-10-13

Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable

#46
20160290952
2016-10-06

Method for manufacturing a biological fluid sensor

#47
20160278217
2016-09-22

Electronic component mounting device

#48
20160044795
2016-02-11

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

#49
20160044791
2016-02-11

Increasing solder hole-fill in a printed circuit board assembly

#50
20150367438
2015-12-24

Pre-heater latch and seal mechanism for wave solder machine and related method

#51
20150319851
2015-11-05

Printed circuit board and method of manufacturing the same

#52
20150305216
2015-10-22

Guide vane and jetting apparatus

#53
20150298233
2015-10-22

Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device

#54
20150276275
2015-10-01

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE COMPONENT IN A THERMAL PROCESS

#55
20150273634
2015-10-01

Method and apparatus for improving selective soldering

#56
20150245499
2015-08-27

Pre-heater latch and seal mechanism for wave solder machine and related method

#57
20150223346
2015-08-06

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

#58
20150174678
2015-06-25

Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor

#59
20150082822
2015-03-26

Refrigerating apparatus

#60
20150007958
2015-01-08

Solder bump forming method and apparatus

#61
20140212678
2014-07-31

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

#62
20140183250
2014-07-03

Heat transfer device for wave soldering

#63
20140182909
2014-07-03

Heat transfer device for wave soldering

#64
20140104807
2014-04-17

ESD protection in a very small form factor consumer electronic product

#65
20140096379
2014-04-10

Electronic component mounting method

#66
20140048931
2014-02-20

Solder on trace technology for interconnect attachment

#67
20140041920
2014-02-13

Printed circuit board

#68
20130126590
2013-05-23

Wave soldering of surface-mounting electronic devices on printed circuit board

#69
20130107460
2013-05-02

Protecting a thermal sensitive component in a thermal process

#70
20130083490
2013-04-04

Electronic system for wave soldering

#71
20130004196
2013-01-03

Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method

#72
20130000718
2013-01-03

Electrodes of solar cell formed by active solder and method therefor

#73
20120318852
2012-12-20

METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR

#74
20120286293
2012-11-15

Manufacturing electronic device having contact elements with a specified cross section

#75
20120193400
2012-08-02

Method and soldering system of soldering a DIP component on a circuit board

#76
20120181069
2012-07-19

Printed wiring board, method of soldering quad flat package IC, and air conditioner

#77
20120091188
2012-04-19

SOLDER POT

#78
20120067638
2012-03-22

Electronic apparatus

#79
20120050938
2012-03-01

ESD protection in a very small form factor consumer electronic product

#80
20120024938
2012-02-02

Soldering apparatus

#81
20120006886
2012-01-12

Localized jet soldering device and partial jet soldering method

#82
20110318924
2011-12-29

Method for deposition of at least one electrically conducting film on a substrate

#83
20110303737
2011-12-15

JET SOLDERING DEVICE AND SOLDERING METHOD

#84
20110284619
2011-11-24

Point flow soldering apparatus

#85
20110278348
2011-11-17

Automatic soldering device and carrier device

#86
20110210283
2011-09-01

Low melting temperature alloys with magnetic dispersions

#87
20110201194
2011-08-18

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

#88
20110162204
2011-07-07

INTEGRATED DEVICE

#89
20110094788
2011-04-28

PRINTED CIRCUIT BOARD WITH INSULATING AREAS

#90
20110079633
2011-04-07

Soldering equipment and soldering method for electronic components

#91
20110072655
2011-03-31

METHOD OF SOLDERING AN ELECTRONIC COMPONENT

#92
20110062483
2011-03-17

Light-emitting diode

#93
20110031297
2011-02-10

Flow soldering apparatus and flow soldering method using a water content sensor

#94
20110024177
2011-02-03

METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF

#95
20100300735
2010-12-02

PRINTED CIRCUIT BOARD

#96
20100290203
2010-11-18

Printed circuit board equipped with piezoelectric element

#97
20100276797
2010-11-04

Semiconductor device

#98
20100273022
2010-10-28

Dual additive soldering

#99
20100264197
2010-10-21

Soldering apparatus and method

#100
20100236823
2010-09-23

RING OF POWER VIA

#101
20100193233
2010-08-05

Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner

#102
20100110650
2010-05-06

Soldering Strategies for Printed Circuit Board Assemblies

#103
20100059575
2010-03-11

Device and method for selective soldering

#104
20100046185
2010-02-25

Printed circuit board

#105
20100038824
2010-02-18

CIRCUIT BOARD CARRIER/SOLDER PALLET

#106
20100001291
2010-01-07

Electronic device having contact elements with a specified cross section and manufacturing thereof

#107
20100001047
2010-01-07

Wave soldering tank

#108
20100001039
2010-01-07

Selective soldering system

#109
20090289102
2009-11-26

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

#110
20090260854
2009-10-22

ELECTRONIC CIRCUIT BOARD

#111
20090212094
2009-08-27

Wave Soldering Bath

#112
20090179067
2009-07-16

Selective soldering system

#113
20090166398
2009-07-02

Soldering apparatus and soldering method

#114
20090160424
2009-06-25

High-voltage power supply device and image forming apparatus having same

#115
20090145644
2009-06-11

Printed wiring board, air conditioner, and method of soldering printed wiring board

#116
20090127321
2009-05-21

Electronic assembly remanufacturing system and method

#117
20090101397
2009-04-23

PRINTED CIRCUIT BOARD HAVING IMPROVED SOLDER PAD LAYOUT

#118
20090065043
2009-03-12

METHOD OF COUPLING PHOTOVOLTAIC CELLS AND FILM FOR IMPLEMENTING IT

#119
20090008434
2009-01-08

Lead-free solder alloy

#120
20080307643
2008-12-18

Method of assembly to achieve thermal bondline with minimal lead bending

#121
20080296348
2008-12-04

Heater for select solder machine

#122
20080241359
2008-10-02

Method of making circuitized substrate with selected conductors having solder thereon

#123
20080223611
2008-09-18

PRINTED WIRING BOARD AND ELECTRIC APPARATUS

#124
20080169121
2008-07-17

Printed wiring board unit for method of detecting rising level of electrically-conductive body in bore

#125
20080142568
2008-06-19

CIRCUIT CARRIER BOARD/SOLDER PALLETT

#126
20080142124
2008-06-19

Solder alloy, electronic board using the solder alloy, and method of manufacturing the electronic board

#127
20080130242
2008-06-05

Using the wave soldering process to attach motherboard chipset heat sinks

#128
20080064232
2008-03-13

INTEGRATED DEVICE

#129
20080057691
2008-03-06

Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum

#130
20080055869
2008-03-06

CIRCUIT BOARD CARRIER

#131
20080029849
2008-02-07

Method for placing material onto a target board by means of a transfer board

#132
20080023840
2008-01-31

Via heat sink material

#133
20070257355
2007-11-08

Soldering structure of through hole

#134
20070228529
2007-10-04

Mounting substrate and manufacturing method thereof

#135
20070228103
2007-10-04

Solder spray jig

#136
20070224856
2007-09-27

Positioning method and board

#137
20070181640
2007-08-09

LEAD-FREE SOLDER REWORKING SYSTEM AND METHOD THEREOF

#138
20070181634
2007-08-09

WAVE SOLDER APPARATUS

#139
20070175659
2007-08-02

Printed circuit board

#140
20070107214
2007-05-17

Soldering method

#141
20070102490
2007-05-10

CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT USING THE SAME CIRCUIT BOARD

#142
20070095879
2007-05-03

Methods and apparatus for assembling a printed circuit board

#143
20070068999
2007-03-29

Method for inspecting manually inserted components

#144
20070063400
2007-03-22

Metal jet apparatus and jet method

#145
20070051778
2007-03-08

Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner

#146
20070051777
2007-03-08

SOLDERING METHOD

#147
20070034403
2007-02-15

Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner

#148
20070029108
2007-02-08

Printed circuit board and soldering method and apparatus

#149
20070019060
2007-01-25

Substrate sheet, manufacturing method of circuit substrate, and ink jet head

#150
20070017699
2007-01-25

Circuit board

#151
20070000690
2007-01-04

Printed circuit board assembly and method for preventing EMI of crystal oscillator thereof

#152
20060239855
2006-10-26

Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure

#153
20060226201
2006-10-12

Circuit board carrier/solder pallet

#154
20060226199
2006-10-12

Selective soldering of flat flexible cable with lead-free solder to a substrate

#155
20060191976
2006-08-31

Flow soldering apparatus

#156
20060188702
2006-08-24

Electronic apparatus including printed circuit board

#157
20060186183
2006-08-24

Wave solder nozzle

#158
20060141864
2006-06-29

Flexible circuit sheet, continuous tape, and ink jet head

#159
20060124927
2006-06-15

Forming of high aspect ratio conductive structure using injection molded solder

#160
20060118604
2006-06-08

Solder interconnect structure and method using injection molded solder

#161
20060104855
2006-05-18

Lead-free solder alloy

#162
20060102700
2006-05-18

Printed circuit board having improved solder pad layout

#163
20060086718
2006-04-27

Soldering method and device

#164
20060054668
2006-03-16

Dual additive soldering

#165
20060054347
2006-03-16

Electric conductors

#166
20060050484
2006-03-09

Using the wave soldering process to attach motherboard chipset heat sinks

#167
20060040517
2006-02-23

Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method

#168
20060035454
2006-02-16

Fluxless solder transfer and reflow process

#169
20060015271
2006-01-19

Revenue meter bayonet assembly and method of attachment

#170
20060011709
2006-01-19

Method of replenishing an oxidation suppressing element in a solder bath

#171
20060005996
2006-01-12

Method of attaching electronic components to printed circuit board and attachment structure thereof

#172
20050284656
2005-12-29

Method for manufacturing printed circuit board and printed circuit board with gas venting hole

#173
20050236718
2005-10-27

Printed circuit board with soldering lands

#174
20050224932
2005-10-13

Electrically conductive wire

#175
20050103826
2005-05-19

Via heat sink material

#176
20050072828
2005-04-07

Jet nozzle structure for soldering apparatus

#177
20050067189
2005-03-31

Soldering method and solder joint member

#178
20050061850
2005-03-24

Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components

#179
20050045370
2005-03-03

Printed board and method of displaying an identification mark on the same

#180
20050000730
2005-01-06

Printed wiring board, electronic component mounting method, and electronic apparatus

#181
18982333
2026-02-03

Dual pump system and method to control wavesolder contact length

#182
14565295
2015-10-06

Thermal carrier