H05K3/445 - CPC Classification Index

#1

20240404934

2024-12-05

THROUGH-HOLE ELECTRODE SUBSTRATE

#2

20240276650

2024-08-15

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#3

20240276632

2024-08-15

Interconnect Circuit Methods And Devices

#4

20230008736

2023-01-12

Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board

#5

20220408563

2022-12-22

Circuit board and manufacturing method thereof

#6

20220246512

2022-08-04

Through-hole electrode substrate

#7

20220201871

2022-06-23

Wiring circuit board

#8

20210352798

2021-11-11

Methods of forming interconnect circuits

#9

20200357733

2020-11-12

Through-hole electrode substrate

#10

20200315032

2020-10-01

Multilayer board and manufacturing method of the same

#11

20200152564

2020-05-14

Through-hole electrode substrate

#12

20190394886

2019-12-26

Multilayer wiring board

#13

20190350076

2019-11-14

Substrate, imaging unit and imaging device

#14

20190254164

2019-08-15

CIRCUIT BOARD, METHOD OF MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE

#15

20190172780

2019-06-06

Through-hole electrode substrate

#16

20190110364

2019-04-11

Multilayer laminate and method for producing multilayer printed wiring board using same

#17

20190053380

2019-02-14

Intermediate printed board for making multiple printed circuit boards and method of manufacturing the same

#18

20180352650

2018-12-06

Assembly and lighting device comprising the assembly

#19

20180310401

2018-10-25

Printed wiring board and camera module

#20

20180277471

2018-09-27

Through-hole electrode substrate

#21

20180146550

2018-05-24

Printed Circuit Board and Method Manufacturing the Same

#22

20180145004

2018-05-24

Wiring board, and manufacturing method

#23

20170374735

2017-12-28

Substrate, imaging unit and imaging device

#24

20170223842

2017-08-03

Multilayer wiring board

#25

20170025218

2017-01-26

Module substrate

#26

20160329273

2016-11-10

Through-hole electrode substrate

#27

20160276257

2016-09-22

Through-hole electrode substrate and semiconductor device using through-hole electrode substrate

#28

20160143129

2016-05-19

Circuit board

#29

20160037653

2016-02-04

Insulating film, printed circuit board using the same, and method of manufacturing the printed circuit board

#30

20160037623

2016-02-04

Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture

#31

20160007451

2016-01-07

Circuit substrate and method for manufacturing the same

#32

20150181698

2015-06-25

Substrate, imaging unit and imaging device

#33

20150181690

2015-06-25

Heat dissipation printed circuit board and manufacturing method thereof

#34

20150118391

2015-04-30

THERMAL MANAGEMENT CIRCUIT MATERIALS, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM

#35

20150107888

2015-04-23

Interconnection substrate

#36

20150083472

2015-03-26

Method for producing a metal core substrate having improved edge insulating properties

#37

20150076107

2015-03-19

Method for manufacturing multilayer wiring board

#38

20150041053

2015-02-12

Method of manufacturing wiring substrate

#39

20150010694

2015-01-08

Method of manufacturing substrate having cavity

#40

20140318834

2014-10-30

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#41

20140138132

2014-05-22

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

#42

20140102770

2014-04-17

Core substrate, manufacturing method thereof, and structure for metal via

#43

20140096380

2014-04-10

Method of manufacturing a hybrid heat-radiating substrate

#44

20140020951

2014-01-23

Method of fabricating high-density hermetic electrical feedthroughs

#45

20130328214

2013-12-12

Through-hole electrode substrate

#46

20130319734

2013-12-05

PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#47

20130240259

2013-09-19

Method of manufacturing a wiring board having via structures

#48

20130228360

2013-09-05

Printed circuit board and method of manufacturing the same

#49

20130206460

2013-08-15

CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND MANUFACTURING METHOD THEREOF

#50

20130098669

2013-04-25

Wiring substrate and manufacturing method for wiring substrate

#51

20130081870

2013-04-04

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

#52

20130048346

2013-02-28

Wiring board having an engineered metallization layer

#53

20120329276

2012-12-27

Method for manufacturing a through hole electrode substrate

#54

20120273963

2012-11-01

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

#55

20120273116

2012-11-01

HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#56

20120268896

2012-10-25

Metal core printed circuit board and electronic package structure

#57

20120247818

2012-10-04

PRINTED WIRING BOARD

#58

20120246924

2012-10-04

Method for manufacturing multilayer printed wiring board

#59

20120220123

2012-08-30

Through-hole electrode substrate and method of manufacturing the same

#60

20120211270

2012-08-23

METHOD OF MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

#61

20120211266

2012-08-23

Wiring board and manufacturing method thereof

#62

20120199386

2012-08-09

MULTILAYER PRINTED WIRING BOARD

#63

20120181066

2012-07-19

PACKAGE CARRIER

#64

20120160549

2012-06-28

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

#65

20120112238

2012-05-10

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

#66

20120111726

2012-05-10

Sensor Element Having Through-Hole Plating

#67

20120106084

2012-05-03

Heat pipe and circuit board with a heat pipe function

#68

20120098137

2012-04-26

Element mounting substrate and semiconductor module

#69

20120097431

2012-04-26

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

#70

20120092816

2012-04-19

Electronic device having a hidden input key and method of manufacturing an electronic device

#71

20120073863

2012-03-29

ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#72

20120031655

2012-02-09

Multi-layer circuit assembly and process for preparing the same

#73

20120012247

2012-01-19

Method of manufacturing and insulating sheet

#74

20120001544

2012-01-05

LIGHT EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME

#75

20110303440

2011-12-15

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#76

20110290408

2011-12-01

Method of manufacturing printed wiring board

#77

20110274877

2011-11-10

METHOD FOR MANUFACTURING METAL BASE LAMINATE

#78

20110266156

2011-11-03

Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials

#79

20110261557

2011-10-27

Metal core circuit board with conductive pins

#80

20110240346

2011-10-06

Heat-radiating substrate and manufacturing method thereof

#81

20110203839

2011-08-25

Wiring substrate and method for manufacturing the same

#82

20110173809

2011-07-21

Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

#83

20110164391

2011-07-07

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

#84

20110163343

2011-07-07

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

#85

20110156090

2011-06-30

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

#86

20110151626

2011-06-23

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

#87

20110131807

2011-06-09

Process for forming an isolated electrically conductive contact through a metal package

#88

20110104856

2011-05-05

Method of making a semiconductor chip assembly with a post/base/post heat spreader

#89

20110101410

2011-05-05

Semiconductor chip assembly with post/base/post heat spreader

#90

20110088928

2011-04-21

HEAT DISSIPATING SUBSTRATE

#91

20110080718

2011-04-07

Interconnect board, printed circuit board unit, and method

#92

20110080717

2011-04-07

INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD

#93

20110062594

2011-03-17

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

#94

20110056740

2011-03-10

Method of manufacturing a through-hole electrode substrate

#95

20110048788

2011-03-03

Method for forming a via in a substrate and substrate with a via

#96

20110042130

2011-02-24

Multilayered wiring substrate and manufacturing method thereof

#97

20100319969

2010-12-23

Lightweight circuit board with conductive constraining cores

#98

20100300736

2010-12-02

Composite multi-layer substrate and module using the substrate

#99

20100294543

2010-11-25

HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#100

20100246140

2010-09-30

Circuit board and method for manufacturing semiconductor modules and circuit boards

#101

20100164120

2010-07-01

Through-hole electrode substrate and method of manufacturing the same

#102

20100139088

2010-06-10

Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device

#103

20100122843

2010-05-20

Circuit board and method of manufacturing the same

#104

20100116782

2010-05-13

Method for manufacturing multilayer wiring board

#105

20100110649

2010-05-06

Suspension board with circuit

#106

20100110590

2010-05-06

Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted

#107

20100012357

2010-01-21

Printed circuit board with improved via design

#108

20100006330

2010-01-14

STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE

#109

20090314650

2009-12-24

PROCESS OF PACKAGE SUBSTRATE

#110

20090308651

2009-12-17

Wiring substrate including conductive core substrate, and manufacturing method thereof

#111

20090294166

2009-12-03

Printed wiring board

#112

20090294161

2009-12-03

Core substrate and printed wiring board

#113

20090288293

2009-11-26

Metal core package substrate and method for manufacturing the same

#114

20090242248

2009-10-01

Insulating sheet and printed circuit board having the same

#115

20090236130

2009-09-24

Multilayered printed circuit board and method of manufacturing the same

#116

20090205852

2009-08-20

Circuit board and manufacturing method thereof

#117

20090197369

2009-08-06

Multilayer substrate manufacturing method

#118

20090178838

2009-07-16

Process of fabricating a circuit board

#119

20090115045

2009-05-07

Stacked package module and method for fabricating the same

#120

20090113705

2009-05-07

Method of making a wiring board having an engineered metallization layer

#121

20090107702

2009-04-30

Printed interconnection board having a core including carbon fiber reinforced plastic

#122

20090095521

2009-04-16

Circuit board and method of manufacturing the same

#123

20090095520

2009-04-16

Wiring substrate and method of manufacturing the same

#124

20090090465

2009-04-09

PRINTED WIRING BOARD WITH CONDUCTIVE CONSTRAINING CORE INCLUDING RESIN FILLED CHANNELS

#125

20090084596

2009-04-02

Multi-layer board incorporating electronic component and method for producing the same

#126

20090049686

2009-02-26

Method of manufacturing component-embedded printed circuit board

#127

20090001558

2009-01-01

Lamp seat for a light emitting diode and capable of heat dissipation, and method of manufacturing the same

#128

20090001400

2009-01-01

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

#129

20080305626

2008-12-11

Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials

#130

20080289178

2008-11-27

Process for forming an isolated electrically conductive contact through a metal package

#131

20080254207

2008-10-16

Electrically conductive substrate with high heat conductivity

#132

20080241997

2008-10-02

Interposer and method for producing the same and electronic device

#133

20080218010

2008-09-11

Motor

#134

20080185704

2008-08-07

Carrier plate structure havign a chip embedded therein and the manufacturing method of the same

#135

20080151518

2008-06-26

Circuit board structure with embedded electronic components

#136

20080118706

2008-05-22

Substrate

#137

20080105457

2008-05-08

Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof

#138

20080083558

2008-04-10

Multilayer wiring board

#139

20080026602

2008-01-31

Printed Circuit Board With Improved Via Design

#140

20080022523

2008-01-31

Method of forming a printed circuit board with improved via design

#141

20080022520

2008-01-31

Method of making multilayered circuitized substrate assembly

#142

20080008904

2008-01-10

HIGHLY HEAT-TRANSFERRING SUBSTRATE

#143

20080006928

2008-01-10

Composite multi-layer substrate and module using the substrate

#144

20070290327

2007-12-20

Circuit board and method for manufacturing semiconductor modules and circuit boards

#145

20070266555

2007-11-22

Apparatus for making circuitized substrates in a continuous manner

#146

20070240901

2007-10-18

Wiring board and method for fabricating the same

#147

20070226998

2007-10-04

Multi-layer circuit assembly and process for preparing the same

#148

20070199195

2007-08-30

Method for making a multilayered circuitized substrate

#149

20070159833

2007-07-12

LED pool and spa light

#150

20070108591

2007-05-17

Interposer and method for producing the same and electronic device

#151

20070080360

2007-04-12

Microelectronic interconnect substrate and packaging techniques

#152

20070067064

2007-03-22

Surface level control systems and material recycling systems for use with programmable material consolidation apparatus

#153

20070044999

2007-03-01

Circuit board and circuit apparatus using the same

#154

20070023889

2007-02-01

Copper substrate with feedthroughs and interconnection circuits

#155

20070023202

2007-02-01

Circuit board and circuit apparatus using the same

#156

20070010086

2007-01-11

Circuit board with a through hole wire and manufacturing method thereof

#157

20070009718

2007-01-11

Layered board and electronic apparatus having the layered board

#158

20070007032

2007-01-11

Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

#159

20070006452

2007-01-11

Method of making mutilayered circuitized substrate assembly having sintered paste connections

#160

20060255456

2006-11-16

Multilayer substrate and the manufacturing method thereof

#161

20060255440

2006-11-16

Composite multi-layer substrate and module using the substrate

#162

20060240641

2006-10-26

Apparatus and method for making circuitized substrates in a continuous manner

#163

20060240364

2006-10-26

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

#164

20060213685

2006-09-28

Single or multi-layer printed circuit board with improved edge via design

#165

20060175084

2006-08-10

Wiring board and method for fabricating the same

#166

20060163596

2006-07-27

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

#167

20060152329

2006-07-13

Conductive polymer device and method of manufacturing same

#168

20060141211

2006-06-29

Highly heat-transferring substrate and process of manufacturing the same

#169

20060099728

2006-05-11

Method of manufacturing a substrate structure for increasing cutting precision and strength thereof

#170

20060065439

2006-03-30

Wiring board and wiring board manufacturing method

#171

20060035407

2006-02-16

Semiconductor substrate structure and processing method thereof

#172

20060035406

2006-02-16

METHOD OF FORMING A COMPOSITE POLYMER MATERIAL INSIDE TRENCHES OF A SEMICONDUCTOR SUBSTRATE TO FORM A COMPOSITE POLYMER STRUCTURE

#173

20060006503

2006-01-12

Insulative coatings for apertures of semiconductor device components and semiconductor device components including insulative coatings

#174

20060005383

2006-01-12

Method of forming printed circuit card

#175

20050282383

2005-12-22

Systems for forming insulative coatings for via holes in semiconductor devices

#176

20050257957

2005-11-24

Printed wiring board with conductive constraining core including resin filled channels

#177

20050194174

2005-09-08

Electrical feedthrough assembly for a sealed housing

#178

20050155789

2005-07-21

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

#179

20050124196

2005-06-09

Single or multi-layer printed circuit board with improved via design

#180

20050056913

2005-03-17

Stereolithographic method for forming insulative coatings for via holes in semiconductor devices

#181

20050048408

2005-03-03

Composite laminate circuit structure

#182

20050040513

2005-02-24

Interconnection circuit and electronic module utilizing same

#183

20050019541

2005-01-27

Lightweight circuit board with conductive constraining cores

#184

20050019535

2005-01-27

Lightweight circuit board with conductive constraining cores

#185

15698430

2019-01-15

Landless via concept

#186

14476549

2017-05-23

Embedded coins for HDI or SEQ laminations