233882 ⎘
Apparatus or processes for manufacturing printed circuits; Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering; Solder materials or compositions; Methods of application thereof Applying molten solder
Localized Soldering U&C Shape with Metal Pin Design
#2SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE
#3SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERING MACHINE
#4SOLDERING SYSTEM AND METHOD OF USE
#5Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole
#6CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
#7On-demand method of making PCB pallets using additive manufacturing
#8On-demand method of making PCB pallets using additive manufacturing
#9Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
#10Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
#11High-resolution soldering
#12Soldering structure with groove portion and power module comprising the same
#13Method for discharging fluid
#14Systems and methods for providing an interface on a printed circuit board using pin solder enhancement
#15Electronic device comprising an electronic component mounted on a support substrate and assembly method
#16WAVE SOLDER PALLETS FOR OPTIMAL SOLDER FLOW AND METHODS OF MANUFACTURING
#17Wave solder pallets for optimal solder flow and methods of manufacturing
#18Flux residue detection
#19On-demand method of making PCB pallets using additive manufacturing
#20Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
#21THREE-DIMENSIONAL PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#22Method for manufacturing a circuit board
#23Systems and methods for attaching printed circuit board to pallet
#24Method for correcting solder bump
#25Reducing displacement of selected components during printed circuit board assembly (PCBA) manufacturing
#26Fluid discharge device
#27Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method
#28Joining part and board unit
#29PRODUCTION PROCESS FOR SOLDER ELECTRODE AND USE THEREOF
#30Method of manufacturing a wave solder pallet
#31Soldering apparatus and method for manufacturing electronic unit
#32Work machine
#33CIRCUIT BOARD WITH SOLDER THIEVES
#34PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#35Conductive particle, and connection material, connection structure, and connecting method of circuit member
#36Electronic component mounting system
#37Increasing solder hole-fill in a printed circuit board assembly
#38PRODUCTION PROCESS FOR SOLDER ELECTRODE, PRODUCTION PROCESS FOR LAMINATE, LAMINATE AND ELECTRONIC PART
#39LEAD-FREE SOLDER ALLOY
#40Jet nozzle and jet soldering apparatus
#41Viscous fluid coating device
#42Solder supply device including a nozzle with a piston and a demarcating member that demarcates an air chamber in which air is supplied to move the piston relative to a solder container
#43Mounting structure of leaded electronic component which reduces occurrence of blow hole
#44Increasing solder hole-fill in a printed circuit board assembly
#45Solder supply device including a solder cup and a nozzle section with a flange section that is elastically deformable
#46Method for manufacturing a biological fluid sensor
#47Electronic component mounting device
#48Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
#49Increasing solder hole-fill in a printed circuit board assembly
#50Pre-heater latch and seal mechanism for wave solder machine and related method
#51Printed circuit board and method of manufacturing the same
#52Guide vane and jetting apparatus
#53Method and soldering device for selective soldering with at least one solder nozzle and another functional element which are moved synchronously by a movement device
#54METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE COMPONENT IN A THERMAL PROCESS
#55Method and apparatus for improving selective soldering
#56Pre-heater latch and seal mechanism for wave solder machine and related method
#57Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
#58Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor
#59Refrigerating apparatus
#60Solder bump forming method and apparatus
#61Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
#62Heat transfer device for wave soldering
#63Heat transfer device for wave soldering
#64ESD protection in a very small form factor consumer electronic product
#65Electronic component mounting method
#66Solder on trace technology for interconnect attachment
#67Printed circuit board
#68Wave soldering of surface-mounting electronic devices on printed circuit board
#69Protecting a thermal sensitive component in a thermal process
#70Electronic system for wave soldering
#71Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method
#72Electrodes of solar cell formed by active solder and method therefor
#73METHOD OF PREVENTING EMI FOR A FASTENING HOLE IN A CIRCUIT BOARD AND A FIXTURE THEREFOR
#74Manufacturing electronic device having contact elements with a specified cross section
#75Method and soldering system of soldering a DIP component on a circuit board
#76Printed wiring board, method of soldering quad flat package IC, and air conditioner
#77SOLDER POT
#78Electronic apparatus
#79ESD protection in a very small form factor consumer electronic product
#80Soldering apparatus
#81Localized jet soldering device and partial jet soldering method
#82Method for deposition of at least one electrically conducting film on a substrate
#83JET SOLDERING DEVICE AND SOLDERING METHOD
#84Point flow soldering apparatus
#85Automatic soldering device and carrier device
#86Low melting temperature alloys with magnetic dispersions
#87Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates
#88INTEGRATED DEVICE
#89PRINTED CIRCUIT BOARD WITH INSULATING AREAS
#90Soldering equipment and soldering method for electronic components
#91METHOD OF SOLDERING AN ELECTRONIC COMPONENT
#92Light-emitting diode
#93Flow soldering apparatus and flow soldering method using a water content sensor
#94METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF
#95PRINTED CIRCUIT BOARD
#96Printed circuit board equipped with piezoelectric element
#97Semiconductor device
#98Dual additive soldering
#99Soldering apparatus and method
#100RING OF POWER VIA
#101Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, printed circuit board and air-conditioner
#102Soldering Strategies for Printed Circuit Board Assemblies
#103Device and method for selective soldering
#104Printed circuit board
#105CIRCUIT BOARD CARRIER/SOLDER PALLET
#106Electronic device having contact elements with a specified cross section and manufacturing thereof
#107Wave soldering tank
#108Selective soldering system
#109Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath
#110ELECTRONIC CIRCUIT BOARD
#111Wave Soldering Bath
#112Selective soldering system
#113Soldering apparatus and soldering method
#114High-voltage power supply device and image forming apparatus having same
#115Printed wiring board, air conditioner, and method of soldering printed wiring board
#116Electronic assembly remanufacturing system and method
#117PRINTED CIRCUIT BOARD HAVING IMPROVED SOLDER PAD LAYOUT
#118METHOD OF COUPLING PHOTOVOLTAIC CELLS AND FILM FOR IMPLEMENTING IT
#119Lead-free solder alloy
#120Method of assembly to achieve thermal bondline with minimal lead bending
#121Heater for select solder machine
#122Method of making circuitized substrate with selected conductors having solder thereon
#123PRINTED WIRING BOARD AND ELECTRIC APPARATUS
#124Printed wiring board unit for method of detecting rising level of electrically-conductive body in bore
#125CIRCUIT CARRIER BOARD/SOLDER PALLETT
#126Solder alloy, electronic board using the solder alloy, and method of manufacturing the electronic board
#127Using the wave soldering process to attach motherboard chipset heat sinks
#128INTEGRATED DEVICE
#129Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum
#130CIRCUIT BOARD CARRIER
#131Method for placing material onto a target board by means of a transfer board
#132Via heat sink material
#133Soldering structure of through hole
#134Mounting substrate and manufacturing method thereof
#135Solder spray jig
#136Positioning method and board
#137LEAD-FREE SOLDER REWORKING SYSTEM AND METHOD THEREOF
#138WAVE SOLDER APPARATUS
#139Printed circuit board
#140Soldering method
#141CIRCUIT BOARD,METHOD OF MOUNTING SURFACE MOUNTING COMPONENT ON CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT USING THE SAME CIRCUIT BOARD
#142Methods and apparatus for assembling a printed circuit board
#143Method for inspecting manually inserted components
#144Metal jet apparatus and jet method
#145Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner
#146SOLDERING METHOD
#147Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner
#148Printed circuit board and soldering method and apparatus
#149Substrate sheet, manufacturing method of circuit substrate, and ink jet head
#150Circuit board
#151Printed circuit board assembly and method for preventing EMI of crystal oscillator thereof
#152Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure
#153Circuit board carrier/solder pallet
#154Selective soldering of flat flexible cable with lead-free solder to a substrate
#155Flow soldering apparatus
#156Electronic apparatus including printed circuit board
#157Wave solder nozzle
#158Flexible circuit sheet, continuous tape, and ink jet head
#159Forming of high aspect ratio conductive structure using injection molded solder
#160Solder interconnect structure and method using injection molded solder
#161Lead-free solder alloy
#162Printed circuit board having improved solder pad layout
#163Soldering method and device
#164Dual additive soldering
#165Electric conductors
#166Using the wave soldering process to attach motherboard chipset heat sinks
#167Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method
#168Fluxless solder transfer and reflow process
#169Revenue meter bayonet assembly and method of attachment
#170Method of replenishing an oxidation suppressing element in a solder bath
#171Method of attaching electronic components to printed circuit board and attachment structure thereof
#172Method for manufacturing printed circuit board and printed circuit board with gas venting hole
#173Printed circuit board with soldering lands
#174Electrically conductive wire
#175Via heat sink material
#176Jet nozzle structure for soldering apparatus
#177Soldering method and solder joint member
#178Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
#179Printed board and method of displaying an identification mark on the same
#180Printed wiring board, electronic component mounting method, and electronic apparatus
#181Dual pump system and method to control wavesolder contact length
#182Thermal carrier